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研究生:鄭金龍
研究生(外文):Chin-Lung Cheng
論文名稱:台灣半導體供應鏈體系之探討
論文名稱(外文):A Study of Supply Chain System for Semiconductor Industry in Taiwan
指導教授:林立千林立千引用關係
指導教授(外文):Lie-Chien Lin
學位類別:碩士
校院名稱:國立高雄第一科技大學
系所名稱:運輸與倉儲營運系
學門:運輸服務學門
學類:運輸管理學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
中文關鍵詞:半導體半導體產業供應鏈供應鏈管理程序
外文關鍵詞:SemiconductorSemiconductor IndustrySupply ChainSupply Chain ManagementProcess
相關次數:
  • 被引用被引用:43
  • 點閱點閱:2004
  • 評分評分:
  • 下載下載:627
  • 收藏至我的研究室書目清單書目收藏:5
本研究主要以學者及學術機構所提出的供應鏈之程序整合與管理及參考供應鏈管理文獻以及半導體產業之現況做法,整理、歸納出半導體產業供應鏈架構。
本研究之半導體供應鏈架構乃是以供應鏈管理程序為「經」,供應鏈管理績效評量及關鍵成功因素與障礙為「緯」,構織出供應鏈管理架構,以作為半導體實施供應鏈管理之參考。半導體產業依循供應鏈管理程序三大主軸-需求計劃、供應計劃、需求達成,實施產品設計研發管理、需求預測管理、供應商管理、生產管理、配銷管理、顧客關係管理等程序,且評核供應鏈管理績效以強化優點與改進缺點,並掌握關鍵成功因素與排除障礙,最終目的使企業以一種獲利的方式來監控與管理訂單允諾,符客戶需求。
本研究以台灣半導體業之晶圓廠、封裝測試廠及材料供應商等上中下游實證分析半導體供應鏈體系,研究結果如下:
(1) 供應鏈夥伴對供應鏈管理觀念認識不深,缺乏認知與了解整體概念。
(2) 供應鏈同步發展製程與協作,並融入供應商技術,創造產品價值。
(3) 雖然晶圓廠日程需求預測與真正投產差異大,但每月總量差異皆能控制在協議百分比內。
(4) 個案供應鏈因產品屬性及為代工業,較難以實施製造與物流延遲策略以及供應商管理存貨或共同管理存貨。
(5) 資訊化未普遍,只限於生產方面且資訊交換與分享亦未能大幅地開放。
(6) 個案供應鏈尚未能體會領悟出實施供應鏈之關鍵成功因素與障礙。
(7) 經濟產業環境對半導體產業產生衝擊,客戶的動向驅使業者之經營決策跟隨客戶亦步亦趨,接近市場及顧客的經營模式似乎是台灣半導體業之未來目標。
有鑑於上述研究結果,本研究也提出建議供台灣半導體業實施供應鏈管理之參考。
This study is mainly based on intergrating and managing supply chain management(SCM), initiated by scholars and academic institutions, also refers to other supply chain literatures and current operations for semiconductor industry to organize the theoretical framework of supply chain management for semiconductor industry.
The study provide for practitioner for semiconductor industry a supply chain framework, which is formed by supply chain management process longitudinally and performance measurement as well as key success factor latitudinally. It guide semiconductor industries to follow supply chain management streams, which includes demand plan, supply plan, and demand fulfillment and implement specifically products development, demand forecast, supplier management, production management, distribution management, and customer relationship, and measure supply chain performance to enforce the strengths and improve weakness, meanwhile recognize key success factors and remove hurdle. The ultimate purpose of supply chain management is to monitor and manage customers’ order commitment in a profitable way.
This study empirically tests supply chain management for semiconductor wafer fabrication, packaging subcontractor, and packaging raw mterials supplier in Taiwan with our research model, and its research finding is as follows:
1. Supply chain in all levels do not fully realize and understand the concept and core meaning of SCM
2. A case of supply chain develope products and process technologies collaboratively and put early supplier involvement which is to create total value.
3. A big deviation exists between daily demand forecast and actual die loading in wafer fabrication, but monthly deviation can be controlled within a agreed fluctuation percentage.
4. As the attribute of semiconductor and a case of supply chain is foundry and subcontractor, it is difficult to perform postponement strategy and vendor-managed inventory or co-managed inventory.
5. Computerization is only for production side, and information exchange and sharing also is not open to packaging subcontractors in a magnitude way
6. A case of supply chain is not seemed to realize and figure out key success factors of SCM.
7. Economic environment will be a big impact on semiconductor industry. In the future in order to survive, semiconductor industry in Taiwan need to approach to get access to their customers and the market.
In light of research results as above, this study also suggest improvement action for practitioners for semiconductor industry in Taiwan.
一、緒論 1
1.1研究背景與動機 1
1.2研究範圍與目的 2
1.3研究限制 3
二、研究架構與方法 4
2.1研究架構 4
2.2研究方法 4
2.2.1研究設計 5
2.2.2資料收集與整理 5
2.2.3研究工具 6
2.2.4個案樣本之選取 6
三、半導體產業供應鏈管理分析 8
3.1半導體產業發展歷史與現況探討 9
3.1.1半導體產品類別與應用 10
3.1.2半導體產業發展史 12
3.1.3台灣半導體產業發展現況分析 17
3.1.4十二吋晶圓發展趨勢 23
3.2供應鏈管理文獻探討 24
3.2.1供應鏈管理演進 25
3.2.2供應鏈管理定義 28
3.2.3供應鏈管理策略 30
3.2.4供應鏈管理績效評量 40
3.2.5供應鏈管理關鍵成功因素與障礙 43
3.2.6產業別供應鏈文獻探討 45
3.3半導體產業供應鏈體系 48
3.3.1供應鏈管理程序 50
3.3.2供應鏈管理績效評量 68
3.3.3供應鏈管理關鍵成功因素與障礙 72
3.3.4小結 75
四、研究命題與實證分析 75
4.1研究命題 76
4.1.1命題定義 76
4.1.2命題推演流程 77
4.2實證結果與分析 78
4.2.1個案供應鏈簡介 79
4.2.2命題意涵與實證結果 83
4.2.3小結 93
五、結論與建議 96
5.1結論 96
5.2建議 100
5.3後續研究方向 101
參考文獻 103
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