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研究生:陳縣成
研究生(外文):Hsien-Cheng Chen
論文名稱:球柵陣列封裝基版電氣特性分析
論文名稱(外文):Electrical Characterization of Ball-Grid Array (BGA) Packaging
指導教授:吳霖堃
指導教授(外文):Lin-Kun Wu
學位類別:碩士
校院名稱:國立交通大學
系所名稱:電資學院學程碩士班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:62
中文關鍵詞:球柵陣列基板多晶片模組共平面波導互阻抗隔離度
外文關鍵詞:Ball-Grid ArraysubstrateMulti-chip Modulecoplannar waveguidemutual impedanceisolation
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隨著無線通訊產業的蓬勃發展,以及產品生命週期的縮短,一個有效且簡單的分析方法,使我們得以在產品設計的階段,就可以充分掌握產品的最終特性。由於球柵陣列封裝有許多優點目前被大量使用於電子產品的封裝應用上,因此對於多層結構球柵陣列封裝,依接地面為基準分別使用電磁場模擬並萃取出其等效電路模型元件參數,使我們容易分析加入封裝後的特性,並找到改善的方法。

Packaging engineers have to work with die level designers to either create a package that performs well at high frequency or to use readily available low cost packages that happen to meet the needs of the application. First time success of a design is more important and models that help achieve this are becoming more valuable. In addition, the accurate models and the analysis method to use them in circuit simulations are more readily available. This paper explores the electrical characterization of ball-grid array (BGA) packaging.

中文摘要
英文摘要
誌謝
目錄
表目錄
圖目錄
第一章 緒論
第二章 研究方法
2-1 問題敘述
2-2 等效集總電路模型
2-3 隔離度等效模型
第三章 數值結果與討論
3-1 準確性驗證
3-2 改變基板高度對S參數的影響
3-2-1 改變焊球腳墊層高度對S參數的影響
3-2-2 改變直流電源層高度對S參數的影響
3-2-3 改變射頻層高度對S參數的影響
3-2-4 改變任兩層高度對S參數的影響
3-2-5 改變焊球距離及直徑對S參數的影響
3-2-6 改變基板材質介電系數對S參數的影響
3-3 輸出入埠間隔離度(Isolation)分析
3-3-1 焊球層輸出入埠間隔離度(Isolation)分析
第四章 結論
參考文獻

[1] John H. Lau, Ball Grid Array Technology, McGraw-Hill Inc. , pp.34-57, 1995.
[2] Chris M. Mueth, “Using Ball Grid Array Packaging in Wireless IC designs”, Agilent Technologies EEsof-EDA, Volume 6, Issue 1, 2001 .
[3] M.P.R. Pancker, D. Douriet, M.S. Hyslop and N.L.Greenman , “Ball Grid Array :A DC To 31.5GHz Low Cost Packaging Solution for Microwave and MM-wave MMICs”, Microwave Journal, pp.158-168, Jan.1998.
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[5] T.Krems, W.Haydl, H.Massles, J.Rudiger, “Millimeter-wave Performance of Chip Interconnections Using wire Bonding and Flip-chip”, IEEE MTT-S International Microwave Symposium Digest pp.247-250, 1996.
[6] Thomas P. Budka, “Wide-Bandwidth Millimeter-wave Bond-wire Interconnects”, IEEE Transactions on Microwave Theory and Techniques, Vol.49, No.4., April 2001.
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[8] D. Staiculesescu , J. Laskar, Emmanouil M.Tantzeris , “Design Rule Development for Microwave Flip chip Applications”, IEEE Transactions on Microwave Theory and Techniques, Vol.48, No.9, pp.1476-1481, Sep.2000.
[9] Hussein H.M. Ghouz and EL-Badawy EL-Sharawy, “An Accurate Equivalent Circuit Model of Flip Chip and Via Interconnects”, IEEE Transactions on Microwave Theory and Techniques,Vol.44, No.12, pp.2543,2554, Dec.1996.
[10] Ryosuke Ito, Thongchai Hongsmatip, and Robert W. Jackson, “Electrical Modeling of BGA Package for Microwave Applications-A Layer by Layer Approach”, IEEE Transaction on Microwave Theory and Techniques, Vol.45, pp.1919-1925, Oct.1998.
[11] Ryosuke Ito, Robert W. Jackson, “Modeling of Interconnections and Isolation Within A Multilayered Ball Grid Array Package”, IEEE Transactions on Microwave Theory and Techniques, Vol.47, No.9, Sep.1999.
[12] J.Fang, Y.Chen, and Z.Wu, “Modeling of Electrical Properties of Power/Ground Planes in Electronics Packaging” in Proc.1st Int, Symp., Microelectron Packaging PCB Technology, pp.74-83, Sep.1994.
[13] Jim Delap, “ Planar EM Simulation on Multi-chip Modules and BGA packages”, Microwave Journal, pp.140-148, Nov.2001.
[14] Ansoft Corporation , High Frequency Structure Simulator, Ver7.004.
[15] David M. Pozar, Microwave Engineering, 2nd Edition , John Wiley & Sons, Inc., pp.160-163,1998.
[16] Applied Wave Research, Inc. , Microwave Office,2001.
[17] Joint Industry Standard ANSI/J-STD-013, “Implementation of Ball Grid Array and Other High Density Technology”, IPC-The Institute for Interconnecting and Packaging Electronics Circuits.

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