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研究生:江若帆
研究生(外文):Ruo-Fan Jiang
論文名稱:垂直式記錄媒體中軟磁底層材料FeTaCN之研究
論文名稱(外文):Novel Sof Magnetic Underlayer Materials FeTaCN for Perpendicular Media
指導教授:賴志煌
指導教授(外文):Chih-Huang Lai
學位類別:碩士
校院名稱:國立清華大學
系所名稱:材料科學工程學系
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:116
中文關鍵詞:軟磁底層垂直式記錄媒體
外文關鍵詞:soft underlayerperpendicular media
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此論文主要是在探討製程條件的調整與設計以及後退火處理對直流磁控濺鍍(DC Magnetron Sputtering)軟磁底層(soft magnetic underlayer)薄膜FeTaC,材料結構與特性、粗糙度、應力行為與磁性質之影響;並觀察藉由硬磁材料(hard magnetic material)或反鐵磁材料(antiferromagnetic material)所提供的偏壓場(biasing field),對軟磁底層磁區(magnetic domain)結構造成的作用,評估對於超高記錄密度垂直式記錄媒體(Perpendicular Recording Media)之貢獻。
在軟磁底層方面,我們藉由在鍍製FeTaC的同時於Ar的工作氣氛下通入適量的N2做反應式濺鍍,成功地在初鍍膜狀態下得到同時具有高飽和磁化量(Ms〜1300 emu/c.c)與絕佳軟磁性質(Hc〜1 Oe、
S〜1)之FeTaCN薄膜;而優異的熱穩定性、平整的表面(Rms<1 nm)、極小的磁致伸縮量(λs〜0)與足夠大的電阻率(140<ρ<220),將使得FeTaCN成為最具潛力應用於垂直式記錄硬碟之軟磁底層材料。
在 軟磁底層/偏壓層 系統中,藉由製程參數的調整與膜層結構的設計,有效地使FeTaCN(2000 A°)之磁區受到足夠大的偏壓場並於難軸(hard axis)產生可逆的coherent rotation;同時觀察經偏壓軟磁底層之磁區結構,的確如文獻上所報告,形成單一磁區(single domain)的狀態,預期這樣的機制能符合減少垂直式記錄媒體中軟磁底層因讀寫過程外加磁場產生磁區壁移動的現象,達到降低spike noise的目的。

The purpose of this thesis is focused on the soft magnetic underlayer materials FeTaC. The material properties, microstructure, roughness, strerss behavior and magnetic properties were investigated under different processing parameters of DC magnetron sputtering; The effects of biasing field offered from hard magnetic material and antiferromagnetic material on the magnetic domain structure in soft magnetic underlayer. And estimate the feasibility of soft underlayer/pinning system in future ultrahigh density perpendicular recording media.
FeTaCN films were synthesized by reactive sputtering with various ratio of N2 in Ar atmosphere, which exhibit high saturation magnetization (~1300emu/cc), low coercivity (1.4 Oe), excellent thermal stability, smooth surface roughness(Rms<1 nm), small magnetostriction(λS ~ 0)and sufficient large resistivity(140<ρ<220) in as-deposited state, is a strong candidate for soft magnetic underlayer materials in perpendicular recording media.
Biasing field from hard magnetic materials and antiferromagnetic materials, novel soft magnetic underlayer material FeTaCN were effectively biased and came into existence of coherent rotation in hard axis. We also observed the single magnetic domain structure in biased soft magnetic underlayer, anticipating this soft underlayer/pinning system can successfully reduce spike noise in perpendicular recording media that due to domain wall motion in soft magnetic underlayer.

