|
Anderson H. M., Merson J.A., and Light R. W., "A Kinetic Model for Plasma Etching in a SF6/O2 RF Discharge," IEEE Trans. Plasma Sci., vol. PS-14, 156-164,1986Belhaouari J. B., Gonzales J. S., and Gleizes A., "Simulation of a Decaying SF6 Arc Plasma: Hydrodynamics and Kinetics Coupling Study," J. Phys. D, vol. 31, pp. 1219-1231, 1998Breitbarth, F. W., Berg, D., Dumke, K., Tiller, H. -J. “Investigation of the Low-pressure Plasma-chemical Conversion of Fluorocarbon Waste Gases”, Plasma Chem. Plasma Porcess, 17, 39-57, 1997Chang M. B. and Yu S. J., “An Atmospheric-Pressure Plasma Process for C2F6 Removal”, Environmental Science & Technology, 35, 1587, 2001Chapman B., “Glow Discharge Processes”, A Wiley-Interscience Publication, Canada, 297, 1980David Y.E., “Capture and Recycle: A New Option for Emission Reductionof Sulfur Hexafluoride in Magnesium Melting,” (paper presented at International Symposium on Recycling of Waste Materials, September, 1999).Derdourl A., Casanovas J., Grob R., and Mathien J., “Spark Decomposition of SF6/H2O Mixtures,” IEEE. Trans. Electr. Insul. Vol. 24, No. 6, pp.1147-1157, 1989Donaldson, D.J.; Sloan, J.J., “Energy Distributions in the HF and CO Products of the Reaction of F Atoms with HCO,” J. Chem. Phys. 82, 1873, 1985Dorai R., “Modeling of Plasma Remediation of NOx Using Global Kinetic Models Accounting for Hydrocarbons”, Thesis for the Degree of Master of Science in Chemical Engineering, University of Illinois at Urbana-Champaign, 2000Edelson D. and Flamm D. L., "Computer Simulation of a CF4 plasma Etching Silicon," J. Appl. Phys., vol, 56, pp. 1522-1531, 1984Fiala A., Kiehlbauch M., Mahnovski S., and Graves D. B., “Model of Point-of-Use Plasma Abatement of Perfluorinated Compounds with an Inductively Coupled Plasma”, Journal of Applied Physics, 86, 152, 1999.Flippo B. G. and Jones R. F., “Abatement of Fluorine Emissions Utilizing an ATMI CDO Model 863 with Steam Injection”, Journal of the Semiconductor Safety Association, 1, 2001Fujimi M., Suwa G. and Nagano K., “PFC Emissions Reductions in the Semiconductor Operations Division at Seiko Epson Corporation”, ISESH 8th Annual Conference, Kenting, Taiwan, 2001Hartz C. L., Bevaan J. W., Jackson M. W., and Wofford B. A., “Innovative Surface Wave Plasmas Reactor Technique for PFC Abatement”, Environmental Science & Technology, 32, 682, 1998Herron J. T. and Van Brunt R. J., "Zonal Model for Corona Discharge-Induced Oxidation of SF6 in SF6/O2/H2O Gas Mixtures", Proc. 9th Int. Symp. On Plasma Chemistry, University of Bari, Italy, 1989.Hitachi S. T. and Hitachi S. k., “Catalytic Decomposition of PFC”, A Partnership for PFC Emissions Reductions, Technical Program Present, Texas, 1998Hung M. C., Yang C. L., Wu P. H., Pan S. M. and Huang Y. S., “Reduction of NF3 Usage for Optimal AMAT HDP Clean Recipe”, ISESH 8th Annual Conference, Kenting, Taiwan, 2001Ibuka S., Japan’s Use of ClF3, A Partnership for PFC Emissions Reductions, Technical Program Present, Texas, 1998IS, “Long-Term Evaluation of the Litmas ‘Blue’ Plasma Device for Point-of-Use (POU) Perfluorocompound and Hydrofluorocarbon Abatement,” International SEMATECH Technology Transfer # 99123865B-ENG., 2000Karecki S. M., Pruette L. C., and Reif R., “Reduction of Global Warming Emissions in a Dielectric Etch Application through Use of Iodofluorocarbon”, A Partnership for PFC Emissions Reductions, Technical Present, Texas, 1998Levy R. A., Zaitsev V. B., Aryusook K., Ravindranath C., Sigal V., Misra A., Kesari S., Rufin D., Sees J., and Hall L., “Investigation of CF3I as an Environmental Benign Dielectric Etchant”, Journal of Materials Research, 13 (9), 2643, 1998Liao M. Y., Wong