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研究生:張凱程
研究生(外文):K.C. Chang (Kaicheng Chang)
論文名稱:高密度微形液珠產生器之研製
論文名稱(外文):High Density Micro Droplet Injector
指導教授:曾繁根曾繁根引用關係
指導教授(外文):Fangang Tseng
學位類別:碩士
校院名稱:國立清華大學
系所名稱:工程與系統科學系
學門:工程學門
學類:核子工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:84
中文關鍵詞:液珠噴頭晶格印表機噴墨彩色噴墨對準高密度
外文關鍵詞:Dropletprintinjectoralignorientationinkjet110high density
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在現今為大家所知道的,噴墨印表機的技術已經被證實是可以在製作上擁有許多優勢的科技。不論是在製作的成本、列印的品質、和所選用的噴墨原理與材料上的,已經可以說是具有多樣化的選擇。這樣的微形液珠噴射系統在目前的個人印表機市場已經形之多年了。
在本篇論文中的微形液珠噴頭的設計,基本上是採用本人的指導教授在美國UCLA時候的博士論文,作為設計的藍圖。最大的不同之處在於所選用的基材是不相同的,這篇論文中所提到的基材都是透過<110>單晶體的矽晶片來製作,目的是希望能夠透過矽晶體的特性來製作出垂直壁面的微流道,而此結果將會大大的提升噴頭在設計上的排列密度,因此我們可以在相同的單位面積上排列出更多的噴孔,借此也希望將其應用於桌上印表機的噴頭上面,來達到更快、更精準、品質更好的列印品質。 而本篇論文亦提到一種創新且準確的晶格對準方式,透過簡單的一次微影過程來達到0.03゚誤差的晶格對準方式。
除了在排列密度上的優勢之外,在製程上也作了一些改變,新增加的一層微電鍍薄膜來強化整個噴頭結構的強度,並提出了最佳的製程方式來提升原先設計上良率的問題,和迴避掉一些可能發生的困難問題。
整個製程分成三個步驟進行,而且在最後的實驗將全部的新、舊製程都已經製作完成。但是遺憾的是卻無法取得足夠好,且在製程上扮演相當關鍵的結構薄膜(低應力氮化矽),導致良率的大幅度降低。最後在整個設計上的結構皆已經成功的完成,且於微形液珠的拍攝方面也作了一些成功的實驗觀測。

It is well know that the micro-jet printing process has been demonstrated to be a highly cost-effective, precise, environmentally friendly method of fabrications and a wide variety of materials and principles. The low-end printing market as we are used to the desktop printers have been widely using this technique (MEMS) to fabricate those print-heads. .
The improved micro droplet injector design is presented here which is just slight modified basing on my advisor professor Tseng’s PhD dissertation5 in UCLA. This new design here could improve the nozzle pitch by using the (110) single crystal silicon wafer to get more closed channel distance. As the result, we could get the higher resolution printings and would be going to apply to the color printer. Those designs have great advantages over conventional print-heads in the cost, resolution and reliability aspect. Moreover, it can integrate circuit with hundreds of nozzles in just one inch. Here, in this dissertation presents our achievement, fabrication and some results for clear understanding, and also shows a precision alignment method for single crystal silicon orientation finding. .
The highest density in 2-dimension region can be reached by the arrangement of each element injector with the vertical lateral walls, and additional electroplated metal layer would be cover on all structures to protect the print heads from the external force and become more robust. .
The improved destinations in this dissertation would be demonstrated until the final experiment has been completely finished and tested. Unfortunately, according to my fabrication process the Low-stress nitride film play an important role, it’s a pity that these films obtained in this design play a critical role but it’s not good enough. That the reason why my experiment cannot success completely, but basic on those experiences I also provide the best way to solve those problems or avoid some dangerous process.

