跳到主要內容

臺灣博碩士論文加值系統

(3.90.139.113) 您好!臺灣時間:2022/01/16 17:49
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

: 
twitterline
研究生:黃子瑜
研究生(外文):Annie Tzu-yu Huang
論文名稱:共晶錫鉛銲錫之氣密式封裝之技術研究
論文名稱(外文):Hermetic Packaging Technology Using Eutectic SnPb Solder and Cr/Ni/Cu Metallurgy Layer
指導教授:陳 智
指導教授(外文):Chih Chen
學位類別:碩士
校院名稱:國立交通大學
系所名稱:材料科學與工程系
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:英文
論文頁數:51
中文關鍵詞:氣密封裝銲錫
外文關鍵詞:Hermeticsolderpackaging
相關次數:
  • 被引用被引用:0
  • 點閱點閱:387
  • 評分評分:
  • 下載下載:61
  • 收藏至我的研究室書目清單書目收藏:1
本論文研發光電元件之氣密性封裝,此技術利用熔融共金銲錫凸塊與鉻銅金之金屬冶金反應層來達到氣密封裝的效果,並具有低溫、低成本、自動對準及大批量製造之優點。本研究利用玻璃和矽兩種基材測試三種封裝組合,分別為矽與矽、矽與玻璃、及玻璃與玻璃。此三種組合在製作過程中皆可達到氣密封裝且未產生脫銲現象。此外,因為所使用之接合材料為銲錫,三者實驗結果均顯示自動對準之現象,在缺乏精密對準儀器的情況之下,加熱封裝後的平均對準誤差仍可達到20 mm的水準,大幅修正了加熱前可能大於100mm的手動對準誤差。可見封裝過程中銲錫融化時產生之表面張力會使基材達到某種程度的自動對準效果。於此研究中,氣密式封裝的接和強度介於3MPa 到 10MPa之間,而三種組合中以玻璃與玻璃基材的接合效果最為良好。綜合研究結果顯示,本技術可作為光電工業界之氣密性。

We develop an easy, low cost, and low temperature optoelectrionic hermetic packaging technology utilizing eutectic SnPb solder and Cr/Ni/Cu bonding pad. Bonding characteristic of our design is investigated on three different setups: silicon-silicon, silicon-glass, and glass-glass samples pairs. For all samples, hermeticity can be achieved at 200oC easily. Our design of bonding pads does not show dewetting during or after the reflow process. By utilizing solder materials, we also observed the characteristic of self-alignment. Because the alignment for sample pairs before bonding process is conducted through visual aligning, original misalignment might be more than 100 mm. With the pulling force of surface tension by solder during reflow process, the final misalignment of our samples were able to self-align to obtain a final misalignment of less than 100mm or even less than 20mm. Bonding strength of the three setups ranges from 3 MPa to 10 MPa. Among the three setups, glass-glass sample pairs appear to have the strongest bonding strength. This low temperature and cost effective soldering process have demonstrates its feasibility in optoelectronic packaging.

Abstract i
摘要 ii
誌謝 iii
Contents iv
Figures Captions vi
Table Captions ix
Chapter 1. Introduction 1
1.1 An Overview of Packaging Technology 1
1.2 Motivation 12
Chapter 2. Experimental Procedure 14
2.1 Sample Preparation 16
2.1.1 Preparation of Silicon Samples 16
2.1.2 Preparation of Glass Sample 20
2.2 Bonding Procedure of Samples Pairs 21
2.3 Analysis of the Bonding Result 23
2.3.1 Leak Check 23
2.3.2 Preparing Samples for Alignment Accuracy Measurement 24
2.3.3 Bonding Strength Test 24
2.3.4 Microstructure Analysis 27
Chapter 3. Results 28
3.1 Silicon-silicon Bonding 31
3.1.1 Gross Leak Check 31
3.1.2 Alignment Accuracy Measurement 31
3.1.3 Bonding Strength Test 33
3.2 Silicon-glass Bonding 37
3.2.1 Gross Leak Check 37
3.2.2 Alignment Accuracy Measurement 38
3.2.3 Bonding Strength Test 38
3.3 Glass-glass Bonding 40
3.3.1 Gross Leak Check 40
3.3.2 Alignment Accuracy Measurement 40
3.3.3 Bonding Strength Test 40
Chapter 4. Discussion 44
Chapter 5. Conclusions 48
Chapter 6. Future Work: 49
References 50

