臺灣博碩士論文加值系統

本研究針對一維陣列發光模式之邊射型雷射進行改善。為增加光傳輸量及使其發射光束易於耦合進入光纖中，乃設計一載具達成上述之要求。而本研究之目標，即設計一符合二維陣列發光模式及具垂直向上發射光束之載具。
文中提出三種達成此目的之方法，經評估其製程及光能量損耗上之優劣後，決定以錫鉛合金回銲固化特性達到控制雷射二極體之特殊傾斜角目標，且研究中所使用之模擬軟體為Surface Evolver。
此軟體乃以最小能量法進行模擬分析，在簡述其理論後，為了解其所得結果之精確性及可信度，乃以實驗比對模擬所得之結果，並分析其間之差異，而後再以相關文獻以資佐證。
研究中所提供控制雷射二極體傾斜角為十字外型之墊片，另一會對其傾斜結果造成影響之因素為錫鉛合金之體積。為觀察其回銲外型及趨勢，乃先利用無加置雷射二極體之模組進行模擬，探討其因受墊片外型及錫鉛合金體積所產生之影響。之後再以加置雷射二極體之模型模擬，在所給定的邊界條件下，分析回銲時雷射二極體之自由度，並討論其於各不同之變數中，其分別單獨造成傾斜角之影響，最後求得所需之上揚發射角19.48度。
對於模擬進行時所使用之網格密度是否足夠，也在分析中做一討論。選擇一適當之網格密度，將節省許多求解精確結果過程所花費的時間。
由於雷射光束最後耦合進入光纖，故其對位精準度所造成的光功率損失亦相當重要，最後即以此載具所造成之對位偏差來分析其於非理想狀態時所產生的功率影響。

摘 要 i
Abstract ii
圖 目 錄 vi
表 目 錄 ix
第一章 導論
1.1 研究動機 1
1.2 研究目標 2
1.3 文獻回顧 4
第二章 研究方法
2.1 45度蝕刻反射面之載具 7
2.1.1 45度蝕刻反射面載具之製程設計 7
2.1.2 45度蝕刻反射面載具之結論評估 8
2.2 加置三角菱鏡之載具 9
2.2.1 三角菱鏡之折射原理及設計 10
2.2.2 三角菱鏡載具之結果與分析 12
2.2.3 加置三角菱鏡載具之結論評估 17
2.3 加置錫鉛合金之載具 17
第三章 原理及理論
3.1 邊射型雷射二極體發光原理 20
3.2 矽材料非等向性蝕刻特性 23
3.3 表面張力 26
3.4 金屬熔接之接觸角 27
3.5 陣列模組之光傳遞效率 29
3.5.1 串訊效應對耦合效率的影響 30
3.5.2 對位偏差(Offset)的影響 31
3.5.2.1 縱向偏差 32
3.5.2.2 橫向偏差 32
3.5.2.3 x軸方向的角偏差 33
3.5.2.4 y軸方向的角偏差 33
3.5.2.5 z軸方向的角偏差 34
3.5.2.6 總偏差的效應 34
3.5.3 陣列對位能力(Array-Alignability) 35
第四章 Surface Evolver 之理論與實驗驗證
4.1 Surface Evolver理論 36
4.2實驗程序及結果 37
4.2.1實驗設備 38
4.2.1.1微量天平 38
4.2.1.2高溫烘箱 38
4.2.1.3 攝影式接觸角分析儀 39
4.2.2 實驗步驟 40
4.2.3 實驗結果 40
4.3 實驗結果與Surface Evolver模擬之比較 45
4.4 文獻驗證 46
4.4.1 軸對稱模型之驗證 46
4.4.2 非對稱模型之驗證 47
4.5 Surface Evolver於模擬應用之結論 48
第五章 錫球成型及光路模擬規劃
5.1 蝕刻凹槽之尺寸規劃 49
5.2 錫球成型之設計模擬 51
5.2.1 無加置LD模型之墊片尺寸及錫球體積設計模擬 51
5.2.1.1 無加置LD模型之墊片尺寸設計 51
5.2.1.2 無加置LD模型之體積設計 52
5.2.1.3 無加置LD模型之邊界條件 52
5.2.2 加置LD模型之墊片尺寸及錫球體積設計模擬 53
5.2.2.1 加置LD模型之墊片尺寸及錫球體積設計 53
5.2.2.2 加置LD模型之邊界條件 54
5.2.2.3 加置LD模型之自由度分析 55
第六章 結果與分析
6.1 無加置LD之Surface Evolver模擬結果 57
6.2 加置LD Surface Evolver之傾斜角模擬分析 61
6.2.1 變數vq-vp之LD傾斜度 61
6.2.2 變數vr-(vp+vr/2)之LD傾斜角 61
6.2.3 變數V-vp之LD傾斜角 62
6.2.4 各變數對傾斜角之影響 65
6.3 表面元素密度對傾斜角之影響 65
6.4 傾斜角偏差之耦合效率 69
6.5 傾斜角19.48度之墊片形狀及錫球體積 70
6.6 Ld於工作溫度所產生的角度偏差 72
第七章 結論
參考文獻 76

【1】Jinshown Shie, Shihan Yu, 2000, ”A micromachined silicon-submount package for vertical emission of edge emitting laser diode”, sensors and actuators, pp.297-301.
