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研究生:陳家旭
研究生(外文):Chia-Hsu Chen
論文名稱:打線接合之實驗與有限元素研究
論文名稱(外文):Experimental and Finite Element Analyses on Wire Bonding
指導教授:洪景華
指導教授(外文):Prof. Chinghua Hung
學位類別:碩士
校院名稱:國立交通大學
系所名稱:機械工程系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:90
中文關鍵詞:打線接合超音波熱音波金球成型接合強度有限元素
外文關鍵詞:wire bondingultrasonicthermosonicforming of golden ballbonding strengthfinite element
相關次數:
  • 被引用被引用:14
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  • 下載下載:181
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在電子構裝製程中,打線接合技術一直是使用最廣的電路連線方式。由於接合時所使用的金線細小(直徑25μm),因此在打線過程中,控制參數的設定會對接合強度的大小有顯著的影響。本論文的目的,便是希望利用實驗與有限元素的配合,討論參數與接合強度的關係。
本論文中將利用不同控制參數的組合,進行打線接合實驗,以觀察金球成型的結果;並討論參數對接合強度的影響。最後嘗試利用與實驗相同的邊界條件下,以有限元素法初步模擬接合時金球成型的情況。
Wire bonding is the most popular interconnection method in electronic packaging. The controlled parameters significantly affect the bonding strength when the tiny golden wires(25μm in diameter) are used in this process. This study examines how parameters and bonding strength are related by performing experimental and finite element analyses.
Bonding experiments were conducted to examine how various combinations of controlled parameters affect both the forming of golden ball connection and the resulting bonding strength. Moreover, finite element simulations on the wire bonding were performed, with the results compared with those of experimental works.
中文摘要......................................I
英文摘要......................................II
致謝..........................................III
目錄..........................................IV
表目錄........................................VII
圖目錄........................................VIII
第一章 導論...................................1
1.1. 前言.....................................1
1.2. 電子構裝簡介.............................1
1.3. 研究動機與目的...........................2
1.4. 文獻討論.................................2
1.5. 研究方法.................................3
1.6. 研究大綱.................................3
第二章 打線接合技術...........................5
2.1. 打線接合技術的介紹.......................5
2.2. 熱音波打線接合的過程.....................6
2.3. 影響接合品質的因素.......................7
2.4. 接合強度的量測...........................8
2.4.1. 拉力測試實驗...........................8
2.4.2. 推力測試實驗...........................9
第三章 實驗的排程與設備介紹 ..................11
3.1. 前言 ....................................11
3.2. 實驗方法與規劃...........................11
3.2.1. 打線接合實驗...........................11
3.2.2. 掃描式電子顯微鏡SEM....................12
3.3. 實驗與量測儀器...........................12
第四章 實驗結果與討論.........................14
4.1. 振動功率為變動參數之實驗結果.............14
4.2. 接合下壓力為變動參數之實驗結果...........15
4.3. 接合時間為變動參數之實驗結果.............17
4.4. 結論 ....................................18
第五章 有限元素分析與初步模擬結果.............19
5.1. 前言 ....................................19
5.2. 前處理軟體I-DEAS.........................19
5.3. 有限元素分析求解軟體.....................20
5.3.1. ABAQUS軟體.............................20
5.3.2. DEFORM2D軟體...........................21
5.4. 邊界條件的討論...........................23
5.4.1. 溫度條件...............................23
5.4.2. 振動條件...............................24
第六章 有限元素模擬之結果與討論...............26
6.1. 前言 ....................................26
6.2. 三維模型的討論...........................26
6.2.1. 模型的假設與建立.......................26
6.2.2. 邊界條件的給定.........................26
6.2.3. 模擬的結果與討論.......................27
6.3. 二維模型的討論...........................28
6.3.1. 二維模型的假設與建立 ..................28
6.3.2. 模擬結果與討論.........................28
6.4. 對照實驗模擬的結果與討論.................29
6.4.1. 幾何模型的建立與假設...................29
6.4.2. ABAQUS軟體模擬的結果與討論.............29
6.4.3. DEFORM2D模擬的結果與討論...............30
6.4.4. 下壓力對金球成型的變化.................30
6.5. 結論 ....................................32
第七章 結論與未來展望.........................33
7.1. 結論 ....................................33
7.2. 未來展望.................................34
參考文獻......................................36
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[3] S. W. Or, H. L. W. Chan, V. C. Lo, and C. W. Yuen, “ Performance Study of an Ultrasonic Transducer used for Wire Bonding”, 1998.
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[15] M. Cockcroft and D. Latham, “Ductility and the Workability of Metals” Journal of the Institute of Metals, Vol. XCVI, pp. 33~39, 1968.
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