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研究生:林文郁
研究生(外文):Wen-Yu Lin
論文名稱:構裝體界面接著性能之實驗研究
論文名稱(外文):The experimental investigation of structure on interfacial-adhesive effectiveness
指導教授:錢志回
指導教授(外文):Chi-Hui Chien
學位類別:碩士
校院名稱:國立中山大學
系所名稱:機械與機電工程學系研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:80
中文關鍵詞:電子封裝界面疊紋干涉術
外文關鍵詞:IC packageinterfacemoiréinterferometry
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  • 被引用被引用:0
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  • 收藏至我的研究室書目清單書目收藏:0

本文研究方法為利用moiré干涉術來量測半導體構裝材料之界面特性,因為moiré干涉術適用於精密位移場量測,有其精確性及非接觸性檢測的優點,並可利用條紋作定性且定量的分析,所以非常適合處理具微小變形量構裝材料的量測分析。
主要目的係利用moiré干涉術對FR-4、綠漆、黑膠之界面接著位移場量測,利用moiré干涉術的U、V兩場分離出剝離應變、剪應變與拉應變,探討全域的施力狀態下應變之比例分佈,並發現轉折點等現象。


The main aim of this paper is using the moiré interferometry to measure interface of the IC package structure materials. The moiré interferometry with high sensitivity can use the fringes to measure displacement field in small structure materials.
The objective of this study is to obtain displacement fields the interfacial adhesion of the substrate and epoxy by using the moiré interferometry. The peeling strain, shearing strain and tensile strain at the interface adhesion are distinguished by utilizing the experiment of data of u-displacement fields and v-displacement field. Finally, a turning point of failure, in found.


第一章緒論…………………………………………………………1
1-1前言 ………………………………………………………1
1-2文獻回顧 …………………………………………………2
1-3本文架構 …………………………………………………5
第二章疊紋干涉術原理及數學模式建立…………………………6
2-1疊紋簡介……………………………………………………6
2-2疊紋干涉術原理……………………………………………7
2-3疊紋干涉術之數學模式……………………………………8
2-4疊紋圖像之產生與疊紋序號之判讀方法 ………………10
2-5疊紋干涉儀之架設 ………………………………………11
第三章實驗規劃與相關設備 ……………………………………18
3-1實驗規劃與步驟 …………………………………………18
3-2實驗儀器設備及用途說明 ………………………………18
3-3光學實驗設備的架設 ……………………………………23
3-4模具設計與試片製作 ……………………………………24
3-5光柵黏貼之作方法 ………………………………………25
3-6實驗注意事項 ……………………………………………26
第四章實驗過程與數據分析 ……………………………………38
4-1萬能拉伸測試機測試 ……………………………………38
4-1-1測試目的 ……………………………………………38
4-1-2萬能拉伸測試過程 …………………………………38
4-1-3萬能拉伸測試結果與討論 …………………………39
4-2封裝材料量測 ……………………………………………40
4-2-1目的 …………………………………………………40
4-2-2封裝材料量測過程 …………………………………40
4-2-3封裝材料量測結果與討論 …………………………42
第五章結果與未來展望 …………………………………………73
5-1結論 ………………………………………………………73
5-2未來展望 …………………………………………………73
參考文獻 …………………………………………………………75


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