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研究生:陳明裕
研究生(外文):Ming-Yu Chen
論文名稱:邊界元素法應用在IC構裝模具熱傳分析之研究
論文名稱(外文):Heat Transfer Analysis of IC Packaging Molds Using Boundary Element Method
指導教授:李輝煌李輝煌引用關係
指導教授(外文):Huei-Huang Lee
學位類別:碩士
校院名稱:國立成功大學
系所名稱:工程科學系專班
學門:工程學門
學類:綜合工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:131
中文關鍵詞:電子構裝模具熱傳分析邊界元素法
外文關鍵詞:Boundary Element MethodMold Heat Transfer AnalysisIC Packaging
相關次數:
  • 被引用被引用:1
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  • 下載下載:134
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電子構裝封膠製程中廣泛應用熱固性環氧封膠樹脂(Epoxy Molding Compounds, EMCs)作為包覆晶片的材料,以提供適當的機械、電性及熱傳性質並保護晶片不受外界環境的干擾,但是EMCs在模具中之熟化階段有放熱聚合反應,此聚合反應與模具溫度有密切的關係,本論文主要探討於完整的封膠製程包括開模及合模固化階段中EMCs與模具的交互熱傳現象,並探討封膠製程參數與加熱器置放位置對EMCs熟化程度的影響。於論文中分別使用2D及3D的邊界元素法結合有限差分法分析封膠製程中不同的製程參數對模具由暫態到穩態時模穴的瞬時溫度分佈情形,並探討穩態下EMCs於每一製程循環週期結束時的熟化程度。分析結果顯示將模穴溫度設為定溫而不考慮模穴溫度週期性變化的影響下會過度高估EMCs於製程循環週期結束時的熟化程度,2D的分析結果亦高估模穴溫度及EMCs熟化程度,且加熱器置放位置對模穴表面溫度能否保持均勻有絕對的影響。
Epoxy molding compounds (EMCs) have been used widely as encapsulation materials for IC packages, which provide adequate mechanical, electronic and thermal properties to protect IC packages from hazard environment. There are exothermic and reactive polymerizations during EMCs undergoing curing stage in transfer mold cavity. The thermally induced reactive polymerization is highly related to mold wall temperature. The heat transfer phenomena of full molding process include mold open and mold close as EMCs at curing stage was studied in this paper. The effects of molding process parameters and location of heaters also discussed. The cavity wall temperature distribution from transition to steady state was analyzed using 2D and 3D boundary element method coupled with finite difference method. The extent of conversion at end of molding cycle during steady state was calculated. The result shows that overestimate extent of conversion too much when constant temperature distribution was applied to cavity wall. It also overestimate extent of conversion and cavity wall temperature when take cyclic cavity wall temperature variation during cyclic molding into consideration under 2D analysis. The result also shows the temperature distribution of cavity wall uniform or not related to location of heaters.
中文摘要 I
Abstract II
致 謝 III
目 錄 IV
表 目 錄 VII
圖 目 錄 VIII
符號說明 XX
第一章 緒論 1
1.1 前言 1
1.2 研究動機與目的 4
1.3 文獻回顧 5
1.4章節與組織 8
第二章 模具熱傳導分析 9
2.1 模具熱傳導分析 9
2.2 EMCs熱傳導分析 11
2.3 模具的模穴與EMCs邊界條件的整合 12
2.4 模具與EMCs熱傳分析程序 13
2.5 邊界元素法在模具瞬時熱傳分析的應用 13
2.6 邊界元素法在2D模具瞬時熱傳分析上的應用: 26
2.7 邊界元素法在3D模具瞬時熱傳分析上的應用 29
2.8 邊界元素法奇異點的處理 34
2.9 有限差分法在EMCs熱傳分析的應用 37
第三章 模具熱傳分析模型 43
3.1 模具熱傳分析模型 43
3.2 模具熱傳分析之邊界條件 48
3.3 模具熱傳分析之初始條件 52
3.4 材料參數 52
3.5 程式架構 53
3.6 數值模擬分析模型驗證 58
3.7 模具熱傳模擬分析 60
第四章 模具熱傳分析結果與討論 61
4.1 2D模具熱傳模擬分析結果 61
4.2 3D模具熱傳模擬分析結果 61
4.3 模具熱傳模擬分析結果討論 62
第五章 結論與未來展望 114
參考資料 116
自 述 121
索引(依中文筆劃順序) 122
索引(依英文字母順序) 127
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