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研究生:何政恩
研究生(外文):Cheng-En Ho
論文名稱:先進半導體封裝技術中之金脆效應及其有效抑制方法
論文名稱(外文):THE GOLD-EMBRITTLEMENT PHENOMENON IN ADVANCED ELECTRONIC PACKAGES AND ITS PREVENTION
指導教授:高振宏高振宏引用關係
指導教授(外文):C. R. Kao
學位類別:博士
校院名稱:國立中央大學
系所名稱:化學工程與材料工程研究所
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:英文
論文頁數:226
中文關鍵詞:銲料封裝金脆
外文關鍵詞:gold-embrittlementsolderpackage
相關次數:
  • 被引用被引用:2
  • 點閱點閱:514
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  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
Cover
ABSTRATE (CHINESE)
ABSTRATE (ENGLISH)
CONTENTS
LIST OF TABLES
FIGURES CAPTION
CHAPTER I INTRODUCTION: PACKAGES AND SOLDERS
1.1 Microelectronic Packages
1.2 Soldering, Solders, and Au/Ni Surface Finish
1.3 Reaction Kinetics of Solder with Au/Ni during Soldering: The Formation of (Au1-xNix)Sn4 in Solder Joints
CHAPTER II CATASTROPHIC FAILURE IN ADVANCED PACKAGES: EXTREMELY WEAK SOLDER JOINTS INDUCED BY (AU1-XNIX)SN4 INTERMETALLIC
2.1 Traditional “Gold-Embrittlement” in Bulk Solder
2.2 New “Gold-Embrittlement” Induced by (Au1-xNix)Sn4 Migration to the Solder/Pad Interface, Forming the (Au1-xNix)Sn4/Ni3Sn4 Intermetallic-to-Intermetallic Interface
2.3 The Objective of this Thesis
CHAPTER III THE MECHANISM FOR (AU1-XNIX)SN4 MIGRATION TO THE INTERFACE
3.1 Interesting (Au1-xNix)Sn4 Phenomena in Solder Joints: Our Observations
3.2 Driving Force for (Au1-xNix)Sn4 Migration to the Interface
3.3 Kinetic Rationales for (Au1-xNix)Sn4 Migration
CHAPTER IV TECHNIQUES FOR INHIBITING THE FORMATION OF THE BRITTLE (AU1-XNIX) SN4 LAYER AT THE INTERFACE
4.1 Using An Ultra-Thin Au Finish for Soldering
4.2 The Competitor, “Ni”, Doped into Solder Joints
4.3 Appling Cu6Sn5-Based Compound to Incorporate Au
CHAPTER V CONCLUSION
APPENDIX
REFERENCES
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