List of Contents
Page number
Abstract …………………………………………………………………..……..I
Acknowledgements …………………………………………………………… III
List of Contents ………………………………………………………………..… V
List of Figures …………………………………………………………………VII
Chapter1 Introduction ……………………………………………………1
1.1 The needs of micro droplet injector
1.2 Applications
Chapter2 Review various micro injector …………….…………….....10
2.1 Acoustic waves — water needles
2.2 Piezoelectricity
2.3 Static electricity
2.4 Thermal
2.5 Dr. Tseng’s micro injector
2.6 Comparison
Chapter3 Design and Fabrication ……………………….……….. ..19
3.1 Why thermal actuator and <110> silicon wafer
3.2 Mask design
3.3 Fabrication
3.4 Experiment
Chapter4 Packaging and Testing ……………………………….……....32
4.1 Package
4.2 Inkjet testing
Chpater5 Discussions ……………………………………………….. ..38
5.1 The difference between (100) from (110) silicon wafer:
5.2 Anisotropy bulk etching:
5.3 Cross talk and refilled
5.4 Electroplating & JSR structured
5.5 New process
Chapter6 Conclusions …………………………………………………..60
References ……………………………………………………………………..…62
Appendix A Physical properties of materials……………………………...……....65
Appendix B Process Flow………………………………………………….……...69
Appendix C Novel Precision alignment method for <110> wafer
orientation finding……………………………………………………74
Appendix D Driving Circuit……………………………………………………….79
VITA

Book:
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4. 潘欽, “沸騰熱傳與雙相流”, 2001. ISBN:957-30316-1-2.
Published paper:
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22. Fang-Gang Tseng, Chang-Jin “CJ” Kim, and Chih-Ming Ho, ”A novel microinjector with virtual chamber neck”,IEEE,1998
23. Jae-Duk Lee, Hi-Deok Lee, Ho-Jun Lee, Jun-Bo Yoon, Ki-Ho Han, Jae-Kwan Kim, Choong-Ki Kim, and Chul-Hi Han, “A Monolithic Thermal Inkjet Printfead Utilizing Electrochamical Etching and Two-Step Electroplating Techniques”, IEEE, 1995.
24. Martin Fähndrich, Bernhard Hochwind and Alfred Zollner, “Fluid dynamics in micro dosing actuators”, Transducers 1995.
25. Quanfang Chen, Da-Jeng Yao, Chang-Jin "CJ" Kim, and Greg P. Carman, “Investigating the Influence of Fabrication Process and Crystal Orientation on Shear Strength of Silicon Microcomponents”, C.J.MEMS, 2000.
26. Kenji Tokoro, Daisuke Uchikawa, Mitsuhiro Shikida. And Kazuo Sato,”Anisotropic Etching Properties of Silicon in KOH and TMAH Solutions”, International Symposium on Micro-mechatronics and Human science, IEEE, 1998.
27. K. Sato, M. Shikida, and Y. Matsushima, Proc of IEEE Micro Electro Mechanical Systems Workshop, Nagoya, Japan, January 1997, pp. 406-411.
28. Florent Cros and Mark G. Allen, “High aspect ratio structures achieved by sacrificial conformal coation”, Solid-State Sensor and Actuator, June8-11, 1998.
29. Fan-Gang Tseng, Yun-Ju Chuang, “Reduction of diffraction effect of uv exposure on su-8 negative thick photoresist by air gap elimination”, HARMST'01, Munich, Germany, June, 2001.
30. Fan-Gang Tseng, Yun-Ju Chuang, “Fabrication of ultrathick micromolds using jsr thb-430n negative uv photoresist”, transducer, 2001.
31. Donald J.Hayes, and W. Royall Cox, ”Micro-Jet Printing of Polymers for Electronics Manufacturing”, 0-7803-4934-2/98,IEEE , 1998.
32. P Krause and E obermeier, “Etch rate and surface roughness of (110)-oriented silicon”, J. Micromech. Microeng. 5(1995) 112-114.

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