K., McVittie J. P., and Saraswat K. C., “Abatement of Perfluorocarbons with an Inductively Coupled Plasma Reactor,” Journal of Vacuum Science & Technology, B17 (6), 2638, 1999Marinelli L., Worth W., “Global Warming: A White Paper on the Science, Policies and Control Technologies that Impact the U.S. Semiconductor Industry”, Technology Transfer # 93112074A-TR SEMATECH, 1994Novak J. P. and Frechette M. F., "Transport Coefficients of SF6 and SF6-N2 Mixturs from Revised Data, "J. Appl. Phys., vol. 55, pp.107-119, 1984Occupational Safety and Health Administration (OSHA). January 19, 2000 .http://www.oshaslc.gov/dts/chemicalsampling/toc/tocchemsamp.htmlPolak L. and Lebedev Y. A., Plasma Chemistry. Cambridge, UK:Cambridge International Science. Principles of Plasma Discharges and Materials Processing, M. A. Lieberman and A. J. Lichtenberg, Eds. New York: Wiley, 1994Pruette L. C., Karecki S. M., and Reif R., “Evaluation of Trifluoroacetic Anhydride as an Alternative Plasma Enhanced Chemical Vapor Deposition Chamber Clean Chemistry”, Journal of Vaccum Science & Technology, A16 (3), 1577, 1998Qwentes, (2002/3/15), Fluorcarbons and Sulfur Hexafluoride http://www.fluorocarbons.org/applications/others/metalcasting/main apply/main.htmRaizer Y. P., Allen J. E. and Kisin V. I., “Gas Discharge Physics”, ISBN: 3-540-19462-2 Springer-Verlag Berlin Heidelberg Present, Texas, 1991Sum S.P., “Evaluation of C3F8 as a Cleaning Gas in a Novellus Concept Two Sequel Tool, SEMATECH TT Document #97053282A-TR, May 31, 1997Seeley A., Chandler P., Cottle S., and Mawle P., “Effective PFC Gas Abatement in a Production Environment”, Semiconductor Fabtech-10th Edition, BOC Edwards Exhaust Management Systems, Nailsea, UK, 1997Shih M., Lee W.-J., Chen C.Y. and Tsai C.H. (2001) “Decomposition of SF6 in the O2/Ar Plasma Environment,” The 2001 Conference on Aerosol Science and Technology, Yu-Lin County, Taiwan.USEPA, (2000) GLOBAL Warming Site: National Emissions-HFCs, SF6.PFCs.http://www.epa.gov/globalwarming/emissions/national/xfcs-sf6.htmlUSEPA, (2002) Byproducts of Sulfur Hexafluoride (SF6) Use in the Electric Power Industy, http://www.epa.gov/high gwpl/sf6/index.htmlVan Brunt R. J. and Herron J. T., “Plasma Chemical Model for Decomposition of SF6 in a Negative Glow Corona Discharge”, Physica Scripta, vol.T53, pp.9-29, 1994Wallington, T. J.; Hurley, M. D.; Shi, J.; Maricq , M. M.; Sehested, J.; Nielsen, O. J.; Ellermann, T., “A Kinetic Study of the Reaction of Fluorine Atoms with CH3F, CH3Cl, CH3Br, CF2H2, CO, CF3H, CF3CHCl2, CF3CH2F, CHF2CHF2, CF2ClCH3, CHF2CH3, and CF3CF2H at 295K,” Int. J. Chem. Kinet. 25, 651-665, 1993Worth W. F., “Reducing PFC Emissions: A Tech. Update”, Future Fab International, Environmental/ Health and Safety, 57, 2000Xu X., Rauf S., and Kushner M. J., “Plasma Abatement of Perfluorocompounds in Inductively Coupled Plasma Reactors”, Journal of Vaccum Science & Technology A: Vaccum, Surfaces and Films, 18 (1), 213, 2000Yu S. J. and Chang M. B., “Oxidative Conversion of PFC via Processing with Dielectric Barrier Discharges”, Plasma Chemistry and Plasma Processing, 21 (3), 311, 2001鄭昆山,能源政策與產業結構之法制調整,國科會/環保署NSC88-EPA-Z-029-001,民國88年。周崇光,“積體電路製程尾氣控制技術之應用與發展”,2000產業環保工程實務技術研討會,民國89年11月。余榮彬,“半導體工業全氟化物排放控制技術與機會”,TSIA專題報導摘選,民國88年4月。下載http://www.tsia.org.tw/cnewletter9.htm.舒碧霞 (2000),“廢氣減量半導體業壓力大”。下載於:http://news.pchome.com.tw/ttimes/science/20000802/index-20000802113003513841.html 張君正 (1998),“半導體製造廠排放地球溫暖化氣體狀況”,一九九八工業減廢暨永續發展研討會論文集。游生任 (2000),「以介電質放電技術轉化四氟甲烷及六氟乙烷之初步研究」,碩士論文,國立中央大學環境工程研究所,中壢,民國89年6月。呂榮峰 (2001),「BaTiO3填充床電漿反應器破壞CF4之初步研究」,碩士論文,國立中央大學環境工程研究所,中壢,民國90年6月。
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