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研究生:陳文泰
研究生(外文):Wen-Tai Chen
論文名稱:錫銅無鉛銲料與Ni基材界面反應之研究
論文名稱(外文):Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
指導教授:高振宏高振宏引用關係
指導教授(外文):C-R Kao
學位類別:碩士
校院名稱:國立中央大學
系所名稱:化學工程與材料工程研究所
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:169
中文關鍵詞:無鉛銲料錫銅波銲共晶
外文關鍵詞:Sn-0.7Cuwave-solderinglead-free solder
相關次數:
  • 被引用被引用:10
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  • 下載下載:0
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隨著環保聲浪的抬起,目前工業界打算採用無鉛銲料,用來取代63Sn-37Pb含鉛銲料。本論文探討錫銅無鉛銲料與Ni間之反應,此一銲料在波銲製程或是迴銲製程上皆有其應用性。本研究探討液態Sn-Cu銲料中微量銅濃度的變化,與Ni基材之反應情形,此一研究,除上述液態反應研究外,本論文也深入探討固態Sn-Cu銲料與Ni之反應,發現一很有趣的現象,即銲料中Cu濃度的些許變化,大幅度的影響界面生成物之種類及形態。
本研究所選用的Sn-xCu銲料,其x分別為0.2、0.4、0.6、0.7、1及3 (wt.%)。在液態反應實驗中,發現微量銅濃度變化,造成界面上介金屬化合物的種類及形態明顯的不一樣。當銅濃度低時(Sn-0.2Cu),界面上生成一層連續的(Ni1-xCux)3Sn4化合物;當Cu濃度高時(Sn0.6Cu ~ Sn1Cu) ,界面上生成(Cu1-yNiy)6Sn5化合物;而當銅的濃度介於上二者之間 (Sn-0.4Cu) 時,在界面上(Ni1-xCux)3Sn4及(Cu1-yNiy)6Sn5同時存在。
但在固態反應實驗中,Cu濃度變化的影響較不重要,此時溫度及時間的影響較為主要,在不同溫度及不同的反應時間下,界面上之化合物種類也不同。在反應溫度225℃,反應時間由25小時~400小時之間,不管Cu濃度變化如何,界面上之生成物永遠以二層存在,底下接近Ni層的為(Ni1-xCux)3Sn4相,其上頭化合物為(Cu1-yNiy)6Sn5。
在介金屬生長速率的分析上,本研究由液態反應實驗發現介金屬化合物遵循反應控制,而固態反應則遵循擴散控制。
由本研究結果發現,工業界選用Sn-Cu銲料時,對於Cu濃度的控制,必須非常的精確,因為只差0.2 wt.%的Cu濃度,界面上生成物種類及形態明顯不同,嚴重影響界面上化合物之機械性質。故銲料組成中Cu金屬濃度必須控制在0.1 wt.%之內,以確保產品品質。


The eutectic 99.3Sn-0.7Cu solder (wt%, Sn-0.7Cu) is the most promising lead-free replacement for the eutectic Sn-Pb solder in wave-soldering applications. In this study, the effect of a small perturbation in the Cu concentration on the reaction between the Sn-0.7Cu solder and Ni was investigated. Specifically, four Sn-xCu solders (x = 0.2, 0.4, 0.7, and 1) were reacted with Ni at 250 degreesC. A slight variation in Cu concentration produced completely different reaction products. When the Cu concentration was low (x = 0.2), the reaction product was (Ni1-xCux)(3)Sn-4. At high Cu concentrations (x = 0.7 and 1), the reaction product was (Cu1-yNiy)(6)Sn-5. When the Cu concentration was in-between (x = 0.4), both (Nil-xCux)(3)Sn-4 and (Cu1-yNiy)(6)Sn-5, formed. The above findings were rationalized using the Cu-Ni-Sn isotherm. the results of this study imply that the Cu concentration must be strictly controlled in industrial production to produce the desired intermetallic at the interface.


頁數
摘 要....................................................................Ⅰ
目 錄....................................................................Ⅲ
圖 目 錄....................................................................Ⅴ
表 目 錄....................................................................Ⅹ
符號說明....................................................................XI
第 一 章 緒論
1.1 研究背景................................................................1
1.1.1 微電子構裝............................................................1
1.1.1.1 構裝四層次......................................................1
1.1.1.2 構裝之演進......................................................4
1.1.1.3 針腳穿孔接合(PTH)構裝...........................................8
1.1.1.4 表面黏著技術(SMT)構裝-BGA、FC...................................9
1.1.2 銲接..................................................................14
1.1.3 銲料..................................................................19
1.1.4 無鉛銲料..............................................................22
1.2 研究目的................................................................25
第 二 章 文獻回顧
2.1 二元及三元相圖.........................................................26
2.1.1 二元平衡相圖..........................................................26
2.1.1.1 Sn-Cu二元平衡相圖..................................................26
2.1.1.2 Sn-Ni二元平衡相圖..................................................26
2.1.1.3 Ni-Cu二元平衡相圖..................................................29
2.1.2三元平衡相圖...........................................................30
2.1.2.1 Sn-Cu-Ni三元平衡相圖...............................................30
2.2 界面反應...............................................................33
2.2.1 Sn/Ni反應.............................................................33
2.2.2 Sn/Cu反應.............................................................41
2.3 Pb-Sn銲料添加微量的Cu ( 0.1 wt.% - 5 wt.% )............................44
2.4 實驗規劃...............................................................51
第 三 章 實驗方法及步驟
3.1 Ni與液態錫銅銲料反應....................................................52
3.1.1錫銅銲料製備.......................................................52
3.1.2 Ni與液態Sn-xCu銲料之界面反應......................................52
3.1.3試片處理、觀察及分析...............................................55
3.2 Ni與固態錫銅銲料反應....................................................61
3.2.1 Ni與固態Sn-xCu銲料之界面反應......................................61
第 四 章 Ni與液態Sn-xCu銲料反應之實驗結果與討論
4.1 Ni與液態Sn-xCu銲料之界面反應型態........................................64
4.1.1短反應時間(10分鐘).....................................................64
4.1.2界面生成物之XRD圖譜....................................................73
4.1.3 Ni與液態Sn-0.4Cu銲料之界面生成物型態.................................75
4.1.4 長反應時間(25小時)...................................................84
4.2介金屬之反應動力學.......................................................99
4.2.1 介金屬生長動力學.....................................................99
第 五 章 Ni與固態Sn-xCu銲料、Cu與液態Sn-yNi銲料反應之實驗結果與討論
5.1 Ni與固態Sn-xCu銲料之界面反應型態........................................103
5.1.1反應溫度:225℃........................................................105
5.1.2反應溫度:180℃........................................................113
5.1.3 反應溫度:160℃......................................................115
5.1.4 介金屬生長動力學.....................................................118
5.2 Cu與液態Sn-yNi銲料之界面反應型態........................................122
5.2.1 短反應時間(10分鐘~1小時).............................................122
第 六 章 Ni及Cu基材與液態純錫銲料反應之實驗結果與討論
6.1 Cu與液態Sn-0.7Cu銲料之界面反應型態......................................132
6.2 Cu與液態Sn-0.7Cu銲料之界面反應型態......................................136
6.2.1液態純錫銲料與Ni之反應.................................................136
6.2.2 液態純錫銲料與Cu之反應................................................141
第 七 章 結論
7.1 結論....................................................................144
參考文獻....................................................................147


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