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研究生:蔡嘉育
研究生(外文):Chia-Yu Tsai
論文名稱:覆晶構裝底填膠材料機械性質及可靠度分析
論文名稱(外文):Material Property of Underfill and Reliability Analysis in Flip Chip Package
指導教授:葉孟考葉孟考引用關係
指導教授(外文):Meng-Kao Yeh
學位類別:碩士
校院名稱:國立清華大學
系所名稱:動力機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:81
中文關鍵詞:覆晶構裝底填膠可靠度分析
外文關鍵詞:Flip Chip PackageUnderfillReliability Analysis
相關次數:
  • 被引用被引用:2
  • 點閱點閱:191
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
覆晶級構裝中底填膠(Underfill)與基板等材料皆具有與溫度相依及吸濕特性,在承受高溫迴焊過程中會產生熱應力,使材料機械性質產生變化而影響產品可靠度;而由於點膠完成的覆晶構裝體因熱膨脹係數(CTE)不同所遭遇不同溫度場之應力破壞,可藉由改變覆晶構裝之不同底填膠材料配方,填角(Fillet),晶片(Die)尺寸大小厚度,凸塊(Solder Bump)高度等因素,進而求得構裝體最佳可靠度。
本文針對構裝材料中具吸水性的有機材料探討溫度對其機械性質的影響,藉此建立材料對溫度之相關資料供分析使用;而含不同底填膠材料之覆晶級構裝,藉由應力分析及參數化研究可獲得構裝體之可靠度。結果顯示晶片厚度為400 m時或底填膠的填角為30o時或底填膠的厚度為120 m時或底填膠的楊氏模數增加為5.82 GPa時,較其他參數值的構裝體可存活的循環次數為高。從分析結果可知改變底體填膠填角、底填膠楊氏模數以及溼氣效應對構裝體之可靠度有明顯的影響;而改變晶片厚度以及底填膠厚度對構裝體的可靠度影響較少。
目錄
頁次
摘要………………………………………………………………………i
致謝………………………………………………………………………ii
目錄………………………………………………………………………iii
圖表目錄…………………………………………………………………v
第一章 緒論………………………………………………………………1
1.1 研究動機……………………………………………………………2
1.2 文獻回顧……………………………………………………………3
1.3 研究主題……………………………………………………………6
第二章 實驗內容及程序…………………………………………………8
2.1 實驗設備……………………………………………………………8
2.2 試片製作……………………………………………………………10
2.3 實驗步驟……………………………………………………………10
2.4 實驗結果……………………………………………………………11
第三章 有限單元分析……………………………………………………16
3.1 熱傳導分析…………………………………………………………16
3.2 溼氣吸收擴散分析…………………………………………………17
3.3 溼熱應力分析………………………………………………………19
3.4 有限單元分析………………………………………………………20
3.5 破壞準則……………………………………………………………21
3.6 可靠度分析…………………………………………………………22
第四章 分析結果與討論…………………………………………………24
4.1 數值收斂性…………………………………………………………24
4.2 熱循環分析…………………………………………………………25
4.3 參數研究……………………………………………………………26
第五章 結論………………………………………………………………30
參考文獻…………………………………………………………………31
圖表………………………………………………………………………36
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