本研究主要是探討不同陽極處理參數對皮膜厚度、成份及CIEL*a*b值的影響。使用的材料為5052 H32合金，電解質為稀釋硫酸溶液，採固定電流密度法。利用薄膜測厚儀、電子微探儀(EPMA)、分光式測色計比較不同處理時間、不同電流密度、不同硫酸濃度及添加酒石酸鉀後皮膜的特性。
實驗結果發現隨著陽極皮膜厚度隨著處理時間越長、電流密度越高、硫酸濃度越低及添加酒石酸鉀有越來越厚的趨勢。皮膜的厚度與皮膜的淨生成率有關，當硫酸濃度越低、電流密度越高時，皮膜的生成速率高，溶解速率低，於是可得到較厚的氧化皮膜。添加酒石酸鉀將降低皮膜的臨界電流密度，使得皮膜的溶解速率降低，於是淨生成率提高，皮膜有較高的厚度。
利用EPMA分析皮膜斷面成份，發現皮膜內的成份有相當大的差異。這是由於外加電場及皮膜的結構影響，離子在皮膜內移動所造成的結果。皮膜屬於微結晶結構的γ-Al2O3，微結晶結構大小並不均勻，離子受到微結晶結構及陽極處理參數的影響，移動的速率有所差異，於是皮膜內的成份有極大的差異。

The purpose of this study is aimed at investigating effects of coating thickness, and composition on CIE L*a*b value by different anodizing condition. The alloy used in this experiment was 5050 H32 Aluminum alloy, and the electrolyte used was dilute sulfuric acid. All experiments conducted by using constant current density. Experimental variables studied including anodizing time, current density, concentration of sulfuric acid, and adding potassium tartaric in the dilute sulfuric acid. The coating thickness and the coating elements were measured by the coating thickness tester, electron probe X-ray microanalyzer(EPMA) and the spectrophotometer.
Increasing the anodizing time, current density and decreasing the concentration of sulfuric acid, increase the thickness of anodic film. Adding the potassium tartaric increases the thickness of the anodic film, too. The compositions of the anodic film were influence by the migration of the ion and the microcrystalline structure in the anodic film.

第一章前言
第二章文獻回顧
2-1陽極處理
2-2陽極處理的分類
2-2.1硫酸法
2-2.2草酸法
2-2.3鉻酸法
2-3封孔
2-3.1熱水封孔
2-3.2鉻酸鹽封孔
2-3.3醋酸鎳的封孔
2-4陽極處理的生成機制
2-4.1早期理論
2-4.2 Keller的模型
2-4.3 Akahori的理論
2-4.4 Murphy及Michelson的理論
2-4.5 Heber的理論
2-4.6 UMIST(英國曼徹斯特大學)研究群的理論
2-4.6.1合金元素及電解質吸附的影響
2-5陽極皮膜生長的動力學
2-5.1陽極處理參數對陽極電位的影響
2-5.2真實表面的電荷交換及電流
2-5.3 Barrier layer內的部份電流密度
2-5.4多孔性皮膜內離子橫越barrier layer的場方程式
2-5.5離子在film / electrolyte界面轉移的方程式
2-5.6電荷在barrier layer轉移
2-6 其他
2-6.1酸根離子的吸附現象
2-6.2皮膜內離子的移動現象
2-6.2.1 SO42－離子的移動
2-6.2.2 OH－離子的移動
2-6.2.3 O2－離子的移動
2-6.2.4金屬離子的移動
第三章實驗步驟
3-1實驗材料
3-2試片規格
3-3實驗設備
3-3.1 直流電源供應器
3-3.2 功率分析儀
3-3.3 陽極處理槽
3-3.4 薄膜測厚儀
3-3.5 色差計
3-3.6 掃描式電子顯微鏡(SEM)
3-3.7 電子微探儀(EPMA)
3-4 實驗步驟
3-4.1 前處理
3-4.1.1 機械拋光(Mechanical Polishing
3-4.1.2 脫脂(Degreasing)
3-4.1.3 鹼洗(Alkaline etching)
3-4.1.4 去污點/去除氧化物(Desmutting/Deoxidizing)
3-4.2 陽極處理(Anodizing)
3-4.3 後處理
3-4.3.1 封孔
3-5 實驗參數
3-5.1 處理時間
3-5.2 電流密度
3-5.3 硫酸濃度
3-5.4 添加劑
第四章結果與討論
4-1 不同參數對厚度的影響
4-1.1 不同時間對皮膜厚度的影響
4-1.2 不同電流密度對皮膜厚度的影響
4-1.3 不同濃度對皮膜厚度
4-1.4 添加酒石酸鉀對皮膜厚度的影響
4-2 電壓-時間曲線
4-2.1 不同電流密度對電壓-時間曲線的影響
4-2.2 不同硫酸濃度對電壓-時間曲線的影響
4-2.3 添加酒石酸鉀對電壓-時間曲線的影響
4-3皮膜的表面形態觀察
4-3.1 鹼洗
4-3.2 不同陽極處理時間的表面形態
4-3.3 不同電流密度的表面形態
4-3.4 不同硫酸濃度的表面形態
4-3.5 添加酒石酸鉀
4-3.6 封孔
4-4 斷面成份分析
4-4.1 不同參數對S含量的變化
4-4.1.1 不同時間對S含量變化的影響
4-4.1.2 電流密度對S含量變化的影響
4-4.1.3 不同濃度對S含量的影響
4-4.1.4 添加酒石酸鉀對S含量的影響
4-4.2 不同參數對Mg含量的影響
4-4.2.1 不同時間對Mg含量變化的影響
4-4.2.2 電流密度對Mg含量變化的影響
4-4.2.3 不同濃度對Mg含量的影響
4-4.2.4 添加酒石酸鉀對Mg含量的影響
4-4.3 不同參數對Al含量的影響
4-4.4 不同參數對O含量的影響
4-4.4.1 不同時間對O含量的影響
4-4.4.2 電流密度對O含量變化的影響
4-4.4.3 添加酒石酸鉀對O含量的影響
4-5 皮膜生成機制探討
4-6 不同操作參數的色彩分析
4-6.1 未染色前的色彩分析
4-6.1.1不同陽極處理時間
4-6.1.2不同電流密度
4-6.1.3不同硫酸濃度及添加酒石酸鉀
第五章 結論
參考文獻
圖
表

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