臺灣博碩士論文加值系統

陀螺儀在各方面的應用越來越重要，傳統的陀螺儀體積大且軸承易磨耗，而微加工的振動式陀螺儀以振動式的方式感應角速度的變化，因結構簡單沒有磨耗問題操作壽命長且體積小，故頻寬大，再者，利用Micro Electrical Mechanical System (MEMS)的微加工技術，更可以達到批量製造之技術，以降低大量的成本。
本研究主要是利用微機電加工技術中的bulk micromachining，藉由陽極接合、蝕刻、微影、Deep Silicon RIE等製程，以製造一振動式微型陀螺儀，其做動原理是以靜電力產生振動的驅動力，再經由電容感測訊號。此新穎的微結構不只因為特殊的設計上使機電耦合的能力大大的提高，更因幾何形狀的對稱而得到較高的解析度，並且減少了溫度對感測元件的衝擊；單一道的光罩製程下更簡化了許多複雜的製程，對於良率來說也因此大幅的提升。就本研究的設計預估之結果，以2.5伏特的電壓驅動，其操作範圍在200 deg/sec之下，靈敏度可達到0.02 deg/sec，操作溫度更可在-40℃至85℃的範圍內操作。在元件的製作上，目前已完成元件尺寸大小為5mm×5mm×50um，其中元件結構中最小之gap為3 um，其深寬比約為17。

The gyro is getting more important applications in many fields. A traditional gyro has some drawbacks, for example, they are bulky in volume and wear of bearings is not avoidable. However, the vibratory micro gyro can sense changes of angular velocity based on conservation of momentum and due to its simple and fixed structure the gyro doesn’t has the problem of wear. The vibratory gyro has long operating time. The size of a vibratory gyro is small so it has higher bandwidth and better linearity then those traditional gyro. This research is designed a two-dimensional vibratory micro-gyro which be driven by electro-static force, transduce angular velocity by capacitance. The micro gyro is fabricated by high aspect ratio micromachining process. According to the results of design, the gyro will be driven by electrostatic with 2.5 volts without vacuum. In the operating range of 0-200 deg/sec the sensitivity of gyro is 0.02 deg/secand the operation temperature range is -40℃-85℃. The size of fabricated device is 5mm×5mm×50um and structure of the gap is 3 um.

摘要 Ⅰ
誌謝 Ⅱ
目錄 Ⅲ
圖目錄 Ⅶ
表目錄 ⅩⅠ
第一章 緒論 1
1.1 前言 1
1.2振動式陀螺儀的應用 3
1.2.1汽車安全與操控 3
1.2.2汽車導引系統 4
1.2.3電腦周邊設備 5
1.2.4製造業用途 5
1.2.5醫學用途 6
1.3 傳統陀螺儀 6
1.4振動式陀螺儀的種類 8
1.4.1振動樑式陀螺儀 9
1.4.2音叉式陀螺儀 11
1.4.3單一或雙加速度計的組合 14
1.4.4振動殼式陀螺儀 15
1.4.5 Decoupled陀螺儀 17
1.4.6環狀(Ring type)陀螺儀 20
第二章 原理分析與結構方程推導 23
2.1原理 23
2.2理論分析與公式推導 27
2.2.1結構的彎曲模態動態方程式 28
2.2.2結構頻率的推導 34
第三章 FEM Analysis 37
3.1簡介 37
3.2 模型分析 37
3.3 分析結果 39
第四章 元件簡介與製程規劃 48
4.1元件簡介 48
4.2製程規劃 50
4.2.1步驟一 陽極接合 52
4.2.1-1 反應機制說明 53
4.2.2 步驟二 KOH濕式蝕刻 54
4.2.3 步驟三 CMP 55
4.2.4 步驟四 Lithography 56
4.2.4-1 光阻材料與其特性 57
4.2.4-2 SU-8光阻的製程條件 58
4.2.5 步驟五 深式反應離子蝕刻( Deep Silicon RIE ) 61
4.2.5-1 反應機制說明 61
4.2.6 步驟六 HF 濕式蝕刻 64
第五章 結果與討論 65
5.1結果討論 65
5.1.1 步驟一 陽極接合 66
5.1.2 步驟二 KOH濕式蝕刻 69
5.1.3 步驟三 Lithography 70
