臺灣博碩士論文加值系統

摘要
奈米級金屬在應用考量上，最直接的就是作為反應的催化劑，因為金屬奈米材料具有較高的表面積與體積的比值，與不同的表面原子排列結構，在商業製程中許多的化學反應，需要使用到金屬作為反應的催化劑，如將它分散至奈米級的顆粒可以大幅地改進它的催化效率。
本論文以SDS微胞作為奈米反應器可將鈀金屬粒徑控制在3~5nm的奈米級鈀金屬粒子作為化學鍍銅的催化劑，研究將奈米級鈀金屬應用在印刷電路板鍍通孔製程可行性的研究。研究結果發現奈米級鈀金屬粒子(Pd/SDS)確實可作為化學鍍銅反應的催化劑，且催化所得的銅層在性質上與商業製程使用錫鈀膠體作為催化劑所得銅層幾乎相同。
另外使用電子顯微鏡(SEM)及原子吸收光譜(AA)比較Pd/SDS膠體與錫鈀膠體在催化能力，由於尚未找到Pd/SDS膠體適用的整孔劑，所以必須在活化後加入乾燥步驟使Pd/SDS膠體能夠吸附在FR-4基板的表面，但是乾燥步驟會使Pd/SDS膠體中過量的SDS在基板表面形成膜狀而延遲銅金屬的析出，因此初步實驗結果在相同的反應時間以錫鈀膠體活化的基板表面有較多的銅金屬析出。
嘗試從文獻、美國專利(U.S. Patent)及商業製程(包括Crimson、Neopact、Shadow)的整孔劑組成中尋找Pd/SDS膠體適用的整孔劑，由實驗結果可以知道使用Crimson製程的整孔劑，能夠在基板表面吸附最多的Pd/SDS膠體，但是Pd/SDS膠體在基板表面吸附的量約為錫鈀膠體的六分之一。經由動態光散射儀(DLS)的測量結果知道造成吸附量不足的主要原因是由於Pd/SDS膠體表面所帶負電荷低於錫鈀膠體所造成。

目錄
摘要
誌謝
目錄
圖目錄
表目錄
第一章 緒論 ……………… 1
1-1 前言…………………… 1
1-2 化學鍍銅在印刷電路板的應用…… 2
第二章 文獻回顧 …………………………… 5
2-1 奈米級金屬粒子的製備………… 5
2-2 鈀膠體在印刷電路版的應用…… 8
2-3 基板表面吸附活化層及導電層的相關研究 9
2-4 化學鍍銅的銅層性質分析的相關研究……15
2-5 研究動機………………… 17
第三章 研究方法 ………………………… 18
3-1 藥液配置……………………… 18
3-2 分析儀器及其測量原理………………… 20
3-3 實驗流程……………………… 27
3-4 製備及稀釋奈米級鈀金屬(Pd/SDS)………28
3-5 錫鈀膠體和Pd/SDS膠體催化化學鍍銅反應實驗 31
3-6 Pd/SDS膠體適用的整孔劑…………………… 34
3-7 銅層性質分析…………………………………… 42
第四章 錫鈀膠體與Pd/SDS膠體催化能力比較 …… 45
4-1 Pd/SDS膠體的製備及分析……………………… 45
4-2 鈀膠體吸附量測量…………………………… 48
4-3 催化化學鍍銅實驗……………………………… 55
4-4 乾燥對Pd/SDS膠體造成的影響……………… 57
4-5 結論……………………………………………… 60
第五章 有機鈀膠體(Pd/SDS)適用的整孔劑 ……… 61
5-1 各種整孔劑的使用結果與討論………………… 61
5-2 基板在整孔後對Pd/SDS膠體吸附性不佳的原因探討…73
第六章 銅層性質分析 …………………………… 80
6-1 掃描式電子顯微鏡(SEM)分析…………… 80
6-2 銅層X-光繞射分析…………………… … 81
6-3 銅層電阻率量測…………… 84
6-4 結論………………………… 85
第七章 結論 ………… ………………… 87
參考文獻 …………………… 90

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