臺灣博碩士論文加值系統

摘要
在多晶片模組構裝(multichips module package, MCM)之初始設計階段，散熱效能之計算分析頗為重要。欲探討各種設計參數如晶片尺寸及位置等對於散熱效能之影響，不論是數值模擬或實驗方法皆需不斷的探討，既耗時亦不具經濟效益。本論文旨在針對平面內含多塊不同尺寸、位置晶片之BGA型態MCM構裝進行散熱分析，進而建立一可以直接且準確描述晶片接面溫度的方程式，以作為平面MCM構裝設計之參考。
本論文首先利用ANSYS有限單元套裝軟體成功的建立了一個精確的三維有限單元熱傳分析模型，經由晶片溫度量測實驗之驗證，可以有效的探討BGA(Ball Grid Array)型態MCM構裝之散熱效能。由於此三維有限單元熱傳分析模型之自然對流邊界條件，係依JEDEC規範，由紅外線熱像儀量測構裝表面溫度場而來，故構裝表面的熱對流和熱輻射效應均已考慮在內。並以不準確度分析，探討晶片接面溫度量測之最大不準確度。為了建立MCM構裝在不同晶片尺寸及位置變化下之晶片接面溫度回應表面，本論文成功的利用所建立之三維有限單元模型，配合Chen 等(2001)所採用的自然對流及輻射修正熱傳邊界深入進行參數化及迴歸分析。並藉由顯著性及複判定係數檢測，證實所建立的多晶片回應表面可有效且準確預測在不同晶片尺寸及位置情況下之平面MCM構裝散熱效能。本論文之成果亦可進一步延伸至多晶片堆疊式MCM構裝之散熱與結構最佳化設計，對於MCM構裝散熱效能設計有相當應用參考價值。

Abstract
Thermal characterization of a multichips module (MCM) during the initial design stage is computationally intensive. The influence of each design parameter, such as chip size or position, on the thermal performance needs to be performed and solved whether by numerical simulations or experiments. It is time consuming and not economical. Therefore, this work aims at analyzing the thermal characterization of a BGA type MCM package having multichips with different sizes and positions. An approximated but accurate mathematical equation, which can be used to directly characterize chip junction temperature of the planar MCM, is also proposed.
In order to attain the objectives, a rigorous three-dimensional (3D) finite element (FE) model for thermal analysis is established using ANSYS program. The accuracy of the FE model in terms of chip junction temperature is substantially validated against a thermal test die measurement. Since the required boundary condition for thermal analyzing MCM package under a natural convection environment is determined by an Infrared (IR) thermometer, based on the JEDEC standard, the heat convection and radiation effects on package surface are fully considered. Also, the uncertainty analysis is used to analyze the maximum uncertainty of the thermal test die measurement. Furthermore, to establish the response surfaces of chip junction temperature with various chip size and positions, this work successfully steps forward into the parametric study and regression analysis by adopting the 3D FE model constructed and the natural convection and radiation heat transfer correlation model used by Chen et al. (2001). After careful examination by the analysis of variance and coefficient of multiple determinations, it is concluded that the response surfaces can effectively and accurately predict the thermal characterization of a planar MCM with different chip sizes and positions. This study can be further extended to analyze the thermal performance and optimization of stacked MCM and should be very helpful in thermal design of MCM package.

目錄：
目錄……………………………………………………………………………I
圖表目錄………………………………………………………………………III
一、 導論………………………………………………………………1
二、 問題敘述…………………………………………………………7
2. 1 BGA型態MCM構裝幾何結構…………………………………………7
2. 2 測試基板……………………………………………………………8
2. 3 材料性質……………………………………………………………8
三、 有限單元熱傳分析………………………………………………10
3. 1 MCM有限單元熱傳分析模型………………………………………10
3. 2 熱傳邊界條件……………………………………………………11
四、 實驗量測與驗證…………………………………………………13
4. 1 二極體溫度順向偏壓曲線量測……………………………………13
4. 2 自然對流環境下晶片溫度量測……………………………………14
4. 3紅外線熱像儀溫度場量測…………………………………………14
五、 不準確度分析…………………………………………………………16
5. 1 電源供應器之不準確度分析………………………………………16
5. 2量測測試晶片晶片接面溫度之不準確度分析……………………17
六、 回應表面法…………………………………………………………20
6. 1線性迴歸模型…………………………………………………22
6. 2二次迴歸模型………………………………………………………23
6. 3 迴歸因子範圍………………………………………………………25
6. 4顯著性檢定…………………………………………………………26
七、 結果與討論…………………………………………………………28
7. 1 三維有限單元熱傳分析模型之確立………………………………28
7. 2線性疊加晶片溫度梯度之結果……………………………………31
7. 3晶片接面溫度之回應表面…………………………………………32
八、 結論及未來展望………………………………………………36
九、 參考文獻……………………………………………………………38
十、 附表與附圖…………………………………………………………41

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