臺灣博碩士論文加值系統

在本文中分實驗與模擬兩方面進行討論，實驗方面的利用疊紋干涉術（Moiré Interferometry）所具備的高靈敏、全場量測平面位移的特性，配合上有限元素法軟體ANSYS ，對消費性電子產品最常使用到的封裝結構形式PBGA結構做溫度與機械負荷的影響。結果顯示原先只有溫度差時，封裝結構在銲錫(Solder Ball)接點產生最大應變量是在於晶片(Chip)下方附近，外加機械負荷之後最大的應變量卻發生在外側的錫球。

最後分別就熱負荷與機械負荷對封裝結構的影響提出看法，提供作為設計人員研究依據。

In this thesis the experiment of the cent and the both side of the Finite Element Method carry ons the discussion, in the experiment use Moiré Interferometry that have high sensitivity and Full-field characteristic, match with the Finite Element Method the software the ANSYS. To do the influence about temperature and mechanical loading in the PBGA package. Show consequently that at first only have the temperature, the Package have maximum strain at contact of the Solder Ball under nearby chip, After addition mechanical loading the maximum strain to take places in outward ball of the Solder ball.

Finally, thes thesis offers a suggestion for the influence of thermal and mechanical loading strain to the electronic package. Through this suggestion, we provide a reliable analysis for designers.

摘要……………………………………………...…………………………..Ⅰ
英文摘要………………………………………..…………………………...Ⅱ
誌謝………………………………………………………………………….Ⅲ
目錄………………………………………….………………………………Ⅳ
表目錄………………………………………………………………………Ⅵ
圖目錄…………………………………………………….…………………Ⅶ
符號說明……………………………………………………………….……Ⅸ

第一章 緒論………………………………………………...………………1
1-1 前言……………………………………………...……………………1
1-2 文獻回顧…………………………………………………...…………2
1-3 研究動機………………………………………………………...……4
1-4 本文架構……………………………………………………………...5
第二章 疊紋干涉術實驗過程……………………………………………..6
2-1 實驗步驟……………………………………………………………...6
2-2 實驗試片……………………………………………………………...10
2-3 構裝材料……………………………………………………………...11
2-4 實驗數據算…………………………………………………………...13
2-5 實驗注意事項………………………………………………………...14
第三章 數值模型………………………………………………………..…16
3-1 數值模型尺寸………………………………………………………...16
3-2 電腦模擬步驟與流程………………………………………………16
第四章 結果討論…………………………………………………………..19
4-1 實驗結果分析………………………………………………………...19
4-1-1 疊紋干涉實驗部分……………………………………………19
4-1-2 數值模擬部分與比較………………………………………24
4-2 實驗數據誤差分析…………………………………………………...27
第五章 結論與建議………………………………………………………..30
5-1 結論……………………………………………………………….…..30
5-2 未來研究方向與建議………………………………………………...31
參考文獻…………………………………………………………………..33
附錄A 干涉方程式之推導……………………………………………….64
附錄B 實驗儀器及設備………………………………………………….70

