臺灣博碩士論文加值系統

微機電系統(MEMS)元件能脫穎於既有產品，成熟的微加工製程平台扮演著極關鍵之角色。本論文根源高深寬比微加工技術(HARM)之結構特徵及材料優點等開發價值，提出一獨特的BELST高深寬比微加工製程平台，其整合了矽深蝕刻技術、(111)單晶矽製程、以及摻硼矽之蝕刻終止特性，輔以如硼支柱角落補償法、防護牆設計、多重結構厚度製造法、特殊垂直梳狀電極等等新型設計，使其不僅能突破現有HARM所普遍存在之結構寬度、厚度、以及自由度等製造限制，並具有能使各型同平面或出平面運動微元件同時在此平台上實現之多樣性製造能力。本論文並同時以雙質塊共振器、以及諧振式微陀螺儀作為研究載具，進一步地探討該平台於靜電致動器與感測器元件之應用。在雙質塊共振器方面，本設計整合了具振幅放大效果之雙自由度振動系統與具衝程-電壓取捨設計特性之斜齒形梳狀致動器；其經由BELST製程平台實現並加以測試，已獲致大振幅、小驅動電壓之預期結果。在諧振式微陀螺儀方面，本文整理了機械結構設計於精確性與準確性提昇上之考量，並據以提出包括單軸及雙軸感測微陀螺儀之微陀螺儀結構設計；經由成品結構之觀察可證實所需之諸多設計特徵皆可實現，而初步驗證了BELST製程平台在微陀螺儀製造上之可行性。由於該製程具有實施簡單、設計限制少、與製造多樣化等特徵，預期將可廣泛應用於微機電系統中，成為一穩定而通用之高深寬比微加工製程平台。

High-Aspect-Ratio Micromachining (HARM) developed recent years has made many devices more versatile compared with surface micromachining process, but it also met some challenges not occurred before. Those issues, which made HARM structure design with thickness/width limitation as well as DOF constraint, are discussed in this work. Accordingly, a novel BELST Fabrication Platform that exploits the (111) wafer process and heavily boron diffusion is proposed. Through some delicate designs in this platform, those design constraints can substantially been reduced, and various microstructure demands of in-plane/out-of-plane devices can also be fulfilled. To further prove it’s feasibility in electrostatic actuators and sensors, Dual Mass Resonator (DMR) and Micro Vibrating Gyroscope (MVG) are studied as the research carrier in this thesis. All the design features incorporated in DMR and MVG design are successfully fabricated using BELST fabrication platform, while the resonator testing also reveals the expected result. In summary, the developed BELST Fabrication Platform can possess most existing merits as well as resolve many design constraints in existing HARM process. Its capability and simplicity are believed to make itself more competitive and promising for many applications.

中文摘要 I
Abstract II
誌謝 III
目錄 V
圖目錄 VIII
表目錄 XII
第一章 前言 1
1-1 研究動機 1
1-2 研究背景 3
1-2-1傳統矽基微加工 3
1-2-2高深寬比微結構製造方式 4
1-3 研究目標 7
1-4 全文架構 8
第二章 BELST製程平台 15
2-1 (111)矽晶片製程 16
2-1-1 (111)矽晶片特性 16
2-1-2 (111)矽晶片製程 19
2-2 BELST製程 21
2-2-1製造流程 21
2-2-2元件對基材之絕緣 23
2-2-3製造結果 26
2-3 擴充型BELST製程平台 27
2-3-1出平面運動元件所需結構 28
2-3-2垂直梳狀致動器之設計考量 30
2-3-3擴充型BELST製程平台 34
2-3-4製造結果 37
2-4 討論 37
2-5 小結 39
第三章 靜電致動器應用：雙質塊共振器 62
3-1 雙自由度系統簡介 63
3-2 雙自由度系統設計考量 64
3-2-1振動系統之數學形式 65
3-2-2響應與設計參數之趨勢關係 67
3-3 斜齒型梳狀致動器 71
3-3-1設計考量 72
3-3-2製造與測試 74
3-4 雙質塊共振器 75
3-4-1雙質塊共振器設計 75
3-4-2製造與測試 75
3-5 小結 76
第四章 慣性感測器應用：諧振式微陀螺儀 91
4-1 諧振式微陀螺儀介紹 91
4-1-1傳統陀螺儀 91
4-1-2諧振式微陀螺儀 92
4-1-3微陀螺儀整體架構 94
4-1-4微陀螺儀應用 95
4-2 微陀螺儀結構設計考量 96
4-2-1操作原理與元件規格 96
4-2-2文獻回顧 99
4-2-3提升精確性 103
4-2-3提升準確性 106
4-3 微陀螺儀設計與製造 108
4-3-1單軸諧振式微陀螺儀 108
4-3-2雙軸諧振式微陀螺儀 110
4-3-3製造結果與討論 112
4-4 小結 114
第五章 總結 128
參考文獻 131
附錄A 矽基材之蝕刻 140
A-1 含多層遮罩之電漿耦合深蝕刻 140
A-2 硼蝕刻終止層與鹼溶液之矽蝕刻 142
附錄B 電路設計考量 147
B-1 電極與電路介面 147
B-2 振幅控制迴路設計 148
B-3 感測電路設計 151
B-4. 共振頻率之偏壓調變法 155
附錄C 量測環境 159
論文著作 162

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