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研究生:張晏漢
研究生(外文):Yan-Han Chang
論文名稱:晶圓廠黃光區考慮重工情況下派工法則構建
論文名稱(外文):Design of Dispatching Rule for Photolithography Area in Wafer Fabrication Factories with Rework Considerations
指導教授:沙永傑沙永傑引用關係
指導教授(外文):Yung-Jye Sha
學位類別:碩士
校院名稱:國立交通大學
系所名稱:工業工程與管理系
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:64
中文關鍵詞:晶圓製造黃光區派工法則重工策略
外文關鍵詞:wafer fabricationphotolithography areadispatching rulerework strategy
相關次數:
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半導體晶圓製造為我國重點產業,亦是我國最具競爭力的產業。一片晶圓製造過程常需經過300~400道的製程步驟。冗長又複雜的製程步驟,又常因現製現場的不確定因素,如緊急工單的插入、不良圓重工、機臺當機等,造成晶圓廠生管作業困難。
本研究以半導體製造廠生產活動控制的派工作業為研究主題。由於晶圓製造的物料成本昂貴,如果製造過程中有不良品產生,常以重工的方式重製不良品。然而進行不良晶圓重工作業,會增加晶圓廠內在製品數量,並增加重工晶圓批量的流程時間。晶圓製造廠瓶頸限制所在為黃光區,故針對黃光區派工作業,考慮兩種不同重工策略:(1)母批在原地等待子批,及(2)母批在後續製程等待子批,發展一考慮重工作業的派工法則。經由模擬的驗證,本研究發展之派工法則能平順晶圓廠內物流,降低重工批量對生產系統的負荷。
Semiconductor industry is one of the most leading edge industry in Taiwan. Generally, the process flow of wafer fabrication may contain 300~400 steps or operations. It is complicated and filled with uncertainties, like hot order, rework lot, machine down and so on. Therefore, the production planning and control in wafer fabrication is an tough issue.
In wafer fabrication, the material cost of wafer is expensive. To reduce the cost and increase the yield of wafer fabrication, it is imperative to repair the defective wafers produced during the manufacturing process. However, repairing defected wafer will not only increase the WIP level but the flow time of rework lots as well. In wafer FAB, rework of wafer is only allowed in the photolithography area, where is the bottleneck of the entire wafer FAB.
The objective of this research is to develop a dispatching rule concerned with rework for photolithography area. The dispatching rule considers two kinds of rework strategies: (1) hold the mother lot while the child lot is reworked and (2) process mother lot while the child lot is reworked, and complete the lot in latter process. We conduct experimental simulation and the results indicate that the dispatching strategy developed in this research can improve the production performance of wafer fabrication factories.
目錄
摘要 i
Abstract ii
誌謝 iii
目錄 iv
表目錄 vi
圖目錄 vii
符號說明 viii
第 1 章 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 2
1.3 研究範圍與限制 2
1.4 研究方法與與步驟 4
第 2 章 文獻探討 6
2.1 晶圓製造廠之生產特性 6
2.2 微影黃光區製程特性 7
2.3 重工策略探討 7
2.4 派工法則探討 10
2.4.1 派工法則之分類 11
2.4.2 一般常見派工法則介紹 12
2.4.3 晶圓製造廠派工法則研究文獻 13
第 3 章 考慮重工情況之派工法則 17
3.1 問題分析與定義 17
3.2 重工策略模式 19
3.2.1 母批在原地等候子批合併 19
3.2.2 母批不等待子批,子批在後續製程與原母批合併 19
3.3 考慮重工情況之派工法則構建 20
3.3.1 重工策略決策 22
3.3.2 黃光區派工法則 25
第 4 章 實例驗證 33
4.1 系統環境說明 33
4.2 模擬情境設定 33
4.3 模擬結果分析與探討 36
4.3.1 平均流程時間比較 36
4.3.2 流程時間標準差比較 37
4.3.3 平均延遲時間比較 38
4.3.4 達交率比較 39
4.3.5 重工批平均流程時間比較 39
4.3.6 重工批流程時間標準差比較 41
4.3.7 全廠績效與重工批績效比較 41
第 5 章 結論與未來研究方向 46
5.1 結論 46
5.2 未來研究方向 47
參考文獻 48
附錄 A 51
附錄 B 工作站資訊 52
附錄 C 產品加工流程資料 53
參考文獻
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