跳到主要內容

臺灣博碩士論文加值系統

(3.238.252.196) 您好!臺灣時間:2022/08/13 23:18
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

我願授權國圖
: 
twitterline
研究生:謝重仁
研究生(外文):HSIEH,CHUNG-JEN
論文名稱:鈀金屬奈米粒子應用於印刷電路板無電鍍金屬層
論文名稱(外文):The application of Pd nano particles for electroless copper layer deposition in PCB
指導教授:萬其超萬其超引用關係王詠雲
學位類別:碩士
校院名稱:國立清華大學
系所名稱:化學工程學系
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
中文關鍵詞:奈米級金屬粒子化學鍍銅界達電位鈀膠體
相關次數:
  • 被引用被引用:5
  • 點閱點閱:856
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:1
摘要
奈米級金屬在應用考量上,最直接的就是作為反應的催化劑,因為金屬奈米材料具有較高的表面積與體積的比值,與不同的表面原子排列結構,在商業製程中許多的化學反應,需要使用到金屬作為反應的催化劑,如將它分散至奈米級的顆粒可以大幅地改進它的催化效率。
本論文以SDS微胞作為奈米反應器可將鈀金屬粒徑控制在3~5nm的奈米級鈀金屬粒子作為化學鍍銅的催化劑,研究將奈米級鈀金屬應用在印刷電路板鍍通孔製程可行性的研究。研究結果發現奈米級鈀金屬粒子(Pd/SDS)確實可作為化學鍍銅反應的催化劑,且催化所得的銅層在性質上與商業製程使用錫鈀膠體作為催化劑所得銅層幾乎相同。
另外使用電子顯微鏡(SEM)及原子吸收光譜(AA)比較Pd/SDS膠體與錫鈀膠體在催化能力,由於尚未找到Pd/SDS膠體適用的整孔劑,所以必須在活化後加入乾燥步驟使Pd/SDS膠體能夠吸附在FR-4基板的表面,但是乾燥步驟會使Pd/SDS膠體中過量的SDS在基板表面形成膜狀而延遲銅金屬的析出,因此初步實驗結果在相同的反應時間以錫鈀膠體活化的基板表面有較多的銅金屬析出。
嘗試從文獻、美國專利(U.S. Patent)及商業製程(包括Crimson、Neopact、Shadow)的整孔劑組成中尋找Pd/SDS膠體適用的整孔劑,由實驗結果可以知道使用Crimson製程的整孔劑,能夠在基板表面吸附最多的Pd/SDS膠體,但是Pd/SDS膠體在基板表面吸附的量約為錫鈀膠體的六分之一。經由動態光散射儀(DLS)的測量結果知道造成吸附量不足的主要原因是由於Pd/SDS膠體表面所帶負電荷低於錫鈀膠體所造成。
目錄
摘要
誌謝
目錄
圖目錄
表目錄
第一章 緒論 ……………… 1
1-1 前言…………………… 1
1-2 化學鍍銅在印刷電路板的應用…… 2
第二章 文獻回顧 …………………………… 5
2-1 奈米級金屬粒子的製備………… 5
2-2 鈀膠體在印刷電路版的應用…… 8
2-3 基板表面吸附活化層及導電層的相關研究 9
2-4 化學鍍銅的銅層性質分析的相關研究……15
2-5 研究動機………………… 17
第三章 研究方法 ………………………… 18
3-1 藥液配置……………………… 18
3-2 分析儀器及其測量原理………………… 20
3-3 實驗流程……………………… 27
3-4 製備及稀釋奈米級鈀金屬(Pd/SDS)………28
3-5 錫鈀膠體和Pd/SDS膠體催化化學鍍銅反應實驗 31
3-6 Pd/SDS膠體適用的整孔劑…………………… 34
3-7 銅層性質分析…………………………………… 42
第四章 錫鈀膠體與Pd/SDS膠體催化能力比較 …… 45
4-1 Pd/SDS膠體的製備及分析……………………… 45
4-2 鈀膠體吸附量測量…………………………… 48
4-3 催化化學鍍銅實驗……………………………… 55
4-4 乾燥對Pd/SDS膠體造成的影響……………… 57
4-5 結論……………………………………………… 60
第五章 有機鈀膠體(Pd/SDS)適用的整孔劑 ……… 61
5-1 各種整孔劑的使用結果與討論………………… 61
5-2 基板在整孔後對Pd/SDS膠體吸附性不佳的原因探討…73
第六章 銅層性質分析 …………………………… 80
6-1 掃描式電子顯微鏡(SEM)分析…………… 80
6-2 銅層X-光繞射分析…………………… … 81
6-3 銅層電阻率量測…………… 84
6-4 結論………………………… 85
第七章 結論 ………… ………………… 87
參考文獻 …………………… 90
1.張中良,“非導體表面之金屬化”,工業材料,112期(1996)86-92.
