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研究生:陳永儒
研究生(外文):Chen-Yung-Ju
論文名稱:覆晶凸塊應用於光學被動對位
論文名稱(外文):Using flip chip solder bump in optical passive alignment
指導教授:江國寧
指導教授(外文):Kuo-Ning Chiang
學位類別:碩士
校院名稱:國立清華大學
系所名稱:動力機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:89
中文關鍵詞:被動對位覆晶凸塊有限元素法可靠度光學構裝
外文關鍵詞:Passive AlignmentFlip Chip Solder BumpFinite Element MethodReliabilityOptical Packaging
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摘要
隨著光纖通訊的蓬勃發展,許多前所未見的挑戰逐漸浮現。肇因於光纖對位精密度要求高、不易大量生產緣故,如何生產一具成本優勢的光纖元件遂成重要目標。將光纖與元件整合於矽基材的被動對位技術或許提供了一個可靠的節決方案,此類型的整合技術包含了蝕刻V型槽與覆晶凸塊製程。V型槽和覆晶凸塊能確保被動對位的高水平與垂直精確度。本研究所設計的矽基材乃利用IC製程中的光罩和氧化薄膜進行。
肇因於容易達成光纖被動對位,自1990年開始,即有許多關於製造與設計的研究進行。然本研究著重於不同部分,本研究著重於整體結構的可靠度分析與覆晶凸塊外型預測。因此本研究將分別利用有限元素法分析結構在熱循環測試之下的力學行為。與Surface Evovler 預測錫球凸塊的幾何外型,達到準確對位之目標。因此,本研究的主要目的乃是要利用電腦輔助軟體簡化設計光學構裝的工作程序。
關鍵字:被動對位、覆晶凸塊、有限元素法、可靠度、光學構裝

Abstract
With the development of optical fiber communication industry, the challenges for producing more cost-effective fiber-optic modules are mainly due to high Electro-optic performance, low volume production, and high reliability requirements. Fiber-in-board technology offers a full solution for those requirements. The technology is based on silicon micro-optical bench with etched V-grooves and flip-chip solder bonding. V-grooves and flip-chip solder bump designed for optical passive alignment provides a precise passive alignment packaging method. High accuracy in horizontal and vertical alignment of optical chip was attained. Silicon micro-optical bench substrates were manufactured together on silicon wafer via photolithography and thin-film processing.
Based on this concept, lots of researches investigate bumping technology and manufacturing process since 1990.This research will focus on different issue. The reliability analysis of optical passive alignment structures and the solder joint design, such as solder geometry shape control, is the main issue in this research. This research will use finite element method to analyze the mechanics behavior of testing vehicle under thermal cycling condition. In order to provide good reliable structure, this research will also use Surface Evovler to predict geometry of solder bump. The main goal of this research is using computer-aided software to design optical packaging.
Keyword : Passive Alignment, Flip Chip Solder Bump, Finite Element Method, Reliability, Optical Packaging

目錄
摘要……………………………………………………………..I
Abstract………………………………………………………...II
目錄………………………………………………………….. III
圖目錄………...……………………………………………...VII
表目錄……………………………………………………...VIIII
第一章 緒論
1.1 研究動機…………………………………………………….. 1
1.2 研究目的…………………………………………………….. 3
1.3 光纖對位之問題…………………………………………….. 4
1.3-1 主動對準…………………………………………….. 5
1.3-2 被動對準…………………………………………….. 5
1.4 光電元件構裝概況…………………………………………. 6
1.5 研究範疇…………………………………………………….. 7
第二章 文獻回顧
2.1 矽的非等向性蝕刻…………………………………………. 8
2.2 覆晶接合技術………………………………………………. 8
2.3 Surface Evolver的應用歷史………………………………... 10
2.4 覆晶結構可靠度……………………………………………. 11
第三章 理論分析
3.1 光纖對位的重要性…………………………………………. 12
3.2 光纖的內部損失……………………………………………. 13
3.2-1 照射損失…………………………………………….. 13
3.2-2 吸收損失…………………………………………….. 14
3.3 光纖的外部損失……………………………………………. 16
3.3-1 照明損失…………………………………………….. 17
3.3-2 數值孔鏡損失……………………………………….. 18
3.3-3 光纖輸出端耦合損失……………………………… 19
3.3-4 反射損失…………………………………………….. 20
3.4 二光纖對接損失……………………………………………. 21
3.4-1 橫向未對準………………………………………….. 21
3.4-2 角向未對準………………………………………….. 23
3.4-3 端點分離未對準…………………………………….. 24
3.5 Surface Evolver之理論分析………………………………... 26
3.6 可靠度估算準則……………………………………………. 28
3.6-1 Pao所提出之Coffin Manson經驗式………………... 28
3.6-2 Hong所提出之Coffin Manson經驗式……………… 29
3.7 有限元素法…………………………………………………. 30
3.7-1 應力與應變關係…………………………………….. 30
3.7-2 降伏準則…………………………………………….. 31
3.7-2 應變硬化法則……………………………………….. 32
第四章 有限元素模型
4.1 結構有限元素分析…………………………………………. 34
4.1-1 材料參數設定……………………………………….. 34
4.1-2 邊界條件設定……………………………………….. 36
4.1-3 熱循環條件設定…………………………………….. 37
4.2 測試載具結構與散熱分析分析……………………………. 39
4.2-1 材料參數設定……………………………………….. 40
4.2-2 邊界條件設定………………………………………..
第五章 有限元素法之結果
5.2 熱循環下光纖端面之位移偏量……………………………. 44
5.1-1 X方向偏移量………………………………………... 44
5.1-2 Y方向偏移量………………………………………... 49
5.1-3 Z方向偏移量………………………………………... 54
5.1-4 結果與討論………………………………………….. 60
5.2 覆晶凸塊之可靠度…………………………………………. 64
5.3 測試載具熱傳分析結果……………………………………. 68
5.3-1 測試載具結構裸露之熱傳分析…………………….. 68
5.3-2 僅PCB與外界接觸之熱傳分析……………………. 70
第六章 實驗設計及進行步驟
6.1 實驗流程……………………………………………………. 73
6.1-1 高溫氧化爐管……………………………………….. 74
6.1-2 光阻微影製程系統………………………………….. 75
6.1-3 濕蝕刻……………………………………………….. 76
6.1-4 金屬濺鍍…………………………………………….. 76
6.2 Surface Evolver分析………………………………………... 77
6.3 V型槽之設計與製造……………………………………….. 79
6.4 結果與討論…………………………………………………. 81
第七章 結論與未來展望
參考文獻 86

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