臺灣博碩士論文加值系統

近年來半導體隨著電腦與光電通訊等產品功能的急速提昇及多元化、可攜性與輕巧化的需求，其電子構裝已脫離了傳統的技術而朝高功率、高密度、輕、薄與微小化等高精密度製程發展。而晶片尺寸級封裝、覆晶與晶圓級封裝正符合此一趨勢要求，因此已逐漸成為下一世代之封裝主流。然晶圓級封裝目前只適用於尺寸小之晶片，因為大尺寸晶片仍有可靠度之問題待需克服。
為了解決上述之問題，本文將針對一新式晶圓級封裝結構設計進行可靠度研究。與其它型式封裝比較，此封裝結構設計創新使用發泡基板，利用其與緩衝層所組成的緩衝機制，以減緩錫球因晶片與基板材料熱膨脹量不匹配所承受之應力，提高其可靠度壽命。故本研究著重於發泡基板與緩衝層對於影響此新式封裝體可靠度之探討，對其進行一系列包括幾何尺寸與材料特性等之非線性有限單元參數化分析。此外，晶片厚度參數之效應亦考慮於本研究內。研究結果顯示，發泡基板與緩衝層均提供緩衝應力之功效，且緩衝層之存在與否對於封裝結構錫球之可靠度深具影響。若封裝體內有緩衝機制之設置，則晶片厚度效應影響錫球可靠度之程度有限。
至於緩衝層其填充式樣的變化對封裝體錫球可靠度影響之高低，於本研究裡亦予以詳加探討分析；由研究結果可知，具緩衝層、無填滿充填式樣封裝有較佳之可靠度；且分析比較結果顯示，緩衝層之有無比填滿與否對封裝結構可靠度更具影響力。
本研究以有限單元軟體的模擬，將此新式晶圓級封裝結構設計進行加速熱循環試驗可靠度規範之測試。其參數化分析結果皆已完成比較與探討。期以作為對日後相關之晶圓級封裝結構可靠度設計上之參考依據。

Recent years, semiconductor chip applied on the computer and optical communication products need to satisfy the demands of smaller, lighter, high I/O density and lower cost. The next generation packages such as CSP, flip chip and wafer level package（WLP）have enjoyed the mainstream. However, the WLP is only suitable to smaller chip in current because the board level reliability for larger one is still critical.
In order to enhance the WLP reliability for larger chip, this research proposed a new WLP design ─ bubble-like buffer layer WLP. Compared to other types of package, it has a novel packaging structure with the bubble-like plate. The research studies the effects of the dimensions and material properties of bubble-like plate and buffer layer on the WLP reliability. A 2-D nonlinear finite element analysis for the proposed new WLP is conducted. The results reveal that both bubble-like plate and buffer layer provide compliant effects. However, the buffer layer has a significant effect on enhancing the solder joint reliability. Moreover, if packages have the buffer structure, the chip thickness does not impact its reliability.
On the other hand, the difference between the no-filled and filled buffer layers also affect the reliability of solder joint. The results reveal the package with the buffer layer and the no-filled bubble-like plate has the better reliability. Compared to the no-filled bubble-like plate, the buffer layer can enhance the package reliability further.
Furthermore, the results presented in the research can be used as a design guideline for bubble-like buffer layer WLP.

目錄
中文摘要
英文摘要
目錄…………………………………………………………. Ⅰ
表目錄………………………………………………………. Ⅲ
圖目錄………………………………………………………. Ⅳ
第一章 緒論………………………………………………... 1
1.1 電子封裝簡介……..……………………………………. 1
1.1.1 晶圓/晶片尺寸級封裝（WL-CSP）技術.. 1
1.1.2 覆晶技術..………………………………… 2
1.1.3 封裝力學行為和可靠度..…………… …3
1.2 研究動機….…………………………………………… 4
1.3 文獻回顧……….……………………………………… 4
1.4 研究目標….…………………………………………… 7
第二章 理論基礎………………………………………….. 9
2.1 錫球幾何外形預測……..……………………………….. 9
2.1.1 截球法..……………………………………9
2.1.2 能量法…………………………..…………11
2.2 非線性理論……..……………………………………… 12
2.2.1 Newton-Raphson法.………………………13
2.2.2 降伏準則（Yield Criterion）…………14
2.3 可靠度估算準則（Reliability Criterion）……….………16
第三章 有限單元分析模型……………………………….. 18
3.1 有限單元模型之建立….……………………………….. 18
3.1.1 發泡式緩衝層之晶圓級封裝結構模型..…19
3.1.2 發泡基板彎曲角度參數化之晶圓級封裝結構模型…19
3.1.3 晶圓級尺寸之無底膠覆晶封裝和Tessera mBGA封裝結構模型……………20
3.2 有限單元分析…….……………………………………. 21
3.2.1 各項材料參數之設定.…………………… 21
3.2.2 分析條件和步驟…………………………..22
3.2.2.1 邊界條界…….……………22
3.2.2.2 加速熱循環試驗模擬…….23
第四章 結果分析與討論………………………………….. 24
4.1 發泡式緩衝層之晶圓級封裝結構加速熱循環試驗之模擬結果. 24
4.2 發泡式緩衝層之晶圓級封裝之參數有限單元設計…..……… 25
4.2.1 結構模型材料性質之參數化………..……25
4.2.2 結構模型幾何尺寸之參數化………………27
4.3 具不同發泡式緩衝層充填式樣之晶圓級封裝結構加速熱循環試驗之模擬結果……………………………………… 29
4.4 與晶圓級尺寸無底膠覆晶封裝和Tessera mBGA封裝結構之比較………………………………………………….. 30
4.4.1 晶圓級尺寸之無底膠覆晶封裝結構加速熱循環試驗之模擬結果……………..…………………………... 30
4.4.2 晶圓級尺寸之Tessera mBGA封裝結構加速熱循環試驗之模擬結果…….……………….………………... 31
4.4.3 結果分析與討論………..……31
第五章 結論與展望………………………………………33
參考文獻……………………………………………………. 35

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