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研究生:楊文琳
研究生(外文):Wen-Lin Yang
論文名稱:利用去耦合電容與RC終端改善印刷電路板電源切換雜訊
論文名稱(外文):On the Use of Decoupling Capacitors and RC-Termination for the Improvement of PCB’s Power Integrity
指導教授:吳霖堃
指導教授(外文):Lin-Kun Wu
學位類別:碩士
校院名稱:國立交通大學
系所名稱:電信工程系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:92
中文關鍵詞:電磁干擾電源雜訊
外文關鍵詞:emcPower Bounce
相關次數:
  • 被引用被引用:2
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  • 下載下載:276
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隨著電子技術不斷進步,時序脈波信號愈來愈快,電磁干擾問題也日益嚴重。電源系統是產生電磁干擾與傳播電磁干擾的一個重要機制。在多層電路板中,通常具有專屬的電源層與接地層作為系統電源與信號回流路徑之用。
本文將以二維傳輸線模型來建立電源層/接地層的Spice模型,並且利用該模型探討數位電路邏輯準位切換電流在電源層上產生的電源雜訊、以及使用去耦合電容、RC 終端、改變電源層/接地層高度等方法,抑制電源上的雜訊。
With the fast increase of chip clock frequency, the high frequency noise on power distribution network caused by simultaneous switching is a primary source of electromagnetic interference and signal integrity problems in high-speed digital circuit design. In multilayer printed circuit board, it is a common practice to use dedicated power and ground planes for power distribution network.
In this thesis, we first use two dimensional transmission lines for the simulation and modeling of power and ground planes. With this model, the noise on the power distribution network caused by simultaneous switching can be easily evaluated. We then investigate the effectiveness of using decoupling capacitors , RC termination and changing the spacing between power and ground planes for the suppression of the noise on the power distribution network.
第一章 簡介
第二章 研究方法
2-1 Power Plane 與Ground Plane Spice等效模型
2-2 Self-Impedance與Transfer Impedance的定義
2-3 Power/Ground Plane 與Patch Antenna
2-4共振腔模式(Cavity Model)
2-5 Self-Impedance與Transfer Impedance模擬值與解析值
2-6 Self-Impedance與Transfer Impedance與TEM共振模
第三章 暫態電流與Decoupling Capacitor的特性
3-1 暫態電流的產生
3-2 暫態電流模擬、時域與頻域轉換方法
3-3 Decoupling Capacitors的特性
3-3-1 走線(Trace)的電感量
3-3-2 貫孔(Via)的電感量
第四章數值結果與討論
4-1 同步切換雜訊 (Simultaneous Switching Noise,SSN)
4-2 Decoupling Capacitors對抑制同步切換雜訊(SSN)的影響
4-3-1 Decoupling Capacitors數量對電壓變動的影響
4-3-2 Decoupling Capacitors接腳電感量的影響
4-4 輸入電流(Transient Current)上昇時間對電壓變動的影響
4-5 RC termination對Power/Ground阻抗的影響
4-6 Power/Ground Plane高度的影響
第五章 結論
參考文獻
【1】 Tim Williams , EMC for Product Designers 3rd edition
Newnes, 2001.
【2】 Clayton R. Paul, Introduction to Electromagnetic
Compatibility, John Wiley& Sons, Inc.1992.
【3】 Franz Gisin and Dr.Zorica Pantic-Tanner, ”Radiation From
Printed Circuit Board Edge Structures,” Electromagnetic
Compatibility, 2001 International Symposium on, Vol.2,
pp. 881 —883, 2001.
【4】 Keunmyung Lee and Alan Barber “Modeling and Analysis of
Multichip Module Power Supply Planes,” IEEE Transactions
on Components, Packaging Technology-Part B,VOL.18,NO.4,
pp.628-639,November 1995.
【5】 Istvan Novak , ”Reducing Simultaneous Switching Noise
and EMI on Ground/Power Planes by Dissipative Edge
Termination,” IEEE Transaction on Advanced
Packaging,VOL.22,NO.3,pp.274-283,August 1999.
【6】 Joong-Ho Kim, Madhavan Swaminathan and Youngsuk Suh, ”
Modeling of Power Distribution Networks for Mixed Signal
Applications,” Electromagnetic Compatibility, 2001
International Symposium on, vol.2, pp. 1117 —1122, 2001.
【7】 Constantine A.Balanis, Antenna Theory, 2nd edition, John
Wiley& Sons,Inc.1997.
【8】 S.Drabowitch, A.Papiernik, H.Griffiths, J.Encinasand
Bradford L.Smith, Modern Antennas, Chapman & Hall, 1998.
【9】 Zhen Mu.” Simulation and Modeling of Power and Ground
Planes in High Speed Printed Circuit Boards,” Circuits
and Systems, 2001. ISCAS 2001. The 2001 IEEE
International Symposium on, vol. 5, pp.459 -462, 2001.
【10】德州儀器 Texas instruments技術資料http://www-
s.ti.com/sc/psheets/sdaa010/sdaa010.pdf
【11】Michel Mardiguian ,Controlling Radiated Emissions by
Design, 2nd Edition , Kluwer Academic Publishers,2001.
【12】Howard Johnson and Martin Graham, High Speed Digital
Design-A Handbook of Black Magic, Prentice Hall ,1993.
【13】Murata 電容S參數網址: http://www.murata.co.jp/sparameter/
【14】David M. Pozar, Microwave Engineering, 2nd Edition, John
Wiley& Sons, Inc.1998
【15】Mark I. Montrose, Printed Circuit Board Design Techniques
for EMC Compliance A Handbook for Designers, 2nd Edition,
IEEE Press 2000.
【16】Robert E. Collin, Foundations for Microwave Engineering,
2nd Edition, McGraw-Hill, 1992.
【17】Stephen H. Hall, Garrett W. Hall and James A. McCall High-
Speed Digital System Design A Handbook of Interconnect
Theory and Design Practices, John Wiley& Sons, Inc.2000.
【18】Marc E. Goldfarb and Robert A. Pucel “Modeling Via Hole
Grounds in Microstrip,” IEEE Microwave and Guided Wave
Letters, Vol. 1 Issue: 6, pp.135-137, June 1991
【19】Istvan Novak, ”Accuracy Considerations of Power-Ground
Plane Models,” Electrical Performance of Electronic
Packaging, pp.153-156 , 1999
【20】Todd H. Hubing, James L.Drewniak,Thomas P.Van Doren and
David M.Hockanson, “Power Bus Decoupling on Multilayer
Printed Circuit Boards,” Electromagnetic Compatibility,
IEEE Transactions on, Vol.37 Issue: 2, pp.155 —166,May
1995.
【21】T.Morris, ”AC coupled termination of a printed circuit
board power plane in its characteristic impedance,” U.S.
Patent 5 708 400,Jan 13,1998.
【22】模擬軟體 Microwave OfficeTM 2000,Applied Wave Research ,網
址:http://www.mwoffice.com .
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