5.1.4 步驟四 Deep Silicon RIE 73
5.1.5 步驟五 HF濕式蝕刻 77
第六章 訊號分析與量測 80
6.1元件形變分析 80
6.2元件量測結果 83
第七章 結論 85
7.1問題與未來研究方向 85
7.2結語 86
參考文獻 87
圖目錄
Fig 1-1 童玩陀螺 [8]. 6
Fig 1-2 速度積分陀螺儀 [9]. 7
Fig 1-3振動樑式陀螺儀 [10] 9
Fig 1-4一種振動樑式陀螺儀的結構 [11] 10
Fig 1-5音叉式陀螺儀 [10] 11
Fig 1-6 石英製音叉式陀螺儀 [2] 12
Fig 1-7石英製的雙音叉陀螺儀 [10] 14
Fig 1-8雙加速度計的組合的陀螺儀 [8] 15
Fig 1-9 Driving mold shapes [2] 16
Fig 1-10半球子諧振陀螺儀 [12] 16
Fig 1-11 RR-structure [13] 18
Fig 1-12 LL-structure [13] 19
Fig 1-13 Structure of a Vibrating Ring Gyroscope [14] 20
Fig 2-1 陀螺轉動與角動量之示意圖 23
Fig 2-2 地球科學之科氏力運用圖 24
Fig 2-3 科氏力解說圖 [15] 25
Fig 2-4質量塊與彈簧系統 [16] 26
Fig 2-5 (a)振動式環狀陀螺儀3-D之元件圖 [18] 27
Fig 2-5 (b)振動式環式陀螺儀的三個主要構成 [17] 28
Fig 2-6 固定於圓心的振動彎曲模態 [27] 29
Fig 2-7 固定於邊緣的振動彎曲模態 [27] 30
Fig 2-8 一軸對稱之力附加於圓上 [27] 31
Fig 3-1 (a) Mesh model 38
Fig 3-1 (b) Mesh model 39
Fig 3-2 結構的扭轉模態 41
Fig 3-3 結構的轉移模態 (一) 42
Fig 3-4 結構的轉移模態 (二) 43
Fig 3-5 結構的彎曲模態 (一) 44
Fig 3-6結構的彎曲模態 (二) 45
Fig 3-7結構的彎曲模態 (三) 46
Fig 3-8結構的彎曲模態 (四) 47
Fig 4-1 振動式陀螺儀之原型. 48
Fig 4-2 振動式陀螺儀原型接合點放大圖. 49
Fig 4-3 振動式陀螺儀製程圖 (a) (b) (c) (d) 51
Fig 4-4 陽極接合設備裝置圖 [20] 53
Fig 4-5 基本的平坦化模型 [22] 55
Fig 4-6 不同厚度光阻在UV光譜下穿透率 [23] 57
Fig 4-7 熱墊板加熱和溶劑排出方向 [25] 59
Fig 4-8 Deep Silicon RIE反應機制流程圖 [26]. 62
Fig 5-1 陽極接合氣泡殘留圖 65
Fig 5-2 Anodic Bonding 改善圖 64
Fig 5-3 陽極接合後表密粗糙度 68
Fig 5-4 經保護後的Silicon表面粗糙度 68
Fig 5-5 本研究在各溫度下的蝕刻速率 69
Fig 5-6 KOH之滲入產生的破壞 70
Fig 5-7 光阻之形狀示意圖 71
Fig 5-8 顯影不完全圖 71
Fig 5-9 發漲效應 72
Fig 5-10 新穎顯影方式示意圖 73
Fig 5-11 完全顯影之結果 73
Fig 5-12 Deep Silicon RIE造成之掀離 74
Fig 5-13 Deep Silicon RIE之成功結果 74
Fig 5-14 接合處之SEM 75
Fig 5-15 環與溝槽截面之SEM 75
Fig 5-16 小圓(彈簧)之SEM全貌 76
Fig 5-17 結構截面的SEM 76
Fig 5-18 Release時結構受到液體表面張力破壞之SEM 77
Fig 5-19 懸浮結構之SEM (a) (b) (c) (d) 78
Fig 6-1電容平行板之示意圖 80
Fig 6-2電容系統能量之示意圖 81
Fig 6-3 The elastic thin ring element [29] 82
Fig 6-4阻抗分析儀之量測結果 83
表目錄
Table 1-1 各種陀螺儀之比較 …………………………… 22
Table 2-1 結構的主要尺寸 (mm) 27
Table 3-1 矽的機械性質表 38
Table 4-1 Pyrex # 7740玻璃成分 [19] 54
Table 7-1 Gyroscope之規格比較表 86

1. 朱銘祥, ”Miniaturization of Control System for Above-Knee Prosthesis”, Report No. NSC 89-2218-E-006-009, Jun 31, 2000.
2. Soderkvist, Jan, “Micromachined Gyroscopes,” Sensors and Actuators A, Vol. 43, 1994, pp. 65-71.
3. M. Niu, et al., “Design and characteristics of Two-gimbals Micro-gyroscopes Fabricated with Quasi-LIGA process”, Solid State Sensor and Actuators,. TRANSDUCERS ’97 Chicago, June 16-19, vol.2, 1997, pp. 891-894.
