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研究生:陳祥維
研究生(外文):Chen Shang-Wei
論文名稱:利用邁克生光學干涉法於裸晶封裝中封膠特性的檢測
論文名稱(外文):The Characterization of Flip Chip Package by Michelson Interferometry Analysis
指導教授:吳允中施明昌施明昌引用關係
指導教授(外文):Wu Yun-ZhongShih Ming-Chang
學位類別:碩士
校院名稱:國立海洋大學
系所名稱:光電科學研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:87
中文關鍵詞:疊紋干涉分光鏡邁克生干涉儀環氧樹酯空間濾波器溫度控制器空間濾波器
外文關鍵詞:MoireBeam SplitterMichelson InterferometryUnderfillSpatial FilterTemperature ControllerSpatial Filter
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摘要
本文研究的主要目的是以Michelson干涉的實驗方法來量測與分析覆晶構裝材料的結構受到熱負載作用下的變形行為.我們用Michelson干涉計來得到物體表面變形前,後的干涉圖再用相移干涉術得到相位分佈圖,分析變形前後相位的變化可得到此物體精確的表面輪廓.
當雷射光被分光鏡分成兩道光並投射到參考面與物面,所得到的干涉圖相的每一點都有不同的相位,檢視未變形前與變形後的相位差值,如此,物體的表面變形量就可得到.
利用此原理,用Michelson即時干涉儀及時量測,針對各種溫度加載於試片表面就可得到不同溫度的翹曲變形量及翹曲值.

ABSTRACT
The objective of the present research activity is to develop an effective technique using Michelson interferometer to characterize the thermal-induced deformations and stress distribution in flip chip packaging(FCP) , and the chip size packaging (CSP). Compare to other methods; such as laser spots analysis, more analysis technique, and the holographic method, Michelson interferometer approach is more reliable in whole area and fast time measurement. Michelson interferometer is useful for measuring the micro- displacement on the surface of the specimen under thermal testing process during the temperature cycle. Due to the flip chip package have gained popularity in high speed devices and PC industry, due to its advantages of low cost and high mass production. The issue of flip chip packaging is the global deformation on the chip surface. The deformation can cause an open circuit , and reduces the reliability of the device. By measuring the phase difference of a projected laser light across the deformed surface, high resolution surface profile measurement of the flip chip is obtainable. In addition, the development of an effective soft ware to transfer the phase difference information into real space deformation of the chip surface is essential to the success of this study. It is shown that the Michelson interference surface deformation system is useful to the application in Flip Chip packaging industry.

目 錄
摘要………………………………………………………………Ⅰ
英文摘要……………………………………………………….Ⅱ
誌謝……………………………………………………………….Ⅲ
目錄……………………………………………………………….Ⅳ
圖目錄…………………………………………………………..Ⅶ
表目錄…………………………………………………………ⅩⅠ
第一章 緒論……………………………………………………1
1 — 1 研究動機與目的…………………………………………..1
1 — 2 目前I C封裝之應力量測方法……………………………..3
第二章 基本干涉原理……………………………………..7
2 — 1. 光的干涉……………………………………………………..7
2 — 2 干涉條紋的可見度…………………..………………………9
2 — 3 Michelson 干涉儀…………………………………………..9
2 — 5 Michelson 干涉儀之變形量測…………………………….13
第三章 干涉條紋之相位解析………………………..18
3 — 1 相移干涉術………………..………………………………18
3 — 1 — 1 相移技術的基本觀念………………………………..19
3 — 1 — 2 五步相移法…………………………………………...21
3 — 2 相移展開之處理………………………………………….….23
3 — 2 — 1 濾波……………………………………………………23
3 — 2 — 2 相移干涉相位圖的取得……………………………..25
3 — 2 - 3 相位展開處理………………………………………...31
3 — 3 相位重建演算………………………………………………36
第四章 Flip Chip C S P 之量測…………………40
4 — 1 Flip Chip CSP簡介………………………………………..40
4 — 2 實驗系統架設………………………………………………42
4 — 2 — 1 實驗設備………………………………………………42
4 — 2 — 2 光學系統架設…………………………………………44
4 — 3 實驗步驟……………………………………………………...45
4 - 4 實驗量測結果……………………………………………..…77
第五章 結論……………………………..……………………83
參考文獻………………………………………………………84

參考資料
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