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研究生:張華基
研究生(外文):Nathan Chang
論文名稱:田口方法於半導體封裝製程改善之應用-以焊線站之焊線強度最佳化為例
論文名稱(外文):Application of Taguchi Methods to Improve the Semi-conductor Packaging Process - A Case Study for Wire Strength Optimization of Wire Bonding Process
指導教授:蘇朝墩蘇朝墩引用關係
指導教授(外文):Chao-Ton Su
學位類別:碩士
校院名稱:國立交通大學
系所名稱:工業工程與管理學程碩士班
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:49
中文關鍵詞:積體電路拉力測試參數設計直交表信號雜音比田口方法
外文關鍵詞:Integrated CircuitWire Pull TestParameter DesignOrthogonal ArraySignal to Noise RatioTaguchi Methods
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半導體封裝製程的主要目的,是將積體電路(Integrated Circuit,IC )晶片上的線路引接至外部之導線架,並覆蓋上保護晶片線路之膠質,確保IC功能正常。在封裝製程中,焊線站是擔任串接內外部線路(晶片與導線架)的任務,因此,假如焊線強度不足,會導致後續的封膠作業將焊線沖斷或受損,或者在後段PCBA(PC Board Assembly)組裝過程中造成可靠度(Reliability)的問題,不但破壞了工廠的品質形象,影響公司的商譽,甚至還會遭致客戶索賠及後續訂單的損失。
本論文應用田口玄一(Genichi Taguchi)博士所發展的參數設計(Parameter Design)方法,找出焊線站作業最佳化的條件設定參數,使焊線強度可以穩定的改善,而不會在後續製程發生斷線或受損現象。針對焊線製程改善問題,本論文以焊線拉力測試(Wire Pull Test)強度為品質特性,配合直交表(Orthogonal Arrays)的配置,並利用望大特性(Larger-The-Better,LTB)信號雜音比(Signal-to-Noise Ratio,SN比)進行分析。研究結果顯示,此分析方法可成功獲得最佳參數設定,經最後進行確認實驗後,確認加法模型在本實驗中是合宜的,並穩定的改善了焊線強度。
The main purpose of semi-conductor packaging process is to ensure workable functionality and protect IC (Integrated Circuit) chip by connecting the electrical circuits of IC chip with external lead frame and injecting the molding compound. In packaging process, the operation of wire bonding is to link the internal/external electrical circuits between IC chip and lead frame. The bonding wire is possibly be broken or damaged during the following molding process if the wire strength is not strong enough. Furthermore, this defect will cause reliability concern in back-end PCB assembly process. Such defect of weak wire strength is not only damaged the quality image of packaging manufacturer, but also customers raised claim on this defect sometimes. Moreover, the afterward business orders will be deducted or cancelled.
The firm applied Taguchi’s approach to the wire bonding process, so as to improve the wire strength in short time. The quality characteristic was decided as reading value by “Wire Pull Test”. The study was also analyzed along with appropriate orthogonal arrays to accelerate and simplify the process of experiment. Based on Larger-The-Better, Signal-to-Noise ratio (SN ratio) data to analyze, the result shows the method result in the optimal parameter design. Furthermore, the additive model is appropriate in the experiment by means of confirmation experiment. The proposed optimal conditions do improve the wire strength of wire bonding process.
第一章 緒論 ……………………………………………………… 1
1.1 研究動機 …………………………………………………… 1
1.2 研究目的 …………………………………………………… 2
1.3 研究架構 …………………………………………………… 4
第二章 半導體封裝製程介紹 ……………………………………… 5
2.1 晶片切割 …………………………………………………… 5
2.2 黏晶/上片 …………………………………………………… 6
2.3 焊線 …………………………………………………………… 6
2.4 壓模 …………………………………………………………… 6
2.5 電鍍 …………………………………………………………… 7
2.6 剪切/成型 …………………………………………………… 8
2.7 印字 …………………………………………………………… 9
2.8 檢驗 …………………………………………………………… 9
第三章 田口方法與相關文獻探討 ………………………………… 10
3.1 品質工程 ……………………………………………………… 10
3.2 田口方法 ……………………………………………………… 12
3.2.1 品質損失函數 …………………………………………… 12
3.2.2 雜音因子 ………………………………………………… 13
3.2.3 參數的分類 ……………………………………………… 14
3.2.4 品質工程三階段 ………………………………………… 15
3.2.5 參數設計 ………………………………………………… 17
3.3 相關文獻探討 ………………………………………………… 20
第四章 研究方法……………………………………………………… 24
4.1 封裝製程特性 ………………………………………………… 24
4.2 田口方法應用於封裝製程之步驟 …………………………… 24
第五章 個案研究 …………………………………………………… 28
5.1 問題描述 …………………………………………………… 28
5.2 品質特性和SN比 …………………………………………… 28
5.3 控制因子/雜音因子及其水準 ……………………………… 29
5.4 矩陣實驗設計 ………………………………………………… 33