4. R. Voss, K. Bauer, W. Fiker, T. Gleissner. W. Kupke, M. Ross, S. Sassen, J. Schalk, H. Seidel, E. Stenzel, “Silicon Angular Rate Sensor for Automotive Applications with Piezoelectric Drive and Piezoresistive Read-out”, Transducers 97, Chicago, June 16-19, 1997, pp. 879-882.
5. Paul Greiff, Bernard Antkowiak, James Campbell, and Anthony Petrovich, “Vibrating Wheel Micromechanical Gyro”, Position Location and Navigation Symposium, IEEE, Apr 22-26, 1996, pp.31-37.
6. F. Paoletti, M.-A. Gretillat and N. F. de Rooij, “A Silicon Micromachined Vibrating Gyroscope with Piezoresisitive Detection and Electromagnetic Excitation”, Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) Feb 11-15, 1996, pp.162-167.
7. T. Fujita, et al. “Two-Dimensional Micromechined Gyroscope”, Solid State Sensors and Actuators, TRANSDUCERS ’97 Chicago, June 16-19, 1997, pp.887-890.
8. 徐玉紋, 周元昉, ”微型振動陀螺儀簡介”, 微系統科技協會季刊, 2000, pp.35-43.
9. Walter Wrigley, Walter M. Hollister, William G. Denhard, “Gyroscopic Theory, Design, and Instrumetation”, 1969, pp. 5-7.
10. Putty, Michael W. and Najafi, Khalil, “A Micromachined Vibrating Ring Gyroscope”, Solid State Sensor and Actuator Workshop, Hilton Head, South Carolina, June 1994, pp. 213-220.
11. Maenaka, K. and Shiozawa, T., “ A Study of Silicon Angular Rate Sensors Using Anisotropic Etching Technology,” Sensors and Actuators A, Vol. 43, 1994, pp.72-77.
12. Loper, E. J. and Lynch, D. D., ”Projected System Performance Based on Recent HRG Test Results, ”Proceedings of IEEE / AIAA 5th Digital Avionics Systems Conference, Oct. 1983, pp.18.1.1-18.1.6.
13. W.Geiger, W.U.Butt, A. Gaiβer, J. Frech, M. Braxmaier”Decoupled microgyros and the design principle DAVED”, IEEE, 2001, pp.170-173.
14. Farrokh Ayazi, and Khalil Najafi, ”Design and Fabrication of a High-Performance Polysilicon Vibrating Ring Gyroscope”, IEEE, 1998, pp.621-626.
15. Gregory T. A. Kovacs, ”Micromachined Transducers sourcebook”, 1998, pp.242-248.
16. J. S. Burdess, A. J. Harris, J. Cruickshank, D. Wood, G. Cooper, ”A Review of Vibratory Gyroscopes”, Engineering Science and Education Journal, December, 1994, pp.249-254.
17. Yao Cheng, “Development of LIGA Process for Micro Gyroscope”, Report No.87-YAO Cheng —LIGA, The Micromachining Laboratory of SRRC, Jan 1998.
18. Hsin Lee, Wei-Hua Chieng, “The Analysis and Design of the Micro Vibrating Ring Gyroscope”, A Thesis of Engineering National Chiao Tung University, June, 2000, pp.18-24.
19. Rainer Sturmanth, “The Analysis of Closed Circular Ring Components”, 1993, pp. 21-56.
20. Warren C, Young, Roark, “ Formulas for Stress and Strain”,1989, pp 531-563.
21. Soedel, Wemer, “Vibrations of shells and plates”, 1981, MARCEL DEKKER, Inc., pp. 76-80.
22. 郭仕奇, ”The design fabrication and testing of micro liquid by fluid stretch”, A Thesis of Engineering National Tsing Hua University, Feb, 2001, pp.32-35.
23. 陳立俊, “Microelectronics Materials and Processing”, Nov, 2000, pp.122-125..
24. 王建榮,林慶福,林必宨, “半導體平坦化CMP技術”, Dec, 1999, pp.3.53-3.56..
25. 尤枝彰, “The fbrication of super fine spinneret by UV LIGA process”, A Thesis of Engineering National Tsing Hua University, June, 2001,pp.13-20.
26. 楊啟榮, ”SU-8後膜光阻於微系統UV-LIGA製程的應用”, 科儀新知, 21 (5), 4(1999).
27. 莊達仁, “VLSI 製造技術”, Feb 10, 1990, pp.243-244.
28. Chin-Jun Lin, “The Fabrication Process Research of Optical Micro Displacement Sensor Using Deep Silicon RIE Technology”, A Thesis of Engineering National Tsing Hua University, June, 2001, pp.66-67.
29. J. P. Holman, “Experimental methods for engineers”, 1994, pp.436-438.