中文摘要………………………………………………………...…..Ⅰ
英文摘要…………………………………………………………….Ⅱ
誌謝………………………………………………………………….Ⅲ
目錄………………………………………………………….………Ⅳ
圖目錄…………………………………………………………...…..Ⅷ
表目錄……………………………………………………………….ⅩⅣ
第一章、序論………………………………………………1
第二章、文獻回顧與原理…………………………………2
2-1 垂直式記錄媒體………………………………………...2
2-2 高飽和磁化量軟磁底層材料FeTaC………………………....15
2-3 薄膜應力………………………………………………………26
2-3.1 本質應力研究發展情形……………………………………26
2-3.2 應力模型……………………………………………………27
2-3.2(a) 張應力…………………………………………………..27
2-3.2(b) 壓應力…………………………………………………..28
2-3.3 製程參數與本質應力之關係………………………………29
2-3.3(a) 濺鍍工作氣壓對薄膜本質應力之影響………………29
2-3.3(b) 基板偏壓對薄膜本質應力之影響……………………30
2-3.3(c) 靶材與氣體分子之重量比對薄膜本質應力之影響…30
2-3.3(d) 鍍膜溫度對薄膜本質應力之影響……………………30
第三章、實驗設備與分析儀器……………………………31
3-1 製程設備(五靶濺鍍系統)……………………………………31
3-2 薄膜厚度量測(α-step)……………………………………..35
3-3 薄膜磁光及磁性質量測………………………………………36
3-3.1 磁光柯爾效應儀(MOKE)……………………………….36
3-3.2 樣品振盪磁測儀(VSM)…………………………………38
3-4 X光薄膜分析技術 …………………………………………..39
3-4.1 θ/2θ scan………………………………………………...39
3-5 原子力顯微鏡薄膜粗糙度觀察(AFM)………………………...41
3-5.1 Tapping mode-AFM………………………………………….42
3-6 穿透式電子顯微鏡(TEM)……………………………………...43
3-6.1 電子束與樣品作用……………………………………….....43
3-6.2 電子顯微鏡系統………………………………………...…..46
3-7 歐傑電子能譜儀分析(AES)……………………………….…..48
3-8 薄膜應力量測儀(bending beam)……………………….……49
第四章、實驗步驟………………………………………….55
4-1 實驗流程……………………………………………………….55
4-1.1 濺鍍系統的準備……………………………………………...56
4-1.2 真空腔抽氣…………………………………………………….58
4-1.3 FeTaC(FeTaCN)軟磁底層薄膜成長………………………..58
4-2 FeTaC(FeTaCN)軟磁底層薄膜之製程條件參數設定………..59
第五章、結果與討論…………………………………….....60
5-1 FeTaC…………………………………………………………..60
5-1.1 初鍍膜FeTaC軟磁底層薄膜結構鑑定…………………….60
5-1.2 初鍍膜FeTaC軟磁底層表面形貌觀察…………………….62
5-1.3 初鍍膜FeTaC軟磁底層磁性質量測分析………………….64
5-1.4 經後退火處理之FeTaC軟磁底層磁性質量測分析……….66
5-1.5 經後退火處理之FeTaC軟磁底層結構鑑定……………….68
5-2 FeTaCN………………………………………………………...69
5-2.1 初鍍膜FeTaCN軟磁底層薄膜磁性質量測分析…………..70
5-2.2 初鍍膜FeTaCN軟磁底層薄膜結構鑑定…………………..76
5-2.3 初鍍膜FeTaCN軟磁底層表面形貌觀察…………………..81
5-2.4 經後退火處理之FeTaCN軟磁底層磁性質量測分析……..83
5-2.5 FeTaCN軟磁底層本質應力量測分析……………………...86
5-2.6 FeTaCN軟磁底層電阻率量測分析………………………...92
5-3 Soft Magnetic Underlayer/Pinning Layer System……………..93
5-3.1 NiFe/CoSm & NiFe/FeMn system…………………………...93
5-3.2 FeTaCN/IrMn system………………………………………...96
5-3.3 laminated FeTaCN/IrMn system…………………………….101
第六章、結論……………………………………………….103
參考文獻…………………………………………………….105

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