臺灣博碩士論文加值系統

本研究成功地發展出一套有效的熱傳分析軟體，來探討多個熱源貼附在結合三維熱擴散介質與散熱座之散熱裝置上的熱傳特性。文中探討的熱傳特性包括：散熱座在自然對流或強制對流下之熱傳係數、散熱鰭片之效率、接合面之接觸熱阻、熱輻射、三維熱擴散介質表面上之局部溫度分佈和彩色等溫圖、三維熱擴散介質與散熱座組合之總熱阻。另外，本文亦作一系列相關的參數研究。相關的參數和條件包括：熱源之尺寸和散熱量、熱擴散介質和散熱座之尺寸和材質、散熱座之對流型式、熱擴散介質和散熱座間之接觸情況。最後，文中再探討兩個具有多個熱源的例子，來印證本研究所發展出的熱傳分析軟體之優越性。

An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performance investigated includes the heat transfer coefficient of natural or forced convection from heat sink to the ambient, fin efficiency, interfacial contact resistance, thermal radiation conductance, local temperature distributions and isotherms on heat spreader surfaces; and overall resistance of heat spreader/sink assembly. Besides, a series of parametric studies have been performed. The parameters and conditions explored include the size and heat dissipation rate of heat sources, size and material of heat spreaders and heat sinks, type of convection in heat sink, and contact conditions between heat spreader and heat sink. The superiority of the developed thermal analyzer through two sample cases having multi-discrete heat sources has finally been demonstrated.

ABSTRACT
ACKNOWLEDGEMENTS
LIST OF TABLES
LIST OF FIGURES
NOMENCLATURE
CHAPTER1 INTRODUCTION AND BACKGROUND
1.1 RATIONALE
1.2 LITERATURE REVIEW 1.2.1 Heat Spreader 1.2.2 Heat Sink 1.2.3 Contact Resistance
1.3 RESEARCH OBJECTIVES
1.4 THESIS ORGANIZATION
CHAPTER2 DEVELOPMENT OF THERMAL ANALYZER
2.1 THERMAL ANALYSIS OF 3-D HEAT SPREADER WITH DISCRETE HEAT SOURCES
2.1.1 Model Definition and Assumptions
2.1.2 Governing Equations and Associated Boundary Conditions
2.1.3 Temperature Distribution
2.2 THERMAL PERFORMANCE OF HEAT SINKS
2.2.1 Heat Convection
(A) Natural Convection Heat Transfer
(B) Forced Convection Heat Transfer
(C) Fin Efficiency
(D) Effective Heat Transfer Coefficient
(E) Useful Thermal Correction Factors in Heat Sink Design
2.2.2 Thermal Radiation
2.3 THERMAL EVALUATION OF INTERFACIAL CONTACT RESISTANCE
2.3.1 Definition of Interfacial Thermal Contact Resistance
2.3.2 Parameters Influencing Thermal Contact Resistance
2.3.3 Correlations for Interfacial Thermal Contact Resistance
2.4 PROCEDURE OF PERFORMING THERMAL ANALYSIS FOR 3-D HEAT SPREADER INTEGRATED WITH HEAT SINK
CHAPTER3 RESULTS AND DISCUSSION
3.1 PROGRAM VALIDATION
3.2 PARAMETRIC STUDIES
3.2.1 Size of Heat Source
3.2.2 Power of Heating Load
3.2.3 Type of Heat Spreader Material
3.2.4 Structure of Heat Sink
3.2.5 Convection Type in Heat Sink
3.2.6 Radiative Emissivity of Heat Sink
3.2.7 Contact Pressure Between Heat Spreader and Heat Sink
3.3 APPLICATIONS
3.3.1 Sample Problem (Ⅰ) 3.3.2 Sample Problem (Ⅱ)
CHAPTER4 CONCLUSIONS AND RECOMMENDATIONS
4.1 CONCLUSIONS
4.2 RECOMMENDATIONS
REFERENCES
APPENDIX A
APPENDIX B

