臺灣博碩士論文加值系統

本論文共分三個部分：第一個部分探討不同的黏著層包括鈦(Ti)及鉭(Ta)對於鉭酸鍶鉍(SBT)薄膜的微結構以及鐵電特性的影響。實驗後發現若是以Ti作為黏著層，沈積在上面的鉑(Pt)底電極會有較粗糙的顯微結構，且Ti原子會擴散至Pt底電極表面生成二次相，導致最後的SBT薄膜鐵電特性比較差。另一方面，以Ta為黏著層的SBT薄膜則是會有比較好的顯微結構以及鐵電特性。
本文的第二個部分是延伸第一個部分的結論：由於黏著層原子的擴散導致薄膜顯微結構與鐵電特性的變化。為了更進一步探討擴散原子的影響，加入Ta晶種層(seeding layer)於Pt底電極之上SBT鐵電薄膜之下來模擬擴散原子所造成的影響。實驗結果顯示加入晶種層的厚度會影響之後微結構及鐵電特性的表現，某一定厚度的晶種層會具有最好的效果。
本文最後一個部分會利用液態源霧化沈積系統(LSMCD)來沈積SBT薄膜，探討SBT鐵電薄膜厚度與鐵電性質之間的關係。在一定的退火溫度下，SBT薄膜厚度太小或太大都會影響結晶特性及鐵電特性，只有在特定範圍的厚度才具有最佳的結果，而且相較於溶凝膠(Sol-Gel)法，LSMCD沈積之SBT薄膜具有更佳的鐵電特性。

目錄
第一章 緒論……………………………………………………..1
第二章 文獻回顧………………………………………………..3
2-1鐵電材料及其極化特性……………………………………3
2-1-1 鐵電材料簡介…………………………………………..3
2-1-2 極化機制……………………………………………….4
2-1-3 鐵電特性………………………………………………..5
2-2 鐵電薄膜之製作與發展……………………………………7
2-3 鐵電薄膜於記憶體元件上的應用…………………………8
2-4 溶凝膠法(Sol-Gel process)鍍膜………………………..…10
2-5 液態源霧化沈積法(LSMCD)鍍膜……………………..…14
2-6 SBT鐵電薄膜之相變化…………………………….……..15
2-7 鐵電薄膜文獻中有關晶種層的已有研究………………..15
2-7-1 PZT相關的研究………………………………………..15
2-7-2 SBT相關的研究……………………………………….17
第三章 實驗程序……………………………………………….26
3-1 基板之準備………………………………………………..26
3-1-1 擴散阻絕層及黏著層的製備………………………….26
3-1-2 白金底電極的製備…………………………………….27
3-2 晶種層的製備……………………………………………..28
3-3 SBT鐵電薄膜製備………………………………………...28
3-3-1 SBT溶液之TG/DTA分析…………………………….28
3-3-2 以溶凝膠法製備SBT薄膜……………………………29
3-3-3 以液態源霧化沈積法製備SBT薄膜…………………30
3-4 薄膜性質之量測分析……………………………………..31
3-4-1 電性量測……………………………………………….31
3-4-2 物性分析……………………………………………….33
第四章 結果與討論…………………………………………….44
4-1 鈦或鉭黏著層對於以溶凝膠法製備之鉭酸鍶鉍薄膜性質的影響……………………………………………………...44
4-1-1 實驗流程……………………………………………….44
4-1-2 Pt/Ti與Pt/Ta基板之特性分析…………………………45
4-1-3 鉭酸鍶鉍薄膜之結晶結構與表面形貌……………….46
4-1-4 鐵電特性……………………………………………….48
4-1-5 鉭與鈦原子向外擴散的影響………………………….50
4-1-6 結論…………………………………………………….52
4-2 Ta晶種層使用於溶凝膠法SBT鐵電薄膜………………..53
4-2-1 實驗流程……………………………………………….53
4-2-2 Ta晶種層對於SBT薄膜結晶的影響…………………54
4-2-3 Ta晶種層對於SBT薄膜表面形貌的影響…………….54
4-2-4 Ta晶種層對於SBT薄膜鐵電特性的影響……………55
4-2-5 不同厚度晶種層SBT薄膜之縱深成分分析…………56
4-2-6 電性分析……………………………………………….56
4-2-7 低溫退火下Ta晶種層對於SBT薄膜的影響………..57
4-2-8 結論…………………………………………………….58
4-3 液態源霧化沈積法(LSMCD)鍍製SBT薄膜…………….60
4-3-1 實驗流程……………………………………………….60
4-3-2 結晶特性……………………………………………….60
4-3-3 顯微結構……………………………………………….61
4-3-4 鐵電特性……………………………………………….61
4-3-5漏電流特性……………………………………………..62
4-3-6 液態源霧化沈積法與溶凝膠法旋鍍之SBT薄膜比
較 ……………………………………………………..62
4-3-7 結論…………………………………………………….63
第五章 結論………………………………………………………….96
參考文獻………………………………………………………...99

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