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研究生:葉倉宏
研究生(外文):Tsang-Hung Yeh
論文名稱:單一與耦合帶線在有無接地貫孔中之時域及頻域分析
論文名稱(外文):Analysis of Single and Coupled Stripline with and without Ground Via in Time Domain and Frequency Domain
指導教授:吳霖堃
指導教授(外文):Lin-Kun Wu
學位類別:碩士
校院名稱:國立交通大學
系所名稱:電信工程系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:63
中文關鍵詞:電磁干擾貫孔
外文關鍵詞:EMIvia
相關次數:
  • 被引用被引用:1
  • 點閱點閱:371
  • 評分評分:
  • 下載下載:58
  • 收藏至我的研究室書目清單書目收藏:0
隨著印刷電路板的多功能化,使得其電路設計變得更複雜,所需要的板層也愈多。在多層印刷電路板中,我們利用via來作為信號線於不同層板間的轉接。
在本研究中,首先探討在無ground via的情況下,信號於不連續轉接處傳輸時,如signal via,會產生非理想效應(如輻射損耗)。接下來討論當ground via增加時,對信號的傳輸有何影響。最後,探討在耦合帶線的結構中,ground via對於降低crosstalk的影響。我們利用HFSS軟體來模擬問題結構的頻域分析,及利用傅立葉轉換來作時域的分析。

As the functionality of the printed circuit boards (PCBs) increases, design of PCB becomes more complicated and the number of board layers required increases too. In a multi-layer PCB, vias are used as transitions for signal traces that have to jump from one reacting layer to a different layer.
In this thesis, we first investigate the nonideal effects (e.g., radiation loss) generated by a discontinuous signal transition, such as a conventional signal via without any accompanying ground via. We then proceed to examine the effects of adding different number of ground vias surrounding each signal via. Finally, effects of ground vias on the reduction of crosstalks between two adjacent coax-stripline-coax structures are examined. In these examples, signal quality metrics (i.e., return/insertion loss and near/far-end crosstalks) are first analyzed in frequency using HFSS software package. Transfer function and inverse Fourier transformation techniques are then used to determine time-domain pulse propagation across various single- and coupled-line structures.

第一章 簡介
第二章 研究方法
2-1問題敘述
2-2 同軸傳輸線─帶線轉接系統
2-2-1基本架構
2-2-2 等效電路
2-2-3 Ground via的設計
2-3 同軸傳輸線─耦合帶線轉接系統
2-3-1 基本架構
2-3-2 耦合帶線的crosstalk分析
2-3-3 Signal via間的耦合效應
2-3-4 Ground Via的設計
第三章 數值結果與討論
3-1 同軸傳輸線─帶線轉接系統的頻域分析
3-1-1 基板厚度變化
3-1-2 Ground via數量的改變
3-1-3 Ground via位置的改變
3-2 同軸傳輸線─耦合帶線系統的頻域分析
3-2-1 基板厚度變化
3-2-2 Ground via數量的改變
3-2-3 Ground via位置的改變
3-3 輸入訊號的時域分析
3-3-1 帶線長度的改變
3-3-2 輸入訊號週期的改變
3-3-3 輸入訊號上升時間的改變
3-3-4 同軸傳輸線─帶線轉接系統有無ground via的時域分析
3-3-5 同軸傳輸線─耦合帶線轉接系統有無ground via的時域分析
第四章 結論
【1】 Clayton R. Paul, “Introduction to electromagnetic compatibility,” New York, John Wiley & Sons, Inc., 1992.
【2】 Tim Williams, “EMC for product designers,” 2nd ed., Newnes, 1996.
【3】 Fusco, Vincent F., “Microwave circuits : analysis and computer-aided design,” Prentice Hall, 1987.
【4】 David M. Pozar, “Microwave engineering,” New York , Wiley, 1998.
【5】 Ryosuke Ito and Robert W. Jackson, “Modeling of interconnections and isolation within a multilayered ball grid array package ,” IEEE Trans. Microwave Theory Tech., vol. 47, no. 9, pp. 1819-1825, Sept. 1999.
【6】 Stephen H. Hall, Garrett W. Hall and James A. McCall, “High-Speed digital system : a handbook of interconnect theory and design practices,” New York, Wiley, 2000.
【7】 Marc E. Goldfarb and Robert A. Pucel, “Modeling Via Hole Ground in Microstrip ,” IEEE Microwave and Guided Wave Lett., vol. 1, no. 6, pp. 135-137, June 1991.
【8】 Harlan Howe, Jr., “Stripline circuit design,” Artch House, 1974.
【9】 Rajesh Mongia, Inder J. Bahl, Prakash Bhartia., “RF and microwave coupled-line circuits,” Boston, Artech House, 1999.
【10】 Brian C. Wadell, “Transmission line design handbook,” Boston, Artch House, 1991.
【11】 David K. Cheng, “Field and wave electromagnetics,” 2nd ed., Addison Wesley, 1989.
【12】 Lothar O. Hoeft, James L. Knighten, Joseph T. DiBene II and Michael W. Fogg, “Spectral analysis of common mode currents on fibre channel cable shields due to skew imbalance of differential signals operating at 1.0625 Gb/s,” IEEE International Symposium on Electromagnetic Compatibility, vol. 2, pp. 823-827, 1998.
【13】 R.E. Ziemer, W.H. Tranter, “Principles of communications : systems, modulation, and noise,” 4th ed., New York, Wiley, 1995.

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