在本論文中我們研製以低壓有機金屬化學氣相沈積(LP-MOCVD)法成長的磷化銦(InP)系列異質接面雙極性電晶體，主要重點在於傳統元件結構的改良設計，元件特性量測與討論。
我們比較以磷化銦/砷化銦鎵(InP/InGaAs)為基礎設計的單、雙異質接面雙極性電晶體。在傳統寬能隙射極部分，我們設計以一未摻雜之穿透性能障結構取代作為侷限電洞的障壁。在單異質接面雙極性電晶體方面，元件具有可操作在低於20nA集極電流，並且有超過12個數量級的寬廣電流操作區域，於室溫下，直流電流增益可達200，但其崩潰電壓僅為2V；在雙異質接面雙極性電晶體方面，崩潰電壓改善為10V並且有較佳的輸出電導特性。另一方面，我們分別比較單、雙異質接面雙極性電晶體在高溫及低溫下的兩端、三端直流特性，並且比較基極金屬自我對準與非自我對準下之元件電流增益截止頻率fT 與最大震盪頻率fmax ，測量結果發現元件應用自我對準技術比非自我對準有較高的fT 及 fmax 。
此外，在磷化銦/砷化銦鎵(InP/InGaAs)穿透式射極障壁異質接面雙極性電晶體中分別使用d摻雜層及磷化銦鎵砷步階組成漸變層的技術於砷化銦鎵空間層之基-集與基-集異質接面。實驗結果顯示，兩結構的電流阻擋效應，皆已改善，另一方面，後者因其較低的電子撞擊游離率而改良了崩潰特性與輸出電導，但熱效應較為嚴重。在高頻特性部分，比較自我對準與非自我對準技術之元件特性，以探討此技術對元件微波特性之影響。

In this thesis, we present heterojunction bipolar transistors (HBTs) based on InP-based material system grown by a low-pressure-metal-organic chemical vapor deposition (LP-MOCVD) system. We focus on the improved designs of conventional device structures, the measurement and discussion of the device characteristics.
We present and compare the InP/InGaAs single and double heterojunction bipolar transistors. By utilizing an undoped tunneling barrier instead of the wide-gap emitter, a good hole confinement can be obtained. In the SHBTs, the devices can operate at the collector current level lower than 20nA. Also, a collector current operation regime wider than 12 orders in magnitude is obtained. At room temperature, the dc current gain of 200 of the SHBT is obtained, but the breakdown voltage is only 2V. The breakdown voltage and output conductance are improved in the DHBTs, and the breakdown voltage is 10V. On the other hand, the two-and three-terminal I-V characteristics at different temperature of the SHBTs and DHBTs are studied and compared. The high frequency characteristics of the studied devices with the self-aligned and non-self-aligned base contact techniques are compared. From experimental results, self-aligned devices have higher fT and fmax than non-self-aligned devices.
The InP/InGaAs tunneling emitter HBT with a d-doping InGaAs spacer and a step-graded B-C heterojunction is fabricated and demonstrated. Experimentally, the current blocking effect can be supressed by using the composite collector structure. The step-graded junction DHBT has better breakdown characteristics and output conductance because of the less carrier multiplication. Yet, the self-heating effect is more serious than the employment of d-doping InGaAs spacer. The high-frequency characteristics of the devices with self-aligned and non-self-aligned techniques are compared to investigate the influence on microwave characteristics.

Contents
Abstract (Chinese) 6
Abstract (English) 7
誌謝 13
Table Captions 16
Figure Captions 17
Chapter 1. Introduction ……………………………………………. 20
Chapter 2 Characterization of InP/InGaAs Tunneling Emitter Bipolar Transistors
2-1. Introduction ………………………………………………. 22
2-2. Device Structures…………………… 22
2-2-1. InP/InGaAs SHBT .. 22
2-2-1. InP/InGaAs DHBT 23
2-3. Devices Fabrication …………. 24
2-3-1. DC HBT Fabrication Process 24
2-3-2 RF HBT Fabrication Process 24
2-4. DC Characterization of InP/InGaAs SHBT and DHBT 25
2-5. High-Frequency Characterization… 28
2-6 Summary 31
Chapter 3. InP/InGaAs DHBTs with Tunneling Barriers and Composite Collector Structures
3-1. Introduction ……………………………………………….. 32
3-2. Device Structures and Fabrication ………………………… 33
3-3. DC Characterization of InP/InGaAs DHBTs ……………. 34
3-4. High-Frequency Characterization …………….…………… 39
3-5. Summary ………………………………………………….. 40
Chapter 4. Conclusions and Prospects 41
References ………………………………………………………………… 43
Tables 50
Figures 51
Publication List 98

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