【2】H.Sodea, K. Iga, C. Kitahara, Y. Suematsu, 1979,“GaInAsP/InP surface emitting injection lasers”, Jpn. J. Appl. Phys.18, pp.2329—2330.
【3】K. Iga and F. Koyama, 1988, ”Surface emitting semiconductor lasers”, IEEE, J. quantum electronics, Vol.24, pp.1845-1855.
【4】D.B. Lee, 1969, ”Anisotropic etching of silicon,” J. Appl. Phys, Vol.40, pp.4569-4574.
【5】Kenneth E. Bean, Oct. 1978, ”Anisotropic etching of silicon”, IEEE, transactions on electron devices, Vol. ED.25, No.10, pp.1185-1193.
【6】Goldmann L.S., 1969, “Geometric optimization of controlled collapse inter-connections”, J. IBM Res. Develop, Vol.13, pp.251-265.
【7】Oshima, M., Kenmotsu, A., Ishi, I., 1982, ”Optomization of micro- solder reflow bonding for the LSI flip chip”, Proc. 2nd annual Intl. electronics packaging Soc. Conf., pp.481-488.
【8】Satoh. R., Oshima. M., Komura, H., Ishi, I. and Serizawa, K., 1983, “Development of a new micro-solder bonding method of VLSIs”, Proc. 3rd annual Intl. electronics packaging Soc.Conf., pp.455-461.
【9】Satoh R., Oshima M. and Hirota K., 1987, “Optimum bonding shape control of micro-solder joint of IC and LSI”, J. Japan Inst. metals, Vol.51, No.6, pp.553-560.
【10】R.H. Katyl and W. T. Pimbley, 1992,” Shape and force relationship for molten axisymmetric solder connections”, ASME J. of electronic packaging, Vol.114, No.3, pp.336-341.
【11】B. Yost, J. McGroarty, P. Borgesen, and C. Y. Li , 1993, ”Shape of a nonaxisymmetric liquid solder drop constrained by parallel plates”, IEEE, transactions on components, Hybrids and manufacturing Tech., Vol.16, pp.523-526.
【12】T. S. Lee, T. P. Choi, C. D. Yoo, 1995, ”Finite element modeling of three-dimentional solder joint geometry in SMT”, advances in electronic packaging 1995, Vol.2, ASME EEP Vol.0-2, pp.1031-1041.
【13】N. J. Nigro , F. J. Zhou , S. M. Heinrich , 1996,”Parametric finite element method for predicting shapes of tree-dimensional solder joints”, ASME J. of electronic packaging, Vol.118, pp.142-147.
【14】Kenneth A. Brakke, 1996, ”Surface evolver manual, version2.01”, the Geometry Center, University of Minnesota.
