(3.238.186.43) 您好!臺灣時間:2021/02/28 14:56
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果

詳目顯示:::

我願授權國圖
: 
twitterline
研究生:周唐詮
研究生(外文):Chuo, Tang Chuan
論文名稱:微小環型諧振式陀螺儀之結構製造
論文名稱(外文):Fabrication for the Structure of Micro-Vibrating Ring Gyroscope
指導教授:成維華成維華引用關係
指導教授(外文):Chieng, Wei Hua
學位類別:碩士
校院名稱:國立交通大學
系所名稱:機械工程系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:67
中文關鍵詞:陀螺儀陽極接合
相關次數:
  • 被引用被引用:2
  • 點閱點閱:338
  • 評分評分:系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔
  • 下載下載:83
  • 收藏至我的研究室書目清單書目收藏:3
本論文主旨在於製造以MEMS為基礎的諧振式環型陀螺儀,以取代複雜、製作不易、製造成本高的一般機械式陀螺儀並達到更廣泛的應用。論文中採用的環型諧振式陀螺儀為殼振動式陀螺儀的一種,藉著半導體製程與微機械加工技術來實現主體結構製造,以達到元件尺寸微小化,並利用批次製造來降低生產成本。在論文中,我們使用微影、陽極接合、KOH濕式蝕刻、ICP或RIE乾式蝕刻等方法來完成諧振式環型陀螺儀的結構。

The main purpose of this thesis is to fabricate the structure of vibrating ring gyroscope based on MEMS technology by
replacing the conventional mechanical gyroscopes with high cost, and complication as well as uneasily-fabricate. The vibrating ring gyroscope in this thesis is one kind of vibrating shell gyroscopes. By means of VLSI and micromachined techniques, we can realize the fabrication of main structure with small size and decrease fabrication cost on batch process. In this thesis, we use lithography, anodic bonding, wet etching (KOH), and dry etching (ICP or RIE) to implement our micro-vibrating structure.

Contents
摘要…………………………………………………….………………......i
Abstract………………………………………………..…………………..ii
Content………………………………………………..…………………..iii
List of Tables……………………………………………………………...v
List of Figures…………………………………………………………...vi
Chapter 1 INTRODUCTION………………………………………….........1
Chapter 2 DESCRIPTION OF THE VIBRATING RING
GYROSCOPE…………………………........................3
2.1 Micromachined Gyroscopes……………………….………………....3
2.1.1 Overview………………………………………………………....3
2.1.2 Types of Vibrating Gyroscopes……………………………….4
2.2 Structure and Operation…………………………………..........7
2.3 Nonideal Effects………...………………………….............12
Chapter 3 FABRICATION TECHNOLOGY………………………............14
3.1 Introduction…………………………………………………………..14
3.2 Lithography……………………………………………………….....14
3.2.1 Coating………………………………………………………....14
3.2.2 Soft Bake……………………………………………………....17
3.2.3 Alignment and Exposure……………………………………...18
3.2.4 Development…………………………………………………....19
3.2.5 Hard Bake……………………………………………………....19
3.3 Anodic Bonding……………………………………………………....20
3.4 Inductively Plasma Etch…………………………………………….22
3.4.1 Inductively Plasma Etch System.......................22
3.4.2 Deep Silicon Etch……………………………………………..23
Chapter 4 EXPERIMENT RESULTS……..………………………..........25
4.1 Fabrication Process………………………………………………...25
4.2 Fabrication Defects………………………………………………….28
Chapter 5 CONCLUTIONS………………………………………...........30
REFERENCE……………………………………….…………………........31

