臺灣博碩士論文加值系統

中文摘要
現今之電子產品皆走向輕、薄、短、小及多功能的趨勢，為達成此理想，在IC封裝技術上亦有相當之突破與變革，近來由於腳數一再的提升，BGA(Ball Grid Array)型態的封裝方式亦漸漸成為主流，而本文所研究之SOC(Substrate On Chip)屬於CSP中的一種封裝方式，為一裸晶產品，透過錫球(Solder Ball)與機板連接以傳遞訊號。用錫球連接可使產品體積減小，但在使用上之可靠度卻降低了，因為錫球本身有易破壞的因素，所以錫球之可靠度(Reliability)便會受到重視。
在可靠度之試驗中，最常使用的是熱循環試驗(Temperature Cycling Test，簡稱TCT)，對CSP產品來說，由構裝體(Package)與印刷電路板(PCB、PWB)之熱膨脹係數差異所產生之熱應力，皆由錫球所吸收，故最常發生破壞的位置即是在錫球與構裝體或印刷電路板間的介面。本文即是針對錫球，透過電腦分析軟體，使用混合黏塑性(Mixed-Viscoplastic)的方法模擬錫球在升溫時SOC之翹曲情形，兼顧了精確度和速度。再使用黏塑(Viscoplastic)之材料參數模擬錫球受TCT試驗之行為並選擇適當之疲勞模型(Fatigue Model)，將分析結果轉為可靠度數據，與實際實驗之可靠度數據應證，並比較其他文獻的結果之差異性。

Abstract
The study on SOC of article is one of package way for CSP. The SOC transmits messages by Solder Ball joining the board.
It can make the volume of product decrease, but the reliability reduces on using. So the reliability of Solder Ball is a very important topic for study.
The article for Solder Ball uses the Mixed-Viscoplastic way to simulate the warpage state of SOC when the temperature of Solder Ball rises by ANSYS. Then using the Viscoplastic material parameter simulates the acts by TCT experiment and checks the suitable Fatigue Model to get the analysis results turn into the reliability data. The reliability data puts to the proof with the experimental reliability data and compares differences to other documents.

目錄
第一章 緒論1
1-1 前言1
1-2 文獻回顧3
1-3 章節摘要5
第二章 理論基礎7
2-1 線性分析(LINEAR SIMULATION)7
2-2 黏塑性分析(VISCOPLASTIC SIMULATION)8
2-3 ANAND'S MODEL11
2-4 疲勞模型(FATIGUE MODEL)15
2-4-1 塑性變形疲勞模型(PLASTIC STRAIN FATIGUE MODEL)15
2-4-2 能量為基礎疲勞模型(ENERGY-BASED FATIGUE MODEL)16
2-5 長期可靠度測試18
2-6 電腦模擬與計算19
第三章 研究方法與步驟22
3-1 建立SOC分析模型22
3-2 分析參數與材料參數25
3-3 線性分析結果29
3-4 黏塑性分析38
3-4-1 求黏塑性關係式38
3-4-2 可靠度分析43
第四章 結果與討論……………………………………………………45
4-1 線性和混合黏塑性分析翹曲比較45
4-2 線性與黏塑性關係式比較46
4-3 錫球可靠度分析結果48
第五章 結論63
5-1 結論63
5-2 未來發展64
參考文獻65
圖目錄
圖1-1 SOC Package2
圖1-2 Dual Die SOC2
圖2-1 TCT升降溫曲線20
圖3-1 SOC截面尺寸(短軸方向)23
圖3-2 SOC 1/4 3D FEM Model(Iso等角圖)24
圖3-3 SOC 1/4 3D FEM Model(Left 左側視圖)……………………24
圖3-4 EMC之CTE v.s. Temperature…………………………………26
圖3-5 Solder Ball之楊氏係數 v.s. Temperature27
圖3-6 Solder Ball之熱膨脹係數 v.s. Temperature27
圖3-7 3D 1/4Model翹曲量圖(1)30
圖3-8 3D 1/4Model翹曲量圖(2)……………………………………30
圖3-9 3D 1/4 Model翹曲情形之前視圖31
圖3-10 3D 1/4 Model翹曲情形左側視圖……………………………31
圖3-11 SOC之elements都使用四面體………………………………32
圖3-12 SOC之elements使用四面體分析的翹曲情形………………33
圖3-13 3D Model之Von Mises Stress分佈情形…………………34
圖3-14 3D Modelτxy 剪力分佈圖……………………………………34
圖3-15 3D Modelτyz 剪力分佈圖……………………………………35
圖3-16 3D Modelτxz 剪力分佈圖……………………………………35
圖3-17 T vs. W的關係圖(線性)……………………………………36
圖3-18 W vs. S的關係圖(線性)……………………………………37
圖3-19 3D 1/4Model翹曲量圖(3)39
圖3-20 T vs. W的關係圖(黏塑性)…………………………………40
圖3-21 W v.s. S的關係圖(黏塑性)…………………………………40
圖3-22 T vs. W/21的關係圖(黏塑性)42
圖3-23 T vs. W/16的關係圖(黏塑性)………………………………42
圖3-24 T vs. WC的關係圖(黏塑性)43
圖3-25 循環溫度圖(2 個Cycle)44
圖4-1 線性與黏塑性之T vs. W的關係圖……………………………47
圖4-2 線性與黏塑之W vs. S的關係圖………………………………48
圖4-3 Plastic Work Energy(2Cycle)49
圖4-4 elements數目64,561個………………………………………50
圖4-5 elements數目33,462個………………………………………51
圖4-6 完成第二個循環後之應力應變圖(elements數目64,561個)51
圖4-7 完成第三個循環後之應力應變圖(elements數目33,462個)52
圖4-8 錫球之等效應力55
圖4-9 錫球之等效塑性應變…………………………………………55
圖4-10 應變隨時間之變化圖(elements數目64,561個)56
圖4-11 應變隨時間之變化圖(elements數目33,462個)…………56
圖4-12 錫球編號之位置60
圖4-13 各錫球之平均黏塑應變能量密度……………………………60
表目錄
表2-1 Anand's Model 之參數意義與單位14
表2-2 加速熱循環實驗之加速因子21
表3-1 材料性質表25
表3-2 錫球材料性質隨溫度之關係26
表3-3 Anand's Model之參數28
表4-1 翹曲量比較圖45
表4-2 各錫球之Average Viscoplastic strain energy density59
表4-3 實驗及模擬之可靠度比較62

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