跳到主要內容

臺灣博碩士論文加值系統

(3.235.140.84) 您好!臺灣時間:2022/08/13 06:32
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

我願授權國圖
: 
twitterline
研究生:張恆碩
研究生(外文):Herng-Shuoh Jang
論文名稱:電子構裝金線接點破壞機構及顯微組織分析
論文名稱(外文):Wire bond failure Mechanism and microstructure analysis
指導教授:謝克昌
指導教授(外文):Ker-Chang Hsieh
學位類別:博士
校院名稱:國立中山大學
系所名稱:材料科學研究所
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:109
中文關鍵詞:介金屬化合物可靠度金鋁微接點顯微組織
外文關鍵詞:Au wireKirkendall voidsCu migrationintermetallicreliabilityAu4Alpeeling offcompoundwire bondPd barrierminute voidsAu5Al2
相關次數:
  • 被引用被引用:9
  • 點閱點閱:565
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
封面
壹、前言
1-1研究背景
1-2wire bond的接合方式
1-3Au-Al ball bonds接合的重要性
1-4Au-Al intermetallic的顯微組織
1-5wire bonding的參數設定
1-6電性量測
1-7wire bonding接合強度的測試
1-8添加雜質對Au-Al intermetallic的影響
1-9封裝材料對wire bonding的顯微組織影響
1-10研究方向
貳、實驗方法
2-1試片分類
2-2時效處理
2-3試片製作
2-4試片分析
參、實驗結果
3-1Wire bond參數對金鋁微接點morphology的影響
3-2封裝樹脂對金鋁微接點的影響
3-3Pure Au wire與wire中摻雜微量合金元素的差異
3-4Au wire中增加Pd對微接點處反應層的影響
3-5Al pad厚度對反應層的影響
3-6電流對微接點的影響
3-7微接點電阻隨時間之變化關係
肆、討論
4-1接合參數對微接點morphology的影響
4-2Pure Au wire與Al pad接合後之時效機制
4-3Au wire添加微量Pd元素與Al pad接合後之時效機制
4-4Au wire添加微量Cu元素與Al pad接合後之時效機制
4-5Au wire中Pd成份增加對微接點的影響
4-6Al pad厚度對微接點的影響
4-7Wire ball edge的影響
4-8封裝樹脂對morphology的影響
4-9不同電極之時效對微接點的影響
4-10電阻曲線與morphology的關係
伍、結論
陸、參考文獻
1.Sung K. Kang, "Gold-to-Aluminum Bonding for TAB Applications," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 6, pp. 998-1003, 1992.2.V. Koeninger, H. H. Uchida, and E. Fromm, "Degradation of Gold-Aluminum Ball Bonds by Aging and Contamination," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No. 4, pp. 835-841, 1995.3.Lisa Maiocco, Donna Smyer, Paul R. Munroe, and Ian Baker, "Correlation Between Electrical Resistance and Microstructure in Gold Wire Bonds on Aluminum Films," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 3, pp. 592-935, 1990. 4.Jin Onuki, Masahiro Koizumi, and Isao Araki, "Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-12, No. 4, pp. 550-555, 1987.5.T. Uno, K. Tataumi, and Y. Ohno, "Voids Formation and Reliability in Gold-Aluminum Bonding," Proceedings of the Joint ASME/JSME Advances in Electronic Packaging, Vol. 1-2, pp. 771-777, 1992.6.K. I. Johnson, M. H. Scott and D. A. Edson, "Ultrasonic Wire Welding," Solid State Technology, Part II, Ball-Wedge Wire Welding, pp. 91-95, 1977.7.T. J. Rossiter, "Ambient Effects on Gold-Aluminum Bonds," Proceedings, Annual Reliability Physics Symposium, pp. 186-190, 1970.8.Nakane et al, "Fundamental Study for Microjoining in LSI," J. High Temperature Society, Vol. 13, pp. 248-255, 1987.9.Suresh Kumar, Frank Wulff and Klaus Dittmer, " Intermetallic Growth in Small Ball Bonds, " Proc. SEMICON Singapore, Test, Assembly & Package, pp. 267-272, 1998.10.Guy V. Clatterbaugh, Joel A. Weiner, and Harry K. Charles, Jr., Senior Member, IEEE, "Gold-Aluminum Intermetallics:Ball bond shear Testing and Thin Film Reaction Couples," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-7, No. 4, pp. 349-356, 1984.11.E. Philofsky, "Intermetallic Formation in Gold-Alluminum System," Solid State Electronics, Vol. 13, pp. 1391-1399, 1970.12.Da-Yuan Shin and Peter J. Ficalora, "The Reliability of Au-Al Intermetallic Formation and