臺灣博碩士論文加值系統

在電子產品生命週期及上市時間越來越短的影響下，電子元件測試設備供應商除了必需要能供給全方面的檢測儀器之外，同時也必需要能夠在最短時間之內達到。習有的承座其設計乃針對單一封裝體，其缺少泛用性使得IC設計者在設計時程中無法在最短時間內有效測試，同時，也將會造成設計成本過高而缺乏競爭力。為了解決這問題，除了將IC尺寸標準化外即是設計新式預燒承座（BIS，Burn In Socket），以求能適應不同尺寸之IC。而如要將IC尺寸及錫球間距固定為單一值，對設計者會造成設計上不必要之牽絆。因此，設計適合不同尺寸IC預燒承座是最可能的解決方法。
本研究之目的在於設計可用於不同腳距、錫球數之預燒承座，希望可以藉此縮短產品設計、上市時程，提升IC設計者、測試設備商之國際競爭力。為達成上列目標，我們將研究計畫分成四大部份逐步執行：第一步份為承座的機構設計；第二部份則針對設計做最佳化設計；第三部份為承座之製作；第四部份將利用本承座測試本群體計畫發展出來的IC並真正測試本研究所設計之承座可靠性，並加以分析對照實驗資料。

Due to the decrease of life cycle and time to market of the electrical products, the suppliers have to provide not only all kinds of inspection instruments but have to meet the customers's need in the shortest time. The former design of burn-in socket is usually for single package only. IC designers could not examine their samples immediately and effectively during the design period. Also, it will lead to high cost of their designs and lack of competitiveness.
In order to solve this problem, one may either standardize the I/O specification or design a new type of burn-in socket to adapt to ICs with different dimensions. However, it is an unnecessary restriction to the designers to make the ball pitch unique. For this reason, it is most likely to design a new universal burn-in socket.
This research proposed a socket, which can adjust itself to test the IC of different size or/and different footprint. By the design, we hope that we can minimize the period of design or time to market, and we would promote the manufacturers’ international competitiveness in IC testing equipment eventually. Following work will be finished to achieve to goal listed above: 1. Design a new socket. 2. Optimized the new design. 3. Manufacture the design. 4. Use the socket to test the IC produced by this project, the reliability of the socket is also tested and analyzed.

摘 要 7
第一章 簡 介...............................................8
1.1研究動機....................................................9
1.2研究目標...................................................10
1.3文獻回顧...................................................12
1.3.1三維多晶片模組簡介.......................................12
1.3.2預燒簡介.................................................15
1.3.3文獻回顧.................................................24
第二章 功能與規格分析........................................26
2.1預燒承座模組規格設定.......................................26
2.1.1專利地圖分析.............................................27
2.1.2預燒承座分析.............................................31
2.2功能結構圖.................................................35
2.2.1符號與步驟...............................................35
2.2.2測試系統功能結構圖.......................................36
2.2.3機構功能結構圖...........................................37
2.2.4模組設計規格.............................................38
2.2.5互動矩陣.................................................38
第三章 模組設計..............................................40
3.1模組概念設計...............................................40
3.2機構設計...................................................41
3.2.1受力分析.................................................42
3.2.2承座操作力...............................................42
3.3模組細部設計...............................................42
3.3.1剪刀式接腳機構...........................................42
3.3.2薄膜式承載機構...........................................48
3.3.3堆疊式導引機構...........................................51
3.4設計分析...................................................56
3.4.1 有限元素分析簡介........................................56
3.4.2 套裝軟體ANSYS...........................................57
3.4.3 分析流程 / 結果.........................................59
3.5熱循環結果分析.............................................94
第四章 實體製造與特性量測....................................95
4.1實體製造...................................................95
4.2量測與預燒規劃.............................................97
第五章 失效模式與可靠度評估.................................113
5.1失效定義..................................................113
5.2失效分析..................................................114
5-3故障等級..................................................114
5.4可靠度預測................................................117
第六章 結 論.............................................120
參考文獻.....................................................122

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