[1] J.Guild, ”The Interference System of Crossed Diffraction Grating: Theory of Moiré Fringes, ” Oxford, Clarendon Press, 1956.
[2] L. Raleigh, “ On the Manufacture and Theory of Diffraction Gratings, ” Phil. Mag. Series 4, pp.81-93, 1874.
[3] A. F. Bastawros and A. S. Voloshin, “ Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moiré Interferometry, ” ASME J. Electron. Packag., vol. 112, pp. 303–308, 1990.
[4] B. T. Han, Y. Guo, and C. K. Lim, “ Applications of Moiré and Microscopic Moiré Interferometry to Electronic Packaging Product Development, ” in Proc. 4th Annu. IEEE Dual-Use Technol. Appl. Conf., Rome,NY, May 1994.
[5] Y. Guo and C. G. Woychik, “ Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moiré Interferometry, ” ASME J. Electron. Packag., vol. 114, pp. 88–92, 1992.
[6] B. T. Han, “ Higher Sensitivity Moiré Interferometry for Micro- mechanics Studies, ” Opt. Eng., vol. 31, no. 7, pp. 1517–1526, 1992.
[7] Y. Guo, C. K. Lim, W. T. Chen, and C. G.Woychik, “ Solder Ball Connect (SBC) Assemblies under Thermal Loading: I. Deformation Measurement Via Moiré Interferometry and its Interpretation, ” IBM J. Res. Develop, vol. 37, no. 5, pp. 635–648, 1993.
[8] H. C. Choi, Y. Guo,W. LaFontaine, and C. K. Lim, “ Solder Ball Connect (SBC) Assemblies under Thermal Loading: II. Strain Analysis Via Image Processing and Reliability Considerations, ” IBM J. Res. Develop, vol. 37, no. 5, pp. 649–660, 1993.
[9] I. Ejim, J. P. Cleth, T. D. Dudder, Y. Guo and B.Han, “ Measurement of Them mechanical Deformations in Plastic Ball Grid Array Electronic Assemblies Using Moiré Interferometry, ” Prodeedings of 1995 SEM Spring Conference on Experimental Mechanics, 1995.
[10] H. Juso, Y. Yamaji, T. Kimura, K. Fujita, and M. Kada, “ Board Level Reliability of CSP, ” in Proc. 48th Electron. Comp. Technol. Conf., pp. 525–531, 1998.
[11] J. Wang, M. Lu, D. Zou, and S. Liu, “ Investigation of Interfacial Fracture Behavior of a Flip-Chip Package under a Constant Concentrated Load, ” IEEE Trans. Adv. Packag., vol. 21, pp. 79–86, Feb. 1998.
[12] A. Eugene, R. Nancy, and F. Andrew, “ Mechanical Characterization of Plastic Ball Grid Array Package Flexure Using Moiré Interferometry, ” IEEE Trans. Adv. Packag., Vol. 23, No.4, pp. 637-645, Nov. 2000.
[13] Y. Zhao, C. Basaran, A. Cartwright, and T. Dishongh, “ Thermo- mechanical Behavior of BGA Solder Joints Under Vibration, ” IEEE Trans. Adv. Thermal., pp. 174-180, Nov. 2000.
[14] B. Han and Y. Guo, “ Thermal Deformation Analysis of Various Electronic Package Products by Moiré and Microscopic Moiré Interferometry, ” Jounal of Electronic Packaging, pp.185-191, Sep. 1995.
[15] 顏群哲, “ 電子構裝熱應變之光學量測, ” 國立成功大學工程科學研究所碩士論文, 1996.
[16] F. Dai, J. Mckelvie and D. Post, “ An Interpretation of Moiré Interferometry from Wavefront Interference Theory, ” Optics and Lasers in Engineering, Vol. 12, No.2, pp. 101-118, 1990.
[17] M. Amagai and M. Nakao, “ Ball Grid Array (BGA) Packages with the Copper Core Solder Balls, ” IEEE Elec. Comp. Tech. Conf., pp.691-701, 1998.
[18] D. Post and T. F. Maclaughlin, “ Strain Analysis by Moiré Fringe Multiplication, ” Exp. Mechanics, Vol. 11, No.9, pp. 408-413, 1971.
[19] T. I. Ejim, J. P. Cleth, T. D. Dudder, Y. Guo and B. Han, “ Measurement of Themomechanical Deformations in Plastic Ball Grid Array Electronic Assemblies Using Moiré Interfermoetry ” Proceedings of 1995 SEM Spring Conference on Experimental Mechanics, Grand Rapid, Mi, June, 1995.
[20] 姜亦震, “ 電子構裝應變之量測, ” 國立成功大學工程科學研究所論文, 1997.
[21] 吳浚銘, “ Super BGA 熱應變之疊紋量測干涉量測, ” 國立成功大學工程科學系碩士論文, 2000.
[22] 曾國洲, “ 高解析度疊紋干涉術之電子構裝熱應變量測, ” 國立成功大學工程科學系碩士論文, 2001.