臺灣博碩士論文加值系統

對任何企業而言，縮短新產品開發上市的時間，不但是獲利的要件更是攸關企業生存的工作。半導體業過去技術與產品的發展進程一直在追隨著摩爾定律的規範─每十八個月的倍增;代表這個行業的”矽週期”更在技術與成本的競逐推升中，有著越來越短促的現象。在如此激烈競爭與快速的變化中，一個半導體廠要如何因應與增加本身競爭優勢呢?
近十來年，台灣半導體業在製造技術與管理上日新月異，創造了許多奇蹟與成就，這些競爭力從何而來？一般咸信台灣半導體廠卓越的「量產能力」，卻少有人討論其中的環節與重點。本研究希望藉由探討半導體廠在新製程開發﹑移轉到量產的技術與管理，一則試圖說明這些流程的進行補遺部分資訊的不足，再則對其做較有系統的分析與探究，尋求更進一步的改善空間以為回饋。
從文獻的搜集與研讀開始，加上與相關領域人員共同展開與探究各個流程，找出主要的關鍵活動與研究範圍，再藉由失效模式效應分析針對這些活動一一檢視其原因﹑效應，以為預防再發機制的設計基礎，希望能做到全面的事前管理。有了這些方案後，將以過去發生的實際案例作進一步的比對分析，最後應用在實際工作以驗證其可行性與效用，並建立制度使未來的相關工作都能有最佳的管理，此乃本研究最大之貢獻。

Shorten the time-to-market is not only matter of profit but also an essential factor to the survival of a company. The Moor’s law — “performance double in every 18 months”, is guiding the semiconductor industry for the passing years. The “silicon cycle” is getting more and more fast in the increasing competition of technology and cost. How can a semiconductor company enact with such rapid changing environment and keeping and increasing her advantage of competition?
The IC industry in Taiwan was blooming in the past decade; all of us declare that we possessed excellent manufacturing capability. Indeed, but what are the key success factorys? This study is focus on the issues of new technology transfer and its capacity ramp up in semiconductor manufacturing factory, and tries to add related information of those details and have opportunity to improve the practice of our jobs.
The research attempts to build a management system to prevent any risk in new technology transfer and ramp up process of IC Fab. Start from the literature review and intensive interview with the domain experts, we have find out the critical path of those activities. Then, use FMEA to review and identify the cause-effect relationship so as to work out some of the feasible solutions. These alternatives will perform the feasible checking by the recorded real cases, then, put them on the line to do the further monitoring.
The major contribution of this paper is to offer a new and useful management framework of our Fab in new technology transfer and its capacity ramp up process.

第一章. 緒論.........................................................................................................1
1.1. 研究背景與動機………………………………………………….....1
1.2. 研究目的…………………………………………….…….……..... 3
1.3. 研究範圍與限制…………………………………………………..4
1.4. 研究方法與論文架構........................................................................ 7
第二章. 文獻回顧………………………………….…….…………………….…….....….9
2.1. 新產品與新製程開發的技術…………………………...............…9
2.2. 新產品開發程序的失敗與風險…………………….......................12
2.3. 新產品開發成功的衡量…………...................................................14
2.4. 新產品開發程序的建立...…............................................................15
2.5. 失效模式效應分析......................................................….................20
第三章. 新製程移轉與量產……………………………………………………......………24
3.1. 半導體廠新製程開發流程……………………………………..… 24
3.2. 新製程移轉與量產……………………………………………..... 28
3.3. FMEA用於流程管理的分析方法…....…………........................... 34
3.4建構製程移轉與量產流程管理架構…………………………..…45
3.5新的流程管理架構與運作……………………………………53
第四章. 實証研究…………………….………………………………………………….…64
4.1. 個案背景說明與分析…………………………………...................64
4.2. 案例分析與對照………………......……………………………68
4.3. 本章小結………...............……....……….…...…............................78
第五章. 研究結論與未來研究方向………………………………................………………80
5.1. 研究結論…………………………....…………………………...…80
5.2. 未來研究方向………...……………......……..……………………81
參考文獻…………………………………………….......………..............…..………………82

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