2. 洪愛娜, “化學鍍銅簡介”,電路版會刊,10期,32-36
3. R.J. Zebliski, “Novel Precious Metal Sensitizing Solutions”,U. S. Patent 3,672,938(1972).
4. 神戶德藏著;莊萬發譯著, “無電解鍍金”,復漢出版社印行,(1989).
5.V.V. Svirdow, “Electroless Metal Deposition Aqueous Solution”,Byelorussian University , Minsk , Russia,(1987).
6.Izumi Ohno, “Electrochemistry of electroless plating”,Materials Science and Engineering ,146,33(1991).
7.K.G. Mishra and R.K. Paramguru,“Kinetics and Mechanism of Electroless ”,J. Electrochem. Soc. ,143,510(1996).
8.Chien-Liang Lee,Chi-Chao Wang, and Yung-Yun Wang, “Synthesis of Metal Nanoparticles via Self-Regulated Reduction by an Alcohol Surractant”,Adv.Funct. Mater. ,11,344(2001).
9.郭清癸、黃俊傑、牟中原, “金屬奈米粒子的製造,”物理雙月刊(二十三卷六期),2001年12月
10.Bradley , J. S. , “The Chemistry of Transition Metal Colloids.In Clusters and Colloids”,Schmid G. , Ed. ,VCH Publishers : New York , NY(USA) , 1994 , p459-537
11. Mafuné F. ,Kohno J. Y. , Takeda Y. , Kondow T. , Sawabe H. , “Structure and Stability of Silver Nanoparticles in Aqueous Solution Produced by Laser Ablation”,J. Phys. Chem. B ,104,8333(2000).
12. Mafuné F. ,Kohno J. Y. , Takeda Y. , Kondow T. , Sawabe H. ,“Formation and Size Control of Silver Nanoparticles by Laser Ablation in Aqueous Solution”,J. Phys. Chem. B ,104,9111(2000).
13. Mafuné F. ,Kohno J. Y. , Takeda Y. , Kondow T. , Sawabe H. ,“Formation of Gold Nanoparticles by Laser Ablation in Aqueous Solution of Surfactant”,J. Phys. Chem. B,105,5114(2001).
14.Brust M. , Walker M. , Bethell D. , Schiffrin D. J. ,Whyman R. , “Synthesis of Thiol-derivatised Gold Nanoparticles in a Two-Phase
Liquid-Liquid System.”, J. Chem. Soc. Chem. Commun. 801 (1994). 15.Puntes V. F. , Krishnan K. M. , Alivisatos A.P. ,“Colloidal Nanocrystal
Shape and Size Control: The Case of Cobalt.”,Science,291,2115(2001).
16.Reetz M. T. ,Helbig W. , “Size-Selective Synthesis of Nanostructured Transition Metal Clusters.”,J.Am. Chem. Soc.,116,7401(1994).
17.Pileni M. P. , “Nanosized Particles Made in Colloidal Assemblies.,”Langmuir,13,3266(1997).
18.Mohamed M. B. , Ismail K. Z. , Link S. , El-Sayed M. A. “Thermal
Reshaping of Gold Nanorods in Micelles. ”, J. Phys. Chem. B, 102, 9370(1998).
19.Ohde H. , Hunt F. , Wai C. M. , “Synthesis of Silver and Copper
Nanoparticles in a Water-in-Supercirtical-Carbon Dioxide
Microemulsion, ”Chem. Mater. to be published.
20. Crooks R. M. , Zhao M. , Sun L. , Chechik V. , Yeung L. K. “Dendrimer-Encapsulated Metal Nanoparticles: Synthesis,
Characterization , and Application to Catalysis. ”, Acc. Chem. Res. , 34, 181(2001).
21.陳元慶、林淙閩,『無電銅新式槽液成份及其特性分析』,電路板資訊,
64,58(1993).
22. K. H. Dietz, “Review of ‘Direct Plate’ Processes & Assessment of the Impact on Primary Imaging of Printed Wiring Boards” ,Plat. Surf. Finish., 82, 60 (1995).
23. J. Hupe and H. Iwan, “Process for Manufacturing Through- Hole Contacting Plated Printed Circuit” ,U.S. Patent 5,145,572 (1992).
24. Miur and Seita, “Electrolytic copper plating using a reducing agent”,U.S.Patent 51,454,930(1995).
25. M. Seita and M. Kusaka, “Direct metallization on surface-modified polyimide rsine” ,Plating and Surface Finishing,83,57(1996).
26. Otsuka and Kuniaki, “Process for Manufacturing Through- Hole Contacting Plated Printed Circuit” ,U. S. Patent 5,616,230(1997).
27. A.S. Kuruganti, K.S. Chen and E.E. Kalu, “”,Electrochemical and Solid-State Letters,2,27(1999).
28.A.S. Kuruganti, K.S. Chen and E.E. Kalu, “Evaluation of a Printable Catalyst for use in Flex-Circuit and PCB Applications” , Plating and Surface Finishing,89,60(2001).
29.C.R. Shipley, “Method of Electroless Deposition on a Substrate and Catalyst Solution Therefore”,U.S. Patent 3,011,920(1961).