Aihara, T., 1963, "Heat Transfer due to Natural Convection from Parallel Vertical Plates," JSME Trans., Vol.29, No.201, pp.903-909.
Antonetti, V. W., Whittle, T. D., and Simons, R. E., 1993, "An Approximate Thermal Contact Conductance Correlation," ASME Journal of Electronic Packaging, Vol.115, pp.131-134.
Antonetti, V. W., and Yovanovich, M. M., 1984, "Thermal Contact Resistance in Microelectronic Equipment," Thermal Management Concepts in Microelectronic Packaging from Component to System, ISHM Technical Monograph Series 6984-003, pp.135-151.
Antonetti, V. W., and Yovanovich, M. M., 1985, "Enhancement of Thermal Contact Conductance by Metallic Coatings: Theory and Experiment," ASME Journal of Heat Transfer, Vol.107, pp.513-519.
Chen, W. H., Cheng, H. C., and Shen, H. A., 2001, "On Effective Thermal Characterization of Electronic Packaging," IPACK2001-15836, Proceedings of InterPACK’01, InterPACK 2001, Kauai, Hawaii, USA, July 8-13.
Chun, Y. H., 1993, "A Theoretical Study on Cold-Plate Performance with Arbitrary Heating Loads," Master's Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Ellison, G. N., 1973, "The Effect of Some Composite Structures on the Thermal Resistance of Substrates and Integrated Circuit Chips," IEEE Transactions on Parts, Hybrids, and Packaging, Vol.ED-20, No.3, pp.233-238.
Ellison, G. N., 1976, "The Thermal Design of an LSI Single-Chip Package," IEEE Transactions on Parts, Hybrids, and Packaging, Vol.PHP-12, No.4, pp.371- 378.
Ellison, G. N., 1979, "Generalized Computations of the Gray Body Shape Factor for Thermal Radiation from a Rectangular U-channel," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.CHMT-2, No.4, pp.517-522.
Ellison, G. N., 1984/1989, Thermal Computations for Electronic Equipment, 1st/2nd Edition, Van Nostrand Reinhold Corporation, New York.
Gooding, J. S., Jaeger, R. C., Mackowski, D. W., Fahrner, C. J., and Hingorani, S., 1994, "Optimal Sizing of Planar Thermal Spreaders," ASME Journal of Heat Transfer, Vol.116, pp.296-301
Ishizuka, M., Yokono, Y., and Hisano, K., 1999, "Experimental Study on the Performance of Compact Heat Sink for LSI Packages," ASME Advances in Electronic Packaging, EEP-Vol.26-1, pp.713-718.
Jones, C. D., and Smith, L. F., 1970, "Optimum Arrangement of Rectangular Fins on Horizontal Surfaces for Free-Convection Heat Transfer," ASME Journal of Heat Transfer, Vol.92, pp.6-10.
Knight, R. W., and Gooding, J. S., 1991, "Optimal Thermal Design of Forced Convection Heat Sinks-Analytical," ASME Journal of Electronic Packaging, Vol.113, pp.313-321.
Kraus, A. D., 1982, Analysis and Evaluation of Extended Surface Thermal Systems, Hemisphere Publishing Corporation, New York.
Kraus, A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Corporation, Washington.
Kraus, A. D., and Bar-Cohen, A., 1995, Design and Analysis of Heat Sinks, John Wiley & Sons, Inc., New York.
Lam, T. T., and Fischer, W. D., 1999, "Thermal Resistance in Rectangular Orthotropic Heat Spreaders," ASME Advances in Electronic Packaging, EEP-Vol.26-1, pp.891-898.
Lam, T. T., Santiago, J. G., and Fischer, W. D., 1997, "Minimum Thermal Resistance of a Convectively Cooled Orthotropic Plate with a Uniform Heat Flux," ASME Advances in Electronic Packaging, EEP-Vol.19-2, pp.1947-1953.
Lee, C. C., and Palisoc, A. L., 1988, "Real-Time Thermal Design of Integrated Circuit Devices," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.11, No.4, pp.485-492.
Ling, F. F., 1958, "On Asperity Distributions of Metallic Surfaces," Journal of Applied Physics, Vol.29, No.8, Aug.
Peterson, G. P., and Fletcher, L. S., 1988, "Evaluation of Thermal Contact Conductance Between Mold Compound and Heat Spreader Materials," ASME Journal of Heat Transfer, Vol.110, pp.996-998.
Sarvar, F., Whalley, D. C., and Low, M. K., 2001, "IGBT Package Design for High Power Aircraft Electronic Systems," ASME Journal of Electronic Packaging, Vol.123, pp.338-343.
Schneider, G. E., Yovanovich, M. M., and Cane, R. L. D., 1980, "Thermal Resistance of a Convectively Cooled Plate with Non-uniform Applied Flux," Journal of Spacecraft and Rockets, Vol.17, No.4, pp.372-376.
Scott, A. W., 1974, Cooling of Electronic Equipment, John Wiley & Sons, Inc., New York.
Stevenson, P. F., Peterson, G. P., and Fletcher, L. S., 1989, "Thermal Rectification in Similar and Dissimilar Metal Contacts," ASME Winter Annual Meeting, San Francisco, CA, Dec.
Toh, K. C., and Ng, K. K., 1997, "Thermal Contact Conductance of Typical Interfaces in Electronic Packages under Low Contact Pressures," IEEE/CPMT Electronic Packaging Technology Conference, pp.130-135.
Van De Pol, D. W., and Tierney, J. K., 1974, "Free Convection Heat Transfer from Vertical Fin-Arrays," IEEE Transactions on Parts, Hybrids, and Packaging, Vol. PHP-10, No.4, Dec.1974, pp.267-271.
Wang, L. S., 1995, "Computer-Aided Design for Multi-Layer Cold Plates," Master's Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Welch, J. W., and Lam, T. T., 1997, "Minimum Thermal Resistance of a Convectively Cooled Isotropic Plate with Non-uniform Heat Flux," ASME Advances in Electronic Packaging, EEP-Vol.19-2, pp.1933-1939.
Welch, J. W., Lam, T. T., and Yeung, W. K., 1999, "Optimal Sizing of Rectangular Isotropic Thermal Spreaders," ASME Advances in Electronic Packaging, Vol.26-1, pp.883-889.
Welch, J. W., 2001, "Numerical Approach to Optimal Sizing of Rectangular Isotropic Thermal Spreaders," IPACK2001-15507, Proceedings of InterPACK’01, InterPACK 2001, Kauai, Hawaii, USA, July 8-13.
Ye, Q. L., 2001, "Multi-media Thermal CAD Package for Electronics Multi-layer Structures with Compact Cold Plates," Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Yeung, W. K., and Lam, T. T., 2001, "Optimal Design of Three-Dimensional Orthotropic Substrates," IPACK2001-15675, Proceedings of InterPACK’01, InterPACK 2001, Kauai, Hawaii, USA, July 8-13.
Yovanovich, M. M., 1991, "Theory and Applications of Constriction and Spreading Resistance Concepts for Microelectronic Thermal Management," Cooling Techniques for Computers, Editor Win Aung, Hemisphere Publishing Corporation, pp.277-332.