臺灣博碩士論文加值系統

本研究主要是以理論及數值分析探討覆晶封裝的點膠式底部填膠(Dispensing Process for Flip Chip Underfill)過程中，封膠(Encapsulant)表面張力及封膠和基板、錫球間接觸角變化(Dynamic Contact Angle)對流動的影響。利用建立在三維共位體心有限體積法(Collocated Cell-Centered Finite Volume Method)下的計算流程，計算充填過程中的流場，預測波前的形狀及位置。
由於點膠式底部填膠係利用表面張力造成的毛細作用來促使封膠充填晶片底部，因此必須準確的計算表面張力以及封膠在牆壁面上的附著力。本研究使用連續表面力模式(Continuum surface force model，CSF model)來計算封膠表面張力，並導入Hoffman動態接觸角模式，計算封膠和基板、封膠和錫球之間接觸角的動態變化，以準確估算封膠在牆壁面上的附著力大小。
以往對於底部填膠流動的研究，多忽略封膠的動態接觸角以及錫球在厚度方向對於流動的影響，本研究藉由設定不同的動態接觸角模式參數，發覺封膠的接觸角變化影響充填時間甚鉅，並進一步對錫球牆面設定不同的接觸角，發覺錫球的存在會同時影響充填時間和充填圖形，因此動態接觸角和錫球的影響不可忽略。藉由設定適當的模式參數與牆壁面條件，本研究已可準確地模擬底部填膠過程。

中文摘要 I
Abstract II
目錄 III
圖目錄 VI
表目錄 IX
重要名詞中英對照 X
第一章、緒論 1
1-1研究目的 1
1-2覆晶封裝簡介 3
1-3底部填膠 5
1-3-1底部填膠的功能 5
1-3-2封膠的材料特性 6
1-3-3底部填膠的方法 9
1-4表面張力、接觸角和潤濕 10
1-4-1表面張力 10
1-4-2接觸角和潤濕 11
第二章、文獻回顧 13
2-1覆晶封裝文獻回顧 13
2-2硬化反應動力模式 14
2-3熱固性樹脂黏度模式 16
2-4表面張力 21
2-4-1平衡狀態下的表面張力關係 21
2-4-2動態下的表面張力關係 23
2-4-3 Hoffman模式簡介 27
2-4-4連續表面力模式 30
2-5共位體心有限體積法 30
第三章、底部填膠的理論架構 32
3-1基本假設與簡化 32
3-2統御方程式 33
3-3反應動力方程式 34
3-4表面張力模式 34
3-5動態接觸角模式 35
第四章、數值方法 36
4-1統御方程式的離散 36
4-1-1動量方程式的離散 36
4-1-2連續方程式的離散 38
4-1-3能量方程式的離散 38
4-1-4體積分率輸送方程式的離散 39
4-2反應動力方程式的離散 39
4-3表面張力方程式的離散 40
4-5動態接觸角模式的參數計算 44
4-6初始條件與邊界條件之設定 47
4-7 SIMPLE去耦合疊代法 48
4-8計算流程 50
第五章、結果與討論 52
5-1晶片幾何與計算網格 52
5-2材料參數及製程參數 55
5-3固定接觸角的模擬結果 56
5-4動態接觸角的影響 61
5-5錫球對於流動的影響 65
5-6點膠速度對於流動的影響 73
第六章、結論與展望 78
參考文獻 80

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