1.Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, Microelectronic Packaging Handbook Semiconductor Packaging. Chapman & Hall, New York, 1997
2. R.K. Shukla, and N. P. Mencinger, “Critical Review of VLSI Die-Attachment in High Reliability Application”,Solid State Technology, 67, July 1985
3. A. L. Tiensuu, J.-Å. Schweitz, and S. Johansson, “In Situ Investigation of Precise High Strength Microassembly Using Au-Si eutectic Bonding”, 8th International Conference on Solid-state Sensors and Actuators(Transductors '95), A-52, 1995.
4. T.R. Anthony, “ Anodic Bonding of Imperfect Surface”, J. Appl. Phys., 54, 2419-28, 1983.
5. Yu-Ting Cheng, Liwei Lin, and Khalil Najafi, “A Hermetic Glass—Silicon Package Formed Using Localized Aluminum/Silicon—Glass Bonding”, J. of Microelectromechanical Systems, Vol. 10, no. 3, 392 (2001)
6. . Y. T. Cheng, Liwei Lin, and Khalil Najafi, “Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging”, J. of Microelectromechanical Systems, Vol. 9, no. 1, 3 (2000).
7. N.K. Budraa, H.W. Jackson, M. Barmatz, W.T. Pike, J.D. Mai, Low Pressure and Low Temperature Heremetic Wafer Bonding Using Microwave Heating, Micro Electro Mechanical Systems, 12th IEEE International Conference, 490 (1999).
8. A.R. Mickelson, N. R. Babavanhally, and Y.C. Lee, Optoelectronic Packaging, John Wiley & Sons, 1997
9. J. H. Lau, "Flip Chip Technologies," New York, McGraw-Hill (1996)
10. T. Kawanobe, K. Miyamoto, T. Inabe and H. Okudaira, “Solder Bump Fabrication by Electrochemical Method For Flip Chip Interconnection”, Proc. IEEE 31th Electronic Comp. Conf., 149, May (1981)
11. Chengkkuo Lee, Wei-Fend Huang, Jin-Shown Shie, “Wafer bonding by low-temperature soldering”, Sensors and actuators A, 85, pp.330-334, 2000
12. S.M. Sze, VLSI Technology, McGraw-Hill, New York, 1988
13. Yu-Ting Cheng, Liwei Lin, and Khalil Najafi, “A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding”, J. of Microelectromechanical systems, 10, 3, September 2001.
14. Arun K. Varshneya, Fundamental of Inorganic Glasses, Academic Press Inc.,Boston, 1994.
15. Ivan Fanderlik, Silica Glass and Its Application Elsevier, Amsterdam, 1990.
16. Armin Rahn, The Basic of Soldering, John Wily & Sons, Inc., New York 1993.
17. Michael G. Pecht, Soldering Process and Equipment, John Wily & Sons, Inc., New York, 1993.
18. Kurt E. Peterson, Silicon as a Mechanical Material,”Proceedings of the IEEE, 70, 5, pp. 420-457, 1982
19. Robert C. Weast, ed, CRC handbook of chemistry and physics, CRC Press, Boca Raton, Florida, 1988
20. Eric A. Brandes, Smithells Metals Reference Book 6th Edtion, Butterworths, UK, 1983.
21. S.K. Patra, Y.C. Lee, “Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering-Part 1: Single Solder Joint”, Journal of Electronic Packaging, 133, pp337-342,

QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top
1. 李振清. 1982.〈視聽教具與語言教學-兼論海外中文教材製作的新構想〉 於《華文世界》第23期. 頁20-25.
2. 李振清. 1982.〈視聽教具與語言教學-兼論海外中文教材製作的新構想〉 於《華文世界》第23期. 頁20-25.
3. 李英哲、王國維. 1995.〈中文教材編寫軟體的設計和教學上的考慮〉. 於《華文世界》第78期. 頁16-20.
4. 王孫元平. 1989.〈試談國內華語及閩南語教材之編輯目的及編寫重點-中華語文研習所卅三年來編纂之心路歷程〉. 於《華文世界》第53期. 頁8-10.
5. 王孫元平. 1989.〈試談國內華語及閩南語教材之編輯目的及編寫重點-中華語文研習所卅三年來編纂之心路歷程〉. 於《華文世界》第53期. 頁8-10.
6. 李英哲、王國維. 1995.〈中文教材編寫軟體的設計和教學上的考慮〉. 於《華文世界》第78期. 頁16-20.
7. 王仁慈. 1998.〈海外中文學校的補充教材製作〉. 於《華文世界》第89期. 頁19-23.
8. 王仁慈. 1998.〈海外中文學校的補充教材製作〉. 於《華文世界》第89期. 頁19-23.
9. 袁筱青. 1998. 〈華語文學習者分析考慮面向〉. 於《華文世界》.第89期. 頁35-45.
10. 袁筱青. 1998. 〈華語文學習者分析考慮面向〉. 於《華文世界》.第89期. 頁35-45.
11. 常閣齡. 1991.〈教材教具教師與語言教學〉. 於《華文世界》第61期. 頁49-51.
12. 常閣齡. 1991.〈教材教具教師與語言教學〉. 於《華文世界》第61期. 頁49-51.
13. 陳希奇. 1996. 〈華文教材與課程標準〉. 於《華文世界第79期. 頁27-29.
14. 陳希奇. 1996. 〈華文教材與課程標準〉. 於《華文世界第79期. 頁27-29.
15. 陳惠玲. 1996. 〈華語教材分級初探〉. 於《華文世界》第79期. 頁21-26.