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[1] K. Azar, R.S. McLeod, and R.E. Caron, “Narrow Channel Heat Sink for Cooling of High Powered Electronic Components,” in Proc. 8th Annual IEEE Semi-Therm Symp., pp. 12-19, 1992 [2] R. W. Knight, D. J. Hall, J. S. Goodling, and R. C. Jaeger, “Heat Sink Optimization with Application to Microchannels,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, no. 5, pp. 832-842, 1992. [3] Seri Lee, ”Optimum Design and Selection of Heat Sinks,” IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, vol. 18, no. 4, 1995. [4] Ronald M. Nowell, Jr., Sushil H. Bhavnani, and Richard C. Jaeger, “Effect of Channel Width on Pool Boiling from a Microconfigured Heat Sink,” IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, vol. 18, no. 3, Sept. 1995. [5] R. A. Wirtz and Ning Zheng, “Methodology for Predicting Pin-Fin Fan-Sink Performance,” InterSociety Conference on Thermal Phenomena, 1998. [6] David Copeland, ”Optimization of Parallel Heatsinks for Forced Convection, ” Sixteenth IEEE Semi-Thermtm Symposium, 2000. [7] Allan D.Kraus and Avram Bar-Cohen, “Design and Analysis of Heat Sinks”. [8] H. H. Jung and J. G. Maveety, ”Pin-Fin Heat Sink Modeling and Characterization,” Sixteenth IEEE Semi-Thermtm Symposium, 2000. [9] Issam Mudawar, “Assessment of High-Heat-Flux Thermal Management Schemes,” IEEE Transactions on Components and Packaging Technology, vol. 24, no. 2, June 2001. [10] Linan Jiang and Jae-Mo Koo, ”Two Phase Microchannel Heat Sinks for an Electrokinetic VLSI Chip Cooling System,” Seventeeth IEEE Semi-Thermtm Symposium, 2001. [11] Madhusudan Iyengar and Bar-Cohen, “Design for Manufacturability of SISE Parallel Plate Forced Convection Heat Sinks,” IEEE Transactions on Components and Packaging Technology, vol. 24, no. 2, June 2001. [12] 周志霖、洪英輝,「筆記型電腦熱控之多媒體電腦輔助設計研發」,1999,清華大學動機所論文。 [13] 吳東駿、林唯耕,「鰭片阻抗理論與鰭片測試分析」,2001,清華大學工科所論文。 [14] 徐富德、林唯耕,「CPU Cooler熱阻測試模擬系統之設計與研發」,2001,清華大學工科所論文。
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