臺灣博碩士論文加值系統

本實驗針對錫球經過155℃不同時間之時效處理後觀測內部的相變化以及IMC的成長過程，並交叉比對含鉛（Sn-Pb）系列與無鉛(Sn-Ag-Cu)系列Solder與IMC之差異性，並經由時效處理觀測材料的擴散行為，量測錫球經不同時效處理後與錫球Shear Force之變化，並將推球破裂面加以放大觀測，且由電子顯微鏡放大分析接合處Cross-Section之IMC成長行為與Phase的變化，由於Pad 上所鍍的Au造成IMC 之（Au,Ni）Sn4快速成長，使得錫球接合處容易形成脆性破裂的情形，但是在無鉛系列之Cu在Reflow過程中將鍍Ni層覆蓋，阻礙Au與Ni的擴散行為，使得IMC成長趨於緩慢，而Ag3Sn的析出物增強無鉛錫球的抗破裂強度，使得Sn-Ag-Cu系列無鉛錫球改善了BGA錫球接合部位之可靠度。

The Study of Microstructure Analysis of Pb/Sn And Sn/Ag/Cu Solder Ball in BGA Package.

壹.前言………………………………………………………………………1
1-1研究背景------------------------------------------------------------------------1
1-2文獻回顧 ------------------------------------------------------------------------2
貳.實驗方法……………………………………………………………………6
2-1實驗目的 -------------------------------------------------------------------------6
2-2實驗之計畫流程 --------------------------------------------------------------------7
2-3本實驗所使用BGA試片之接點部位說明 ------------------------------------8
2-3.1.Pad 接合部位----------------------------------------------------------------8
2-3.2.Solder Ball接合部位--------------------------------------------------------8
2-4試片實驗種類、成分與標示代號之說明 ---------------------------------------10
2-5熱處理過程 ---------------------------------------------------------------------------11
2-6推球過程 ------------------------------------------------------------------------------12
2-7 BGA試片Cross-Section部位之金相處理 --------------------------------------13
2-8試片觀察與分析 ---------------------------------------------------------------------13
參.實驗結果……………………………………………………………………14
3-1 由剪斷強度分析 --------------------------------------------------------------------14
3-2 Pb-Sn系列錫球顯微分析 ---------------------------------------------------------15
3-2.1.推球後Pad Surface的顯微組織分析 ------------------------------------ 15
3-2.2.BGA Cross-Section 的顯微組織分析 -----------------------------------15
A.錫球接合部位之IMC成長行為-----------------------------------------------15
B.Au、Ni、Sn各成分之擴散情形-----------------------------------------------16
C.錫球內部之析出物-----------------------------------------------------------17
3-3 Sn-Ag-Cu系列錫球顯微分析-------------------------------------------------------18
3-3.1.推球後Pad Surface的顯微組織分析--------------------------------------18
3-3.2.BGA Cross-Section 的顯微組織分析--------------------------------------18
A.錫球接合部位之IMC成長行為-------------------------------------------18
B.各成分之擴散情形-----------------------------------------------------------19
C.錫球內部之析出物-----------------------------------------------------------19
肆.討論 …………………………………………………………………………21
4-1.由推球值、微接點接合部位之IMC成長以及破裂面探討 ------------------21
4-2.顯微組織觀測與探討 ----------------------------------------------------------------22
4-2.1.接合部位之IMC成長情形 -------------------------------------------------22
4-2.2.含鉛與無鉛錫球成分對微接點接合部位成分之探討 -----------------23
4-2.3.155℃高溫時效處理之擴散情形與IMC成長行為之探討 -----------23
4-3. BGA Pb-Sn系列與 Sn-Ag-Cu 系列相互比較---------------------------------25
4-4. Sn-Ag-Cu 系列加入Cu與Ag之功能探討------------------------------------27
4-4.1 加入Ag之功能--------------------------------------------------------------27
4-4.2 加入Cu之功能--------------------------------------------------------------27
伍.結論 ……………………………………………………………………………29
陸.參考文獻 ………………………………………………………………………31
表目錄
表一、試片分類、處理與編號說明---------------------------------------------------34
表二、含鉛系列錫球接合部化合物厚度與時效時間關係整理表---------------35
表三、含3%Ag之無鉛錫球接合部化合物厚度與時效時間關係整理表------36
表四、含1%Ag之無鉛錫球接合部化合物厚度與時效時間關係整理表------36
圖目錄
圖1、The equilibrium phase diagrams of the Ni-Sn binary system---------------37
圖2、The equilibrium phase diagrams of the Au-Ni-Sn ternary system--------- 38
圖3、The equilibrium phase diagrams of the Au-Sn binary system-------------- 39
圖4、The equilibrium phase diagrams of the Ag-Sn binary system-------------- 40
圖5、The equilibrium phase diagrams of the Cu-Ni-Sn ternary system---------41
圖6、Type A-Reflow 一次、二次之時效處理與剪斷強度關係--------------- 42
圖7、Type B、C、D-Reflow一次、二次之時效處理與剪斷強度關係------ 43
圖8、Pb-Sn系列在155℃時效處理Pad Surface的破裂行為------------------ 44
圖9、Pb-Sn系列推球後之破裂行為------------------------------------------------45
圖10、Pb-Sn系列在推球破裂面Pad Surface上Pb的分佈情形--------------46
圖11、Pb-Sn系列之接合部位成長曲線圖-----------------------------------------47
圖12、Pb-Sn系列之接合部位成分分析--------------------------------------------48
圖13、在155℃時效處理24小時內Au的擴散行為----------------------------49
圖14、在155℃時效處理Au、Ni、Sn的擴散行為-----------------------------50
圖15、在155℃時效處理Solder內Pb的擴散行為-----------------------------51
圖16、含鉛系列錫球Au在Solder的分佈情形----------------------------------52
圖17、Sn-Ag-Cu系列推球破裂面之情形 ----------------------------------------53
圖18、Sn-Ag-Cu系列顯微觀測Ag的析出物------------------------------------54
圖19、Sn-Ag-Cu系列Cross-Section顯微觀測-----------------------------------55
圖20、Sn-Ag-Cu系列之接合部位成長曲線圖-----------------------------------56
圖21、Sn-Ag-Cu系列之接合部位成分分析 -------------------------------------57
圖22、Sn-Ag-Cu系列經時效處理後Au與Cu的擴散行為 ------------------58
圖23、Sn-Ag-Cu系列經時效處理後Ni的擴散行為---------------------------59
圖24、Sn-Ag-Cu系列經時效處理後Ag的擴散行為--------------------------60
圖25、Pb-Sn系列錫球接合部位之顯微分析 -----------------------------------61
圖26、Sn-Ag-Cu系列錫球接合部位之顯微分析-------------------------------62

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