[1] William A. Clark, Roger T. Howe, and Roberto Horowitz,
“Surface Micromachined Z-axis Vibratory Rate Gyroscope”,
Solid-State Sensor and Actuator Workshop, Hilton Had, South
Carolina, June 2-6, 1996, pp283-287.
[2] M.Weinberg, J.Bernstein, S.Cho, A.T.King, A.Kourepenis, and
P.Maciel, “A Micromachined Comb-Drive Tuning Fork Rate
Gyroscope”, Proceedings of the 49th Annual Meeting
“Future Global Navigation and Guidance”, The institute of
Navigation, June 21-23, 1993.
[3] Thor Juneau, A.P. Pisano, “Micromachined Dual Input Axis
Angular Rate Sensor”, Solid-State Sensor and Actuator
Workshop, Hilton-Had, South Carolina, June 2-6, 1996, pp299-
302.
[4] Putty, Michael Williaw, “A Micromachined Vibrating Ring
Gyroscope”, Technical Report No.245, Department of
Electrical Engineering and Computer Science, University of
Michigan, Arm Arbor, 1994.
[5] P.Greiff , B. Boxenhorn, T.King, L. Niles, “Silicon
Monolithic Micromechanical Gyroscope”, Transducers’91,
San Francisco, CA, USA; 24-27 June 1991, pp.966-8.
[6] Gert I.Andersson, Nils Hedenstierna, Per Svensson, Hakan
Pettersson, “A Novel Silicon Bulk Gyroscope", Transducers’
99, Sendai, Japan, June 7-10, 1999, p.902-905.
[7] M. Lutz, W.Golderer, J. Gerstenmeter, J. Marek, B.
Maihofer, S. Mahler, H. Munzel, U. Bischof, “A Precision
Yaw Rate Sensor in Silicon Micromachining”, Transducers’
97, Chicago, June 16-19, 1997, p.847-850.
[8] K.Y. Park, H.S. Jeong, S. An, S.H. Shin, and C.W. Lee,
“Lateral Gyroscope Suspended By Two Gimbals Through High
Aspect Ratio ICP Etching”, Transducers’99, Sendai, Japan,
June 7-10, 1999, p. 972-975.
[9] G.C. Newton, “Theory and Practice in Vibratory Rate
Gyroscopes,” Control Engineering, June 1963, pp. 149-151.
[10] J. S. Burdess and T. Wren, “The Theory of a Piezoelectric
Disc Gyroscope,” IEEE Transactions on Aerospace and
Electronic Systems, VOL. AES-22, NO.4, July 1986, pp. 410-
418.
[11] G.H. Bryan, “On a Revolving Cylinder or Bell”,
Proceedings of the Royal Society, London, 47.1890.
[12] H.C.Nathanson et al, “The Resonant Gate Transistor,”
IEEE Transactions on Electron Devices, Vol. ED-14, March,
1967, pp. 117-133.
[13] R. T. Howe and R.S. Muller, “Resonant-Microbridge Vapor
Sensor,” IEEE International Electron Devices Meeting, San
Francisco, California, December 10-12, 1984.
[14] M. W. Putty et al, “One-Port Active Polysilicon Resonant
Microstructures,” Proceedings, IEEE Workshop on Micro
Electro Mechanical Systems, Salt lake City, Utah, Feb. 20-
22, 1889, pp. 60-65.
[15] M. W. Putty, “Polysilicon Resonant Microstructures,”
Master’s Thesis, University of Michigan, Ann arbor, MI,
Aug. 1988, pp. 23,31.
[16] D. D. Lynch, “Vibration Induced Drift in the
Hemispherical Resonator Gyro,” Annual Meeting of the
Institute of Navigation, Dayton, Ohio, June 1987.
[17] S.F. Yoon et al., “The effect of elevated softbake
temperature on high resolution positive photoresist”,
Solid State Technology, vol.32(2), p89, 1989.
[18] S. Wolf and R. N. Tauber, “Silicon processing for the
VLSI era,” in Process Technology. CA: Lattice, 1986,
vol. 1, pp. 434-438.
[19]“AZ 4000 Series Photoresist for Thick Film Applications,”
Catalog, Hoechst.
[20] Stanley Wolf, Richard N. Tauber, “Silicon Processing for
the VLSI Era”, Lattice Press, Sunset Beach, California,
1986.
[21] G. Wallis and D.I. Pomerantz, “Field Assisted Glass-Metal
Sealing", J, Appl. Phys. 40 (1969), p3348-3949.
[22] S. Kong, M. Minami, M.Esashi, “Fabrication of Reactive
Ion Etching System for Deep Silicon Machining, TIEE Jpn.
117-E (1997) 10-13.
[23] J. W. Coburn, “Plasma Etching and Reactive Ion Etching”,
IBM Research Laboratory San Jose, California, 1982.

QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top
系統版面圖檔 系統版面圖檔