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研究生:白景傑
研究生(外文):Jing-Jie Bai
論文名稱:三維凸出熱體之自然對流之計算
論文名稱(外文):Three-Dimensional Computation of Natural Convection Problems for Protruding Heat Sources in a Cube
指導教授:林三益林三益引用關係
指導教授(外文):San-Yih Lin
學位類別:碩士
校院名稱:國立成功大學
系所名稱:航空太空工程學系碩博士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:98
中文關鍵詞:有限體積法人工壓縮因子熱傳導自然對流雷利數
外文關鍵詞:Natural ConvectionArtificial CompressibleFinite-Volume methodConductionRayleigh number
相關次數:
  • 被引用被引用:6
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  • 下載下載:62
  • 收藏至我的研究室書目清單書目收藏:0
本文研究的目的在於利用數值方法模擬在三維封閉矩形內的自然對流與熱傳導,數值方法是以上風的有限體積法來求解三維Navier-Stokes equation,在連續方程式中加入人工壓縮因子(artificial compressibility)及壓力對時間的微分項,其中對流項採用高階的上風有限體積法,進而利用DDADI數值法對時間積分,並加入隱式殘值平滑性(implicit residual smoothing)加速穩態計算的收斂性。
在物理模型方面應用於一導熱基板上鑲有三塊通有一均勻熱通量並充滿工作流體為空氣的三維封閉矩形,晶片用不同的排列方式鑲於傳導基板上(垂直、水平與平躺)。主要模擬雷利數、基板與晶片的熱傳導係數對三維封閉矩形內的自然對流與晶片和基板間熱效應的影響。
A numerical method is developed to investigate the three-dimensional conjugate heat transfer of natural convection and conduction problems in a cubic enclosure. The Rayleigh number is selected between 10 to10 . The numerical method applied a finite-volume technique to solve the three -dimensional steady Navier-Stokes equations. The artificial compressible method, a third-order upwind finite volume method, DDADI time integration and an implicit residual smoothing were applied in the numerical method to achieve a higher-order accurate method.
In this article, we are concerned with the three-dimensional iterative- coupled heat conduction-convection problem for three heated chips mounted on a conductive substrate in a cubic enclosure filled with air. The chips are assumed to have uniform properties, with internal heat generation rate of Q [W], are mounted by different arrangements (Vertical, Horizontal, and Bottom). The main objective of the present work is to simulate the effect of Rayleigh number and substrate thermal conductivity on the three-dimensional natural convection flow within the cubic and on the heat transfer from the chips.
目 錄

中文摘要…………………………………………………Ⅰ
英文摘要…………………………………………………………Ⅱ
致 謝…………………………………………………………Ⅲ
目 錄…………………………………………………………Ⅳ
圖表目錄…………………………………………………Ⅶ
符號說明………………………………………………ⅩⅡ
第一章 緒 論…………………………………………1
第二章 數值方法…………………………………………5
2.1 統御方程式……………………………………………5
2.2空間差分………………………………………………6
2.3時間積分………………………………………………11
2.4 DDADI數………………………………………………11
2.5邊界條件………………………………………………14
2.5.1固體邊界條件………………………………………14
2.5.2流入及流出的邊界條件……………………………14
2.6數值方法加速收斂……………………………………15
2.7熱傳導方程式…………………………………………15
2.7.1熱傳方程式…………………………………………15
2.7.2熱邊界條件…………………………………………16
2.8收斂標準………………………………………………17
2.9格點系統………………………………………………18
第三章 程式驗證………………………………………19
3.1三維封閉立方體內的自然對流………………………19
3.1.1絕熱壁………………………………………………19
3.1.2線性壁………………………………………………23
3.2封閉矩形內自然對流與熱傳…………………………25
3.3封閉閉矩形內自然對流與熱傳結……………………28
第四章 結果與討論………………………………………30
4.1三維立方體內基板上晶片組的熱傳與自然對流……30
4.1.1垂直排列……………………………………………31
4.1.2水平排列……………………………………………33
4.1.3平面排列……………………………………………35
4.2 不同排列晶片組的比較與分析……………………37
4.3雷利數之影響分析……………………………………39
4.4 熱傳導係數之影響分析……………………………40
第五章 結論………………………………………………41
參考文獻…………………………………………………42
圖…………………………………………………………46
表…………………………………………………………95
自述………………………………………………………97
著作權聲明………………………………………………98
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