30.C. E. Thorn, F. Polakovic , and C. A. Mosolf (Electrochemicals,Shadow), “Composition and Process for Preparing a Non-conductive Substrate for Electroplating”,U.S. Patent 5,389,270(1995).
31. H. Meyer, R. J. Nichols, D. Schroer, and L. Stamp, “The Use of Conducting Polymers and Colloids in the Though Hole Plating of Printed Circuit Boards”, Electrochimica Acta., 39, 1325 (1994).
32.Z.H. Ma, K.L. Tan, E.T. Kang, “Electroles plating of palladium and copper on polyaniline films”, Synthetic Metals ,114,17(2000)
33.M.C. Zhang, E.T. Kang, K.G. Neoh, and K. L.Tan , “Electroless Plating of Copper and Nickel on Surface-Modified Poly(Tetrafluoroethylene) Films”, J.Electrochem. Soc. , 148,(2),71(2001)
34.K. KORDÁS, J. BÉKÉSI, R. VAJTAI, M. JAUHIANEN, J. REMES, A.UUSIMÄKI, S. LEPPÄVUORI, THOMAS F. GEORGE,and NÁNAI, “Laser-Assisted Via Hole Metallization in PCB Materials”, J. Electronic Mat. ,30,no.5,L21(2001).
35.S.Z. Chu, M. Sakairi, and H. Takahashi ,“Copper Electroless Plating at Selected Areas on Aluminum with Pulsed Nd-YAG Laser”, J. Electrochem. Soc. ,147(4),1423(2000).
36.Hiroyuki Niino and Akira Yabe , “Positively charged surface potential of polymer films after excimer laser ablation:Application to selective-area electroless plating on the ablated films”, Appl. Phys. Lett. ,60,no.21,2697(1992)
37. Hiroyuki Niino and Akira Yabe , “Excimer laser polymer ablation:formation of positively charged surfaces and its application into the metallization of polymer films”, App. Surface Sci. ,69,1(1993).
38.J. Horkans, “A TEM Study of the effect of Accelerators on Pd-Sn Colloidal Catalysts and on the Initiation of Electroless Cu Deposition on epoxy”, J. Electrochem. Soc. , 134(2),300(1987)
39.J. Kim, “Microstructure Evalution During Electroless Copper Deposition”, IBM Journal of Research and Development, 28 (6) ,697(1984).
40. Roger Palmans, Karen Maex , “ Feasibility study of electroless copper deposition for VLSI”, App. Surface Sci. ,53,345(1991).
41.M.Radoeva and B. Radoev, “Ohm resistivity of electroless copper layers as a function of their thicknesses”, J. Material Sci. ,30,2215(1995).
42.P. H. Rieger , “Electrochemistry” , 2nd edition p.82-85,Chapman & Hall One Penn Plaza(1993).
43.Straus, Martin,“Cleaner/conditioner for the direct metallization of non-conductors and printed circuit boards”, U.S. Patent 5,387,332(1995).
44.Jong-Yun Kim, Myung-Geun Song, and Jong-Duk Kim, “ Zeta Potential of Nanobubbles Generated by Ultrasonication in Aqueous Alkyl Polyglycoside Solutions”, J. Colloid Interface Sci. ,223,285(2000).
45.Kevin D. , Dobson, Alisa D. , Roddick-Lanzilotta, A. James McQuillan, “An in situ infrared spectroscopic investigation of adsorption of sodium dodecylsulfate and of cetyltrimethylammonium bromide surfactants to TiO2,ZrO2,AlO3 and Ta2O5 particle films from aqueous solution”, Vibrational Spectroscopy , 24,287(2000).
46.Soo-Jin Park and Joong-Seong Jin, “Effect of Silane Coupling Agent on Interphase and Performance of Glass Fibers/Unsaturated Polyester Composites”, J. Colloid Interface Sci. ,242,174(2001).
47.Walter G. McDonough, Joseph M. Antonucci, Joy P. Dunkers, “Interfacial shear strengths of dental resin-glass fibers by the microbond test”, Dental Mat. ,17,492(2001).
48. 王冠斐和賴山強, “膠體中物理的簡介”,物理雙月刊(二十三卷四期),2001年8月
49. 莊達人, “錫鈀膠體II”,電路版資訊,57期,46-52
50. 黃怡君, 硫化鈉對直接電鍍速率之促進作用, 碩士論文, 國立清華大學, 中華民國台灣 (2001).
51.Michael Gulla, Mills, Mass, Donald F. Foust, Scotia N. Y., Geogre K. Philipose, Waitman, Mass. , “Electroplating process”, U.S. Patent 4,810,333(1987).
52.Holzman, Abrahm M., Relis, Joseph, “Composition for the electrolytic coating of circuit boards without an electroless metal coating”, U.S. Patent 4,891,069(1990).
53.Morrissey, Denis M., Takach , Peter E., Zeblisky, Rudolph J., “Method for electroplating non-metallic surfaces”, U.S. Patent 4,683,036(1987)
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top