臺灣博碩士論文加值系統

本文旨在研究集束型半導體製程設備的可靠度。半導體製程設備屬於大型機電整合系統，可靠度的複雜性比生產一個產品的可靠度來得不易分析，除了考慮各元件本身的可靠度之外，還須知道各個元件間的關連及其彼此物理連結。本文首先介紹集束型設備的硬體，然後介紹可靠度一些方法，如方塊圖分析、樹狀圖形分析，將整體系統內元件彼此的關係用圖示表現，進而藉表示出來的關係計算可靠度，最後在可靠度的考量下探討產能方面的表現。

This study is focused on the reliability of cluster tools in semiconductor production equipment. Cluster tools in semiconductor production equipment belong to a large-scale mechatronic system, which is not amenable to reliability analysis. One has to take into account the correlation and physical interconnection among components in addition to the reliability of each component itself. This work introduces the hardware of cluster tools for semiconductor production equipment first, and then describes methods such as the block diagram analysis and Bryant tree analysis. By using these methods, this work relates components in the whole system using graphs. Reliability is calculated by matrix manipulation. Finally, based on the cluster tool reliability, this study investigates the throughput of cluster tools in semiconductor production equipment.

第一章 緒論…………………………………………………………1
1.1 研究動機與目的……………………………………………1
1.2 文獻回顧……………………………………………………2
1.3 本文組織及架構……………………………………………3
第二章 集束型設備各部份分析……………………………………4
2.1 設備介紹……………………………………………………4
2.2 程序流程簡介………………………………………………6
第三章 可靠度基本介紹……………………………………………8
3.1 可靠度定義及特性…………………………………………8
3.1.1 定義…………………………………………………………8
3.1.2 特性…………………………………………………………9
3.2 設備生命週期及可靠度……………………………………11
3.2.1 系統生命週期………………………………………………11
3.2.2 浴缸曲線……………………………………………………12
第四章 集束型設備圖形定理分析…………………………………14
4.1 集束型設備的圖形分析……………………………………14
4.2 從整體到細節的可靠度模組分析…………………………15
4.2.1 分析步驟……………………………………………………15
4.2.2 分配作法……………………………………………………19
4.3 從細節到整體的可靠度模組分析…………………………21
4.3.1 分析步驟……………………………………………………22
第五章 集束型設備樹狀圖分析……………………………………24
5.1 故障樹的建構………………………………………………24
5.2 加入布林函數重建樹狀圖…………………………………25
5.2.1 畫出系統圖計算出可靠度…………………………………26
5.2.2 布林函數建構的樹狀圖……………………………………27
5.3 對集束型設備進行可靠度評估……………………………30
5.3.1 相互連結的可靠度評估……………………………………30
5.3.2 集束型設備的可靠度評估…………………………………32
第六章 並行式及依序並行式集束型設備可靠度分析……………33
6.1 矩陣的降階…………………………………………………33
6.2 依序式半導體製程設備可靠度分析………………………35
6.3 並行式半導體製成設備可靠度分析………………………40
6.4 依序並行式半導體製成設備可靠度分析…………………45
6.5 複雜系統可靠度方法之比較………………………………50
第七章 設備可靠度數據及產能分析………………………………51
7.1 可靠度試驗規格……………………………………………51
7.2 數據結果……………………………………………………51
7.3 產能分析……………………………………………………55
第八章 結論…………………………………………………………59
8.1 結果討論……………………………………………………59
8.2 未來展望……………………………………………………59
參考文獻 ………………………………………………………………60

[1] Bryant RE, “Graph-Based Algorithm for Boolean Function Manipulation”, IEEE Trans Comput, 1986;C-35(8):677-691.
[2] Gandhi OP, Agrawal VP, Shishodia KS, “Reliability Analysis and Evaluation of system”, Reliab Engng System Safety, 1991;32:283-305.
[3] Bazu, M., “The Reliability of Semiconductor Devices: An Overview”, IEEE Optimization of Electrical and Electronic Equipments, 1998; 785 -788.
[4] Marcel J. Lopez and Samuel C. Wood, “Systems of Multiple Cluster Tools: Configuration and Performance Under Perfect Reliability”, IEEE Transations on Semiconductor Manufacturing, 1998; 465-474.
[5]John L Mauer, Roland E A Schelasin, “Analysis Of Cluster Tool Performance In Semiconductor Manufacturing”, IEEE/CHMT Int1 Electronics Manufacturing Technology Symposlum, 1992.
[6] W. Long, Y. Sato, M. Horigome, “Quantification of Sequential Failure Logic for Fault Tree Analysis. Reliability Engineering and System Safety”, 2000; 269—274.
[7] Winfrid G. Schneeweiss, “Fault Trees for Clusters Tolerating Failure or Disconnectedness of A Single Node”, Journal of Systems Architecture, 1999; 887 - 895
[8] DOD, MIL-HDBK-217F, “Reliability Prediction of Electronic Equipment”, 1991.
[9] Elmer E. Lewis, “Introduction to Reliability Engineering”, 1989.
[10] 鄭隆傑, “300mm型多腔式製程設備之建模及自動化排程”, 國立交通大學機械工程研究所碩士論文,民90年。
[11] Rauzy A., “New Algorithm for Fault Tree Analysis”, Reliab Engng System Safety, 1993;40;203-11.
[12] S. C. Wood, S. Tripathi, and F. Moghadam, “A Generic Model for Cluster Tool Throughput Time and Capacity”, IEEE/SEMI Semiconductor Manufacturing Conf., 1994; 194-199.
[13] Samuel C. Wood, “Cost and Cyale Time Performance of Fabs Based on Integrated Single-Wafer Processing”, IEEE Transactions on Semiconductor Manufacturing, 1997; 98-110.
[14] Peter D.Ashe.Cluster, “Tool Handler Reliability Modeling Using Top-Down and Bottom-Up Methodologies”, IEEE/SEMI Advanced Semiconductor Manufacturing Conference, 1994.
[15]王宗華,“可靠度工程技術手冊”, 2000.