臺灣博碩士論文加值系統

本研究目的在於探討電子構裝形式PBGA中的BT基板材料以及polyimide材料在不同應變率拉伸試驗之機械性質，以及兩種材料在不同溫度之下進行拉伸試驗的機械性質，最後針對較易觀察出潛變現象的polyimide材料做潛變試驗。
在拉伸試驗的過程中，分別以10-2、10-3、10-4(mm/mm/s)三種應變率對BT材料以及polyimide材料進行拉伸試驗，發現拉伸速率越快，兩種材料的強度都會越強，剛性(E)也越高，BT材料的拉伸破壞的應變也會加大，但polyimide材料則是應變速率越慢，其拉伸破壞應變越大，因為有頸縮(necking)的現象發生所導致。
另外考慮兩種材料在不同溫度之下的機械性質，BT材料的應變率為10-3而polyimide材料則是使用10-2，因為polyimide材料的延展性較好的緣故，總共使用五種不同的溫度，分別為-40°C，25°C，75 °C ，125°C及150°C。
最後討論較易觀察出潛變行為的polyimide材料，觀察此材料的潛變行為，因為低溫的潛變現象非常不明顯，所以不予討論，使用25°C，75 °C ，125°C及150°C這四種溫度來做潛變的試驗，做了多組不同的實驗，希望能找出潛變的數學模型。

The research based on BT material and polyimide material under defferent strain rate test.And use two materials to enforce tensile test in different temperature.Final,use polyimide material enforce creep test.
Use 10e-2、10e-3 and 10e-4 strain rate to enforce tensile test,when strain rate faster,the strength is stronger.But polyimide material,when strain rate slower,tensile rupture is higher,because the necking behavior happen.
Consider two material,it's mechanical properties under different temperature.Use five temperature,each temperatue is -40°C，25°C，75 °C ，125°C及150°C。
Final,consider polyimide material,observe creep behavior under this material,because creep not obvious uder lower temperature,we don't consider it.Use 25°C，75 °C ，125°C及150°C to enforce creep test,use different experiment,hope can find creep mathmatical model.

摘要
表目錄…………………………………………………………………..IV
圖目錄…………………………………………………………………...V
壹、前言………………………………………………………………..1
貳、研究目的與內容…………………………………………………..3
2.1 研究目的………………………………………………………….3
2.2 研究內容…………………………………………………………3
2.2.1 常溫試片機械性質探討
2.2.2 不同溫度下之機械性質
2.2.3 PI材料在不同溫度之下的潛變行為探討
參、文獻回顧…………………………………………………………..5
肆、材料機械性質……………………………………………………..7
4.1高分子複合材料受拉伸試驗之材料反應…………………………8
4.2材料的潛變行為……………………………………………………9
4.2.1實驗曲線的嵌合
4.2.2潛變性質與時間之關係曲線模式
4.2.3潛變的數學模型
伍、實驗內容及程序…………………………………………………12
5.1 儀器簡介………………………………………………………….12
5.1.1 Instron-8848型微測試試系統(micro tester system)
5.1.2 微氣動式夾頭 (micro pneumatic grips)
5.1.3 溫度控制箱(temperature chamber)
5.1.4 可變換夾面夾頭(versa grips)
5.1.5 高倍率電子顯微鏡量測設備
5.2 試片準備…………………………………………………………14
5.2.1 PBGA基板以及polyimide軟線板簡介
5.2.2 試片的尺寸與裁切
5.3 實驗方法及程序…………………………………………………15
5.3.1不同應變率下之拉伸試驗
5.3.2不同溫度下的試驗
5.3.3拉伸潛變測試
5.4 實驗流程………………………………………………………….17
陸、結果與討論………………………………………………………18
6.1 BT常溫試片承受拉伸試驗之研究………………………………18
6.1.1 BT常溫試片不同應變率之拉伸試驗
6.1.2 BT常溫試片不同應變率拉伸試驗之比較
6.1.3高倍率顯微鏡觀察破壞斷面
6.2 PI常溫試片承受拉伸試驗之研究………………………………..19
6.2.1 PI常溫試片不同應變率之拉伸試驗
6.2.2 PI常溫試片不同應變率拉伸試驗之比較
6.2.3 高倍率顯微鏡觀察破壞斷面
6.3 BT積層板在不同溫度下之拉伸試驗研究……………………..20
6.3.1 BT積層板在不同溫度之下拉伸試驗之比較
6.3.2 高倍率顯微鏡觀察破壞斷面
6.3.3 不同溫度的BT積層板SEM圖片
6.4 PI材料在不同溫度下之拉伸試驗研究………………………21
6.4.1 PI材料在不同溫度之下拉伸試驗之比較
6.4.2高倍率顯微鏡觀察破壞斷面
6.5 PI材料在不同溫度之下的潛變試驗………………………..22
6.5.1 不同溫度下潛變試驗的比較
6.5.2 潛變數學模型的建立
柒、結論…………………………………………………………25
參考文獻…………………………………………………………27

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