臺灣博碩士論文加值系統

本論文首度提出一個LTCC電感元件的修正T型等效電路，此模型可預測LTCC電感元件的並聯諧振點、串聯諧振點、接地諧振點及傳輸線重複週期角頻率點，同時也提出一個LTCC電容元件之等效電路模型，其準確範圍能有效涵蓋至第二個諧振頻率點，並以一個電感及電容元件為例比較模型化與量測所得散射參數。本論文的後半部則提出一套LTCC電感及電容元件評量方法，以π等效電路為基礎可讓測試者得知其LTCC元件之性能好壞，在此以環隆電氣公司及工研院材料所所製作的LTCC元件當作評量實例。

A new modified-T equivalent-circuit model for the embedded inductors in LTCC is first introduced in this thesis. The model can predict the parallel, series, and ground resonant frequencies successfully. For the embedded capacitors in LTCC, a π-equivalent circuit that can include first two resonant frequencies has been used. One example for each model has been established to illustrate the broadband features of the models. Finally, a parameter table is given to evaluate the performance of these embedded LTCC inductors and capacitors.

目 錄
目錄I
圖表目錄II
第一章 緒論1
第二章LTCC之技術應用與元件模擬量測方法4
2.1 簡介4
2.2 LTCC製程技術及應用4
2.3 LTCC元件的量測方法9
2.4 LTCC的模擬工具12
2.5 量測與模擬結果之比較20
第三章LTCC電感及電容元件模型化31
3.1 簡介31
3.2 無損耗傳輸線之修正T型等效電路33
3.3 考慮並聯及串聯諧振點之LTCC電感元件修正T型等效電路
41
3.4 考慮更高階之串聯與接地諧振點之LTCC電感元件修正T型
等效電路43
3.5 考慮串聯及並聯諧振點之LTCC電容元件之π型等效電路46
3.6 模型化實例48
第四章LTCC電感及電容元件之改善與評量方法55
4.1 簡介55
4.2 LTCC電感元件之改善方法57
4.3 LTCC電容元件之改善方法66
4.4 LTCC電感及電容元件評量方法66
4.4.1 LTCC電感元件評量方法67
4.4.2 LTCC電容元件評量方法71
第五章結論73
參考文獻74