【15】Kenneth A. Brakke, 1978, ”The motion of a surface by its mean curvature”, University of Minnesota.
【16】Sidharth, Blish,2002,“Solder joint shape and standoff height prediction and integration with FEA-based Methodology for reliability evaluation,” IEEE, electronic components and Tech. Conf., pp.1-6.
【17】Gary K. Mui, Xiaohua Wu, Kai X. Hu, Chaopin Yeh, 1997, “Solder joint formation simulation and finite element analysis”, IEEE, electronic components and Tech. Conf., pp.435-443.
【18】Betty H. Yeung, Tienyu T. Lee, 2001, “Evaluation and optimization of package processing, design, and reliability through solder joint profile prediction”, IEEE, electronic components and Tech. Conf., pp.925-930.
【19】Susan T., Bingzhi Su, Y.C. Lee, 1998, “Prediction of Yield for flip-chip solder assemblies”, IEEE, intl. Conf. on multichip modules and high density packaging, pp.35-40.
【20】Susan T., Bingzhi Su and Y.C. Lee, 1999, “Yield prediction for flip- chip solder assemblies based on solder shape modeling”, IEEE, transactions on electronics packaging manufacturing, Vol.22, No.1, pp.29-37.
【21】Sakai, H., Yamaoka, N. and Ujiie, K., 2000, “Shape prediction and residual stress evaluation of BGA and flip chip solder joints”, IEEE, inter society Conf. On Thermal phenomena, pp.181-186.
【22】Xiaohua Wu and Kai Hu, xxxx,”Solder joint formation and reliability prediction”, ASME J. of electronic packaging, pp.1-7.
【23】T. A. Nguty T.A., B. Salam, and N. N. Ekere, 2000, ”A parametric study of the effects of process parameters on the assembly of chip scale packages”, Intel. symposium on advanced packaging materials, pp.208-210.
【24】Wei Lin, Susan K. and Y.C. Lee, 1995, “Design of solder joints for self-aligned optoelectronic assemblies”, IEEE, transaction on components, packaging, and manufacturing Tech. Part-b, Vol.18, No.3, pp.543-551.
【25】Racz, L. M., and Szekely, J., 1993, ”Determination of equilibrium shapes and optimal volume of solder droplets in the assembly of surface mounted integrated circuits”, trans., iron and steel institute of Japan Intel., Vol.33, No.2, pp.336-342.
【26】Daniel Lewis, 1998, “Development of a new solder joint modeling tool for IC package designers”, IEEE, electronic component and Tech. Conf., pp.734-736.
【27】Peter M. Martino, Gary M., Freedman, Livia M. Racz, Julian Szekely, 1994, ”Predicting solder joint shape by computer modeling”, IEEE, pp.1071-1078.
【28】X. Zhao, C. Wang, 2000, ”An integrated system for prediction and analysis of solder interconnection shapes”, IEEE, transactions on electronics packaging manufacturing, Vol.23, pp.87-91.
【29】X. Wu, X. Dou, C.P. Yeh, K. Waytt, 1998, ”Solder joint formation simulation and component tombstoning prediction during reflow”, ASME, J. of electronic packaging, Vol.120, pp.141-144.
【30】K.F. Harsh, V. M. Bright, Y. C. Lee, 2001, ”Design optimization of surface micro-machined self-assembled MEMS structures”, ASME, pp.1-7.
【31】K. Ishikawa, J. Zhang and Adisorn Tuantranont, 2002, ”An intergrated micro-optical system for laser-to-fiber active alignment”, IEEE, pp.491-494.
【32】Judith Glazer, 1994, “Microstructure and mechanical properties of Pb-free solder alloy for low-cost electronic assembly: a review”, J. of electronic materials, Vol.23, No.8, pp.693-700.
【33】K. N. Chiang, C. A. Yuan, 2001, “An overview of solder bump shape prediction algorithmas with validations”, IEEE, transactions on advanced packaging, Vol.24, No.2, pp.158-162.