Electromigration in Hydrogen Environments," IEEE Transations on Electron Devices, Vol. ED-26, No. 1, pp. 27-34, 1979.13.G. Harsanyi, "Electronchemical Processes Resulting in Migrated Short Failures in Microcircuits, " IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No. 3, 1995.14.G. Harsanyi, "Effect of Bromine in Molding Compounds on Gold-Aluminum Bonds, " IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-9. No. 4, 1986.15.R. Wayne Johnson, Michael J. Palmer, Michael J. Bozack, and Tamara Isaacs-Smith, "Thermosonic Gold Wire Bonding to Laminate Substrate with Palladium Surface Finishes," IEEE Transactions on electronics packaging manufacturing, Vol 22, No. 1, pp. 7-15, 1999.16.Jin Onuki, Masateru Suwa, Masahiro Koizumi, and Tomio Iizuka, "Investigation of Aluminum Ball Bonding Mechanism," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-10, No. 2, pp. 242-246, 1987.17.Salim, Khoury, David J. Burkhard, David P. Galloway, and Thomas A. Scharr, "A Comparison of Copper and Copper and Gold Wire Bonding on Integrated Circuit Devices," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 4, pp. 673-681, 1990.18.Kenji Toyozawa, Kazuya Fujita, Syozo Minamide, and Takamichi Maeda, "Development of Copper Wire Bonding Application Technology," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 4, pp. 667-672, 1990.19.F. J. J. van Loo, "Multiphase Difusion in Binary and Ternary Solid State Systems," Prog. Solid State Chem. Vol. 20, pp. 47-99, 1990.20.Gautam N. Shah, Lee R. Levine, and Dipak I. Patel," Advances in Wire Bonding Technology for High Lead Count, High-Density Devices", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 11, No. 3, 1988.21.J.F Graves and W. Gurany, "Reliability Effects of Fluorine Contamination of Aluminum Bonding Pads on Semiconductor Chips," Solid State Technology, pp. 227-232, 1983.22.George G. Harman, Wire Bonding in Microelectronic, second Edition.23.S. S. Ahmad, Richard C. Blish, T. J. Corbett, J. L. King, and C. G. Shirley, Member, IEEE, "Effect of Bromine in Molding Compounds on Gold-Aluminum Bonds," IEEE Transactions on Components, Hybrid, and Manufacturing Technology, Vol. CHMT-9, No. 4, 1986.24.Robert M. Murcko, Robin A. Susko, and John M. Lauffer, "Resistance Drift in Aluminum to Gold Ultrasonic Wire Bonds, " IEEE Transactions on Components, Hybrid, and Manufacturing Technology, Vol. 4, pp. 843-865, 1991.25.B. Krabbenborg, "High Current Bond Design Rules Based on Bond Pad Degradation and Fusing of The Wire," Microelectroncs Reliability, Vol. 39, pp. 77-88, 1999.26.E. Imasato, M. Araki, I. Shimizu, and Y. Ohno, " Effect of Mold on Reliability in Gold-Aluminum Bonding, " IEEE/CHMT Electronics Packaging Technology Conference, pp. 338-344, 1998.27.Raymond A. Pearson, Tom B. Lloyd, Hamid R. Azimi, Jen-Chou Hsiung, Malcolm S. Early, and Peter D. Brandenburger, "Adhesion Issues in Epoxy-Based Chip Attach Adhesives, " IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 1, 1997.28.Jin Onuki, Masahiro Koizumi, and Isao Araki, "Investigation of The Reliability of Copper Ball Bonds to Aluminum Electrodes, " IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-12, No. 4, pp. 550-555, 1987.
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top