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研究生:孫立明
研究生(外文):Li-Ming Sun
論文名稱:電鍍錫鋅合金及其鍍層之性質研究
論文名稱(外文):Investigation on the Properties of Tin-Zinc Alloy by Electroplating
指導教授:林光隆
指導教授(外文):Kwang-Lung Lin
學位類別:碩士
校院名稱:國立成功大學
系所名稱:材料科學及工程學系碩博士班
學門:工程學門
學類:材料工程學類
論文種類:學術論文
畢業學年度:90
語文別:中文
論文頁數:82
中文關鍵詞:脈衝電鍍錫鋅合金電鍍無鉛銲錫
外文關鍵詞:pulse electroplatingelectroplatingSn-Zn alloyPb-free solder
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本研究目標為利用電鍍製程以析鍍出均勻性佳且鍍層成份為錫鋅共晶(Sn-9Zn)的合金鍍層,以作為錫鋅隆點的銲錫層。
本實驗使用267ml Hull Cell電鍍槽,藉著改變不同的鍍液濃度及電流大小,使用直流電(Direct Current)電源,以找到最接近錫鋅共晶的最佳條件,接著再利用此條件,在體積為1L的錫鋅電鍍液中,進行大面積的電鍍,在此實驗中所使用的電源包括,直流電流及脈衝電流(Pulse Current),並以上述之最佳條件進行電鍍錫鋅隆點的製程。在本實驗中,利用GDS 縱深分析(GDS Depth Profile),分析鍍層內元素分佈的均勻性。
由Hull Cell試驗槽的實驗結果發現,當電流密度在0.16A/dm2以上時,所得到的鍍層之錫含量皆少於80wt%,並由實驗結果發現,若欲得到接近錫鋅共晶組成時,則電流密度不可高於0.13A/dm2。以此條件應用於1L的鍍液中進行電鍍時,必須添加Polyethylene glycol(PEG)以消除氫氣附著,但是會影響鍍層內錫與鋅的析出量,並且造成錫與鋅不能同時析出。本實驗進一步採用脈衝電流,如此,則鍍層內之錫與鋅兩元素能同時析出,明顯的改善了鍍層內元素分佈的均勻性。Pulse-off的時間為0.1ms時,則鍍層內之錫與鋅能同時析出,在本實驗中,並藉著改變不同的ZnSO4 ● 7H2O、SnCl2的濃度,及Pulse-off的時間,以求得到均勻性佳且鍍層成份為錫鋅共晶的合金鍍層之最佳條件。電鍍層利用DSC測試得熔點為198.84℃,相當接近錫與鋅的共晶成份(Sn-9Zn)。
The goal of this research is to produce uniform Sn-Zn eutectic deposit by electroplating. The deposit is intended to apply for Pb-free solder bump.
The best electroplating condition was established by manipulating the concentration and current density with 267ml Hull Cell. The condition was then applied for the plating experiment in a 1L plating bath. The plating current applied in this research includes direct current and pulse current.
The results of Hull Cell experiment showed that the Sn content of the deposit produced at current density above 0.16A/dm2 is less than 80wt%. The current density must be below 0.13A/dm2 to achieve eutectic Sn-Zn composition. PEG(Polyethylene glycol) was added into the plating solution to eliminate the adsorption of H2. PEG affects the deposit composition and was unable to produce simultaneous deposition of Sn and Zn. Pulse current was applied to enhance simultaneous deposition of Sn and Zn. Pulse plating improved the uniformity of Sn and Zn in the deposit. Simultaneous deposition of Sn and Zn was achieved at a pulse-off time of 1ms. The deposit with eutectic composition was characterized with DSC to exhibit a melting temperature of 198.84℃. Both composition and melting temperature confirm that the deposit composition is close to the Sn-Zn eutectic composition.
中文摘要…………………………………………………І
英文摘要…………………………………………………Ⅱ
總目錄……………………………………………………Ⅲ
表目錄……………………………………………………Ⅵ
圖目錄……………………………………………………Ⅶ
第一章 簡介…………………………………………… 1
1-1電子構裝技術……………………………………… 1
1-1-1 覆晶技術發展趨勢…………………………… 1
1-1-2 無鉛銲錫……………………………………… 5
1-2電鍍理論…………………………………………… 6
1-2-1 電鍍熱力學…………………………………… 6
1-2-2 電鍍動力學…………………………………… 13
1-2-3 脈衝電鍍(Pulse Plating)……………………17
1-3 電鍍錫鋅合金…………………………………20
1-4 實驗目的…………………………………………21
第二章 實驗方法與步驟……………………………22
2-1實驗構想…………………………………………22
2-2使用267ml Hull Cell試驗槽析鍍錫鋅鍍層…22
2-2-1 實驗設備……………………………………22
2-2-2 電鍍液組成…………………………………24
2-2-3 底材前處理…………………………………24
2-2-4 電鍍操作……………………………………28
2-2-5 電流密度換算………………………………30
2-2-6 鍍層成份分析………………………………30
2-3大面積電鍍……………………………………30
2-3-1 實驗設備……………………………………30
2-3-2 電鍍液組成…………………………………32
2-3-3 底材前處理…………………………………32
2-3-4 電鍍操作……………………………………32
2-3-5 鍍層成份分析………………………………35
2-3-6 鍍層元素縱深分析…………………………35
2-3-7 鍍層示差掃描熱量分析……………………37
第三章 結果與討論………………………………38
3-1 Hull Cell直流電鍍的析鍍行為……………38
3-2直流電源大面積電鍍…………………………43
3-2-1 析鍍行為…………………………………43
3-2-2 PEG(Polyethylene glycol)對析鍍行為的影響…43
3-3直流電電鍍所得鍍層成份之均勻性…………47
3-4脈衝電流電鍍鍍層之成份均勻性……………57
3-4-1 峰值電流0.1A的鍍層……………………58
3-4-2 峰值電流0.3A的鍍層……………………61
3-4-3 不同Pulse-off時間之析鍍行為………66
3-4-4 鍍層之熔點分析…………………………71
3-4-5 Pulse-off時間對鍍層表面型態之影響…73
第四章 結論………………………………………75
參考文獻……………………………………………76
致謝…………………………………………………81
自述…………………………………………………82
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