[1]D. I. Amey, B. E. Taylor, T. P. Mobley and L. A. Bodwell, “The Performance of High Frequency Functions using Multilayer Low Temperature Cofired Ceramic (LTCC),” IEEE MTT-S International Microwave Symposium on Workshop Notes & Short Courses, June. 2002[2]P. M. Piel, J. Estes, S. Marshall, G. Funk and A. Pavio, “Low Temperature Cofired Ceramic: An enabler of high power RF integrated amplifiers,” IEEE MTT-S International, pp. 1557-1560, June. 2002[3]J. Estes, P. Piel, G. Shapiro, A. Pavio, M. Hurst, J. Call, and G. Funk, “An Internally Matched LTCC 3G WCDMA 180 Watt LDMOS Power Amplifier,” IEEE MTT-S International, vol. 2, pp. 1357-1358, June. 2001[4]L.Kyutae, S. Pinel, M. Davis, A. Sutono, L. H. Chang, H.Deukhyoun, A. Obatoynbo, J. Laskar, E. M. Tantzeris, and R. Tummala,” RF-system-on-package (SOP) for wireless communications,” IEEE Microwave Magazine, vol. 3, pp. 88-99, Mar 2002[5]A. Sutono,D. Heo,Y.-J.E. Chen, and J. Laskar, “High-Q LTCC-based passive library for wireless system-on-package (SOP) module development,” IEEE Transactions on Microwave Theory and Techchniques, vol. 49, pp. 1715-1724, Oct. 2001 [6]D. Heo, A. Sutono, E. Chen, Y. Suh, and J. Laskar, “A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passives,” IEEE Microwave and Wireless Components Letters, vol. 11, pp. 249-251, June 2001[7]D. Heo, A. Sutono, E. Chen, E. Gebara, S. Yoo, Y. Suh, J. Laskar, E. Dalton, and E. M. Tentzeris, “A high efficiency 0.25/spl mu/m CMOS PA with LTCC multi-layer high-Q integrated passives for 2.4 GHz ISM band,” IEEE MTT-S International, vol. 2, pp. 915-918, 2001[8]S.Chakraborty, K. Lim, A. Sutono, E. Chen, S. Yoo, A. Obatoyinbo, and J. Laskar, “Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology,” 2001 Radio and Wireless Conference, pp. 117-120, 2001[9]C. H. Lee, A. Sutono, S. Han, and J. Laskar,”A compact LTCC Ku-band transmitter module with integrated filter for satellite communication applications,” IEEE MTT-S International, vol. 2, pp. 945-948, 2001[10]L. Kyutae, A. Obatoyinbo, A. Sutono, S. Chakraborty, L. H. Chang, E. Gebara, A. Raghavan, and J. Laskar,”A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology,” IEEE MTT-S International, vol. 3, pp. 1739-1742, May 2001[11]R. Lucero, A. Pavio, D. Penunuri, and J. Bost, “Design of an LTCC integrated Tri-Band Direct Conversion Receiver Front-End Module,” IEEE MTT-S International, pp.1545-1548, June 2002[12]M. D. O’Hearn, “A voltage controlled oscillator using low temperature co-fired ceramics,” Proceedings of 1996 International IEEE Frequency Control Symposium, pp. 744-748, 1996[13]L. Kyutae, A. Obatoyinbo, M. Davis, J. Laskar, and R. Tummala,” Development of planar antennas in multi-layer packages for RF-system-on-a-package applications,” IEEE Conference on Electrical Performance of Electronic Packaging, pp. 101 —104, 2001[14]S. Pinel, S. Chakraborty, M. Roellig, R. Kunze, S. Mandal, H. Liang, C-H. Lee, R. Li, K. Lim, G. White, M. Tentzeris and J. Laskar, “3D Integrated LTCC Module using μBGA technology for compact C-band RF Front-End Module,” IEEE MTT-S International, pp.1553-1556, June. 2002[15]S. Chakraborty, K. Lim, A. Sutono, E. Chen, S. Yoo, A. Obatoyinbo, S. —W. Yoon, M. Maeng, M. F. Davis, S. Pinel, and J. Laskar, “A 2.4-GHz Radio Front End in RF System-on-Package Technology,” IEEE Microwave Magazine, vol. 3, pp. 94-104, June. 2002[16]T. H. Lin, H. Sanchez, R. Rofougaran, and W. J. Kaiser, “CMOS front end components for micropower RF wireless systems,” Proceedings of IEEE 1998 International Symposium on Low Power Electronics and Design, pp. 11-15, 1998 [17]R. Rofougaran, “A Micro-Power CMOS Front-End For Embedded Wireless Devices,” Master of Science in Electrical Engineering of University of California, Los Angeles, 2000[18]K. H. Drue, H. Thust, and J. Muller, “RF models of passive LTCC components in the low Gigahertz-range,” Applied Microwave and Wireless, pp.26-35, April. 1998 [19]陳棓煌, “向量網路分析儀量測校正方法之研究與實踐,” 國立中山大學電機工程研究所碩士論文, 1996[20]郭明哲, “微帶互連元件電性測試夾具製作與向量網路分析儀量測校正技術之研發,”國立中山大學電機工程研究所碩士論文, 1998[21]黃輝祥, “應用於射頻積體電路之釘架型晶片尺寸封裝電性模型及效應評估,” 國立中山大學電機工程研究所碩士論文, 2001[22]蔡第奇, “平衡式元件之向量網路分析儀量測技術,” 國立中山大學電機工程研究所碩士論文, 2002[23]W. Blood, L. Feng, T. Kamgaing, T. Myers, and M. Petras, “Simulation, modeling, and testing embedded RF capacitors in low temperature cofired ceramic,” Proc. 51st ECTC, pp. 852-857, 2001[24]W. Blood, L. Feng, T. Myers, and M. Petras, “Library development process for embedded capacitors in LTCC,” IEEE Conference on Electrical Performance of Electronic Packaging, pp. 147-150, 2000[25]A. Sutono, A. H. Pham, J. Laskar, and W. R. Smith, ”RF/Microwave characterization of multilayer ceramic-based MCM technology,” IEEE Transactions on Advanced Packaging, vol. 22, pp. 326-331, Aug 1999[26]Sunderarajan S. Mohan, “The Design, Modeling and Optimization of On-chip Inductor and Transformer Circuits,” PhD of Electrical Engineering of Stanford University, Dec 1999[27]“LTCC Design Guideline,” Thales Microsonics Corp., http://www.thales-tmx.com/html/ltcc/ltcc1.pdf[28]J. J. Wooldridge, “High density interconnect (HDI) packaging for microwave and millimeter wave circuits,” in IEEE Aerosp. Applicat. Conf. Dig., vol. 1, pp. 369-376, Mar. 1998[29]R. Brown, “LTCC-Bringing Functional Integration to RF & Microwave Products,” National Semiconductor Corp., http://207.82.57.10/appinfo/ltcc/[30]Francisco J. Lopez-Dekker, “Three Dimensional Electromagnetic Field Simulation of Integrated Metal-Insulator-Metal Capacitors,” Master of Science in Electrical and Computer Engineering of University of California, Irvine, 1998[31]Ansoft HFSS Engineering Note, Ansoft Corporation[32]Ansoft Ensemble 8.0 Technical Notes, Ansoft Corporation[33]Ansoft Spicelink 4.5 Technical Notes, Ansoft Corporation[34]D. Cottet, J. Grzyb, M. Scheffler, G. Troster, “Experimental analysis of design options for spiral inductors integrated on low cost MCM-D substrates,” Proc. 51st ECTC, pp. 824-830, 2001