5.5 實驗程序 ……………………………………………………… 34
5.6 執行矩陣實驗 ………………………………………………… 35
5.7 資料分析 ……………………………………………………… 35
5.8 確認實驗 ……………………………………………………… 40
第六章 結論與建議 ………………………………………………… 44
6.1 結論 …………………………………………………………… 44
6.2 未來研究方向與建議 ………………………………………… 45
參考文獻 ……………………………………………………………… 47
1. 李輝煌,田口方法-品質設計的原理與實務,高立圖書有限公司,2000
2. 張俊彥主編,鄭晃忠審校,積體電路製程及設備技術手冊,經濟部技 術處,1997
3. 劉漢誠,球腳格狀陣列封裝技術,鴻海精密工業股份有限公司,1997
4. 鍾清章,田口式品質工程導論,中華民國品質學會,1998
5. 蘇朝墩,產品穩健設計-田口品質工程方法的介紹和應用,中華民國品質學會,1997
6. Belavendram, N., Quality by Design, Prentice Hall, 1995
7. Chang, Chih-Fang, The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process, Master Thesis of Mechanical Engineering Dept., National Sun Yat-Sen University, 1999
8. Chen, Jin-Lon, The Effect and Analysis of Solder Joint Geometry on the Fatigue Life of PBGA Packaging, Master Thesis of Mechanical Engineering Dept., Chung Yuan Christian University, 2000
9. Fowlkes, W.Y. and Creveling, C.M., Engineering Methods for Robust Product
Design, Addision-Wesley Publishing Company, 1995
10. Intel, Packaging Handbook, 儒林圖書公司, 1991
11. Intel, Surface Mount Technology-Packaging Guide, 儒林圖書公司, 1990
12. Jeng, Y.C, Huang, M.F. and Li, C.C. “Optimizing the Thermalsonic Bonding Process for Thick Film Hybrid IC by Taguchi Method”, International Journal of Microelectronics and Reliability, Vol.31, No.2/3, pp.501-510, 1991
13. Kackar, R. N., "Off-line Quality Control, Parameter Design, and Taguchi’s Method (with discussions ), " Journal of Quality Technology, Vol.17, No.4, 1985
14. Lee, H.L., Hwang, S.J., Lee, H.H., Huang, D.Y., Su, F., and Chen, S.K., “Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance”, ChipMOS Technical Symposium, 1999, pp.11-20.
15. Lee, Hung-Lung, The Taguchi Analysis of Mold Flow Simulation of IC Packaging, Master Thesis of Mechanical Engineering Dept., National Cheng Kung University, 1998
16. Li, Yi-Shiou, The Optimized Analysis and the Development of Design Module for the Wire Sweep of IC Encapsulation, Master Thesis of Mechanical Engineering Dept., Chung Yuan Christian University, 1997
17. Lin, Yeh-Chao, Study of Parameters for Thermosonic Wire Bonder, Master Thesis of Mechanical Engineering Dept., National Chung Hsing University, 2000
18. Lin, Heng-Zheng, Optimal Dimension of Plastic Quad Flat Package (PQFP) by Using Taguchi Method, Master Thesis of Engineering Science Dept., National Cheng Kung University, 1997
19. Lin, Wei-Shin, Multiple Objectives Robust Design of Thermally Enhanced PQFP, Master Thesis of Mechanical Engineering Dept., National Yunlin University of Science & Technology, 2000
20. Montgomery, D.C., Design and Analsis of Experiments, Wiley, New York, 1991
21. Phadke, M.S., Quality Engineering Using Robust Design, Prentice-Hall, 1989
22. Phadke, M.S., "Selection of quality characteristics and S/N ratio for robust design," Blobecom, 1987
23. Ross, P.J., Taguchi Techniques for Quality Engineering, McGraw-Hill Book Company, 1996
24. Shih, Chia-Chien, The Optimized Analysis for Paddle Shift of IC Lead Frame, Master Thesis of Mechanical Engineering Dept., Chung Yuan Christian University, 1997
25. Tay, K.M. and Butler C., "Methodologies for Experimental Design: A Survey, Comparison, and Future Predictions," Quality Engineering, Vol.11, No.3, 1999
26. Tsao, Chih-Chiang, The Taguchi Method and Neural Network Analysis in a Loop of Wire Bonding Profile for IC Packaging, Master Thesis of Mechanical Engineering Dept., National Cheng Kung University, 2000
27. Wu, Yuin, and Moorei, W.H., Quality engineering, product and process design optimization, ASI, 1985
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