臺灣博碩士論文加值系統

本論文主要在探討光纖陣列模組在熱循環負載下，熱應力/應變對於模組可靠度之影響及光纖位移變動的趨勢。研究中利用有限元素分析軟體ANSYS建立三維有限元素模型並配合材料參數、邊界條件與熱負載溫度進行模組物理行為之模擬分析。本研究分為三個部分，第一部份在於探討接觸元素模型在升降溫階段時接觸力與接觸勁度的關係，並對接觸元素的使用與簡化加以討論。第二部分將探討無接觸元素之模型，本部份又細分為兩片矽晶片之間為黏合之模型及無黏合之模型。並研究其在熱循環負載下所產生的熱應力/應變，對於光纖陣列模組可靠度的影響，並對兩個不同模型之模擬分析結果加以討論。第三部分探討光纖在熱循環負載下在X、Y、Z三方向上之位移變動的趨勢。
本研究於光纖陣列模組所模擬分析之結果，顯示光纖陣列模組的可靠度及光纖的位移變動在合理且容許的範圍之內，可做為從事相關研究人員設計之依據。

The effect of thermal stress/strain distribution and the displacement of optical fiber in the optical fiber array module under cyclic thermal loading are investigated in this thesis. A general-purpose of finite element system ANSYS is adopted in this research for thermal and mechanical behavior analysis. This research consists of three parts. In the first part, contact element models are used to investigate the relation between the contact force and contact stiffness when the optical fiber array module is subjected to a temperature cycling condition. Moreover, the simplification of contact element models is also discussed in this research. In the second part, non-contact element models are applied to study the reliability characteristics of optical fiber array module under cyclic thermal loading. There are two cases for the non-contact element models to handle the surface between top and bottom silicon of the optical fiber array model; one is bonding free and the other one is perfectly bonding conditions. Furthermore, the research discusses with the comparison of analysis results between the two models. For the third part, the investigation considers that the displacement of optical fiber in the X、Y、Z directions under cyclic thermal loading.
The simulation results of optical fiber array module can fulfill the reliability demands. In addition, the displacement of optical fiber in the optical fiber array module is in reasonable and allowable range. Consequently, this study gives a methodology for the design of the optical fiber array module.

摘要………………………………………………………….…..I
目錄……………………………………………………………………..III
圖表目錄………………………………………………………………...V
第一章、緒論…………………………………………………..………1
1.1 研究動機...…………………………………………………………..1
1.2文獻回顧……………………………………………………………..3
1.3研究目標……………………………………………………………..8
第二章、理論分析……………………………………….…………...9
2.1.光纖導波管…………………………………………………………..9
2.1.1階變折射率光纖………………………………………………….9
2.1.2漸變折射率光纖…………………………………...…………….10
2.1.3訊號衰減與損失…………………………………………...…….13
2.2 光纖與光學元件之耦合….……………………………….………..21
2.2.1插入損失……………………...………………………………….21
2.2.2回波損失…………………………………………………………24
2.2.3光學元件與光纖之耦合架構…….……………………………...24
2.2.4光纖互相連接耦合………………………………………………26
2.3結構可靠度………………………………………………………….32
2.3.1疲勞壽命……………………...………………………………….32
2.3.2應力與應變的關係………………………………………………33
2.3.3降伏準則…………………………………………………………34
2.3.4應變硬化法則……………………………………………………36
2.3.5有限元素軟體分析………………………………………………37
第三章、研究方法………………………………………………..…..39
3.1有限元素模型建立…………...……………………………………..39
3.2接觸元素…………………………………………………………….40
3.3邊界條件與參數設定……………………………………………….42
第四章、分析結果……………………………………………………46
4.1三維有限元素模型…...….……………………………….…………46
4.2接觸元素的使用及問題分析…………..…………………………...50
4.3無接觸元素之模型的分析結果……...……………………………..63
4.4光纖端的位移偏準討論…………………………………………….77
第五章、光纖陣列模組製程設計…………………………………93
5.1選擇性(Selectivity)及非等向性程度(Degree of Anisotropic)……..93
5.2製作過程概述..……………………………………………………...93
第六章、結論…………………………………………………….…..99
參考文獻…….……………….………………………………………102

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