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研究生:許勝允
論文名稱:Sn-3Ag-X無鉛焊錫與鐵鎳42合金界面反應研究
論文名稱(外文):A study of the interface of Sn-3ag-X lead-free solder and Ni-Fe alloy
指導教授:張士欽
學位類別:碩士
校院名稱:國立清華大學
系所名稱:材料科學工程學系
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:英文
論文頁數:86
中文關鍵詞:無鉛焊錫草葉相介金屬相
外文關鍵詞:lead-free solderSFL phaseintermetallic phase
相關次數:
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本研究討論Sn-3Ag-X 無鉛焊錫與42合金反應在界面處所產生的介金屬相。Sn-3Ag-0.5Cu 的商用無鉛
焊錫在研究當中也用來討論與比較。藉由特殊的斜磨後黏掀技術 (taper grinding and bound opening
technique) 可露出界面平面而對其上所生成之介金屬化合物做觀察。
藉由鋅的添加,可以細化Sn-Ag合金的微結構,使其更為細緻均勻。添加了 1 %鋅的合金擁有接近常數
的熔點, 217 ℃, 也具備相當良好的腐蝕抗性。
在Sn-3Ag-1Zn焊錫與42合金反應的界面上,發現了三種介金屬相。草葉相(sweet flag leaf
phase)SFL phase,柱狀相,立方相。草葉相具有很長、很窄、很薄的外觀,均勻的分布在界面平面上。經由
60分鐘的長時間回焊,草葉相的長度長度最大可達約200μm。柱狀相與立方相的量比起草葉相少了許多。
在Sn-3Ag-0.5Cu焊錫與42合金反應的界面上,發現了兩種介金屬相,分別是草葉相與塊狀相。
在Sn-3Ag-1Zn與42合金反應所產生的三種介金屬相經由鑑定分析的結果均為Ni3Sn4。Sn-3Ag-0.5Cu焊
錫與42合金反應所產生的草葉相也是Ni3Sn4。在柱狀相的分析結果當中,其鐵元素的含量比起其他兩種相
略高。其原因可能是在柱狀相形成的過程中,必須突破FeSn2層而長出,因此會帶有微量的鐵元素。
在剝離測試的機械性質實驗當中,Sn-3Ag-1Zn焊錫試片可得到最良好的機械性質。其強度比
Sn-3Ag-0.5Cu與Sn-3.5Ag的焊錫試片高出35~50 %。而試片的破壞均由焊錫部份開始發生。

Lead-free Sn-3 Ag-x Zn solders and the intermetallic phases in the interface between Sn-3 Ag- 1 Zn solder and Alloy 42 were investigated in this study. The interface between the commercial Sn-3 Ag-0.5 Cu solder and Alloy 42 is also investigated and compared. By a technique of bond opening after taper grinding, the interface between solders and substrate could be observed.
With the addition of zinc, the microstructure of Sn-Ag alloy is refined and becomes more uniform. The 1 % Zn-containing alloy has a nearly constant melting point at 217°C and exhibits the best corrosion resistance among the solder alloys studied in this work.
On the interface of the Sn-3 Ag-1 Zn solder and Alloy 42, the most noticeable feature is the very long, narrow and thin sweet flag leaf (SFL) particles that densely scattered in a single layer on the interface plane. With a long reflow time of 60 minutes, the SFL particles can grow to a length of about 200μm with a width of several micrometers. There are also some column and cubic shaped phases on the interface, but they are in very small quantity.
On the interface between Sn-3 Ag-0.5 Cu solder and Alloy 42, there are SFL phases lying on the interface and a few lump phases among the SFL phases. Similar to the cubic phase in the Sn-3 Ag-1 Zn/ Alloy 42 interface, they are in small quantity compared to SFL particles.
The three intermetallic phases on the interface of Sn-3 Ag-1 Zn solder and Alloy 42 were identified as Ni3Sn4 by EPMA analysis and X-ray diffraction. The SFL particles on the interface of Sn-3 Ag-0.5 Cu solder and Alloy 42 were also identified as Ni3Sn4. In comparison, the iron concentration of column phase was a little bit higher than the other two phases. The formation of column phase was probably influenced by the flaws on the continuous FeSn2 layer of the interface.
The mechanical properties of soldered specimens were investigated in this study by peel test. The addition of zinc effectively enhances the strength of Sn-Ag alloy. The peak loads of Sn-3 Ag-1 Zn solder joints were 35~50 % higher than that of Sn-3 Ag-0.5 Cu and Sn-3.5 Ag. All the fractures are in the solder region and the strength of the solder joints increases with the decrease in the thickness of solder region.

TABLE OF CONTENTS
ABSTRACT i
ACKNOWLEDGEMENT iii
TABLE OF CONTENTS iv
I INTRODUCTION 1
II LITERCTURE REVIEW 3
Ⅱ-1. Lead-free Solders 3
Ⅱ-2. Wetting characteristics 4
Ⅱ-3. Adhesion strength test 6
Ⅲ EXPERIMENTAL PROCEDURES 9
Ⅲ-1. Materials 9
Ⅲ-2. Melting Point Measurement 10
Ⅲ-3. Potentiodynamic Polarization Curves 10
Ⅲ-4. Soldering 11
Ⅲ-5. Microstructure Analysis and Intermetallic Phase Identification 11
Ⅲ-6. The Peel Test 12
Ⅳ. RESULTS AND DISCUSSION 14
IV-1. Melting Point Analysis 14
IV-2. The Fluxes for Sn-Ag-Zn Solder 14
IV-3. Potentiodynamic Polarization Curves 15
IV-4. The Cross Section View and Microstructure Analysis 16
IV-5. The Intermetallic Compounds Observed on the Interface Plane 18
IV-6. The Identification of the Interfacial Phases 20
IV-7. The Growth of SFL Phase 21
IV-8. Mechanical properties 22
V. CONCLUSION 24
VI. REFERENCES 26
FIGURE 29
TABLE 80
APPENDIX 83

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