由於光通訊提供長距離且高頻寬的特性，大幅改變了人類的生活品質。本論文中主要討論高速光收發機研製，在發射端的選擇為一雷射驅動積體電路(Integrated Circuit,IC)和1310nm法布里-珀羅雷射光次積組(Fabry-Perot Laser Optical Sub-Assembly,FP-LASER OSA)構成，接收端為一限幅放大器IC和PIN光二極體+轉阻放大器(PIN+TransImpedance Amplifier) OSA組成，基底部分則使用FR4的板材。
由於傳輸速率不斷提昇，傳統的佈線(layout)方法可能會使高速傳輸的電路產生反射及一些雜訊等問題。在高速信號傳輸下對於微帶線的設計和印刷電路板(Printed Circuit Board,PCB)的佈局顯得格外重要，經由正確選擇工作點和PCB佈局來發揮IC的最佳特性及穩定性，在必要時也需加上一些補償措施來達到較佳的結果。

Due to its high-bandwidth and long-range characteristics, optical communication plays an important part in our daily lives and improves the quality of lives for humans. In this thesis,we decomposed the implementation of the optical transceiver circuits into two parts,the transmitter part and the receiver part. The transmitter includes a driver and a 1310nm FP Laser OSA(Fabry-Perot ooptical Sub-Assembly),the other part,the receiver,composed of a limiting amplifier and a PIN+TIA (PIN+TransImpedance Amplifier)OSA. The substrate for the transceiver is made of FR4.
The need for speed is growing very vastly,traditional layout with less concern to the length constraint 、rules and so on may give rise to reflection and some other noise problems in high speed circuits. At high speed transmission,microstrip line design and component placing on PCB(Printed Circuit Board) are important. With properly selecting biased point and enforcing correct PCB design,the best performance of IC on 2-layer PCB can be achieved,and several compensation if it is needed.

中文摘要……………………………………………...………………….I
英文摘要………………………………………………………………...II
致謝......................................................III
目錄……………………………………………………………………..IV
第一章 緒論…………………………………………………...1
1.1 研究動機與目的………………………………………….1
1.2 論文架構………………………………………………….4
第二章 光收發機之光源與二極體分析………………….....5
2.1 概要………….……………………………………………5
2.2 光發射機元件.……………………………………………6
2.2.1 光源之分析…….………………………………….6
2.2.2 FP Laser Cavity……….…………………………....8
2.3 雷射的靜態和動態響應………..………………….……11
2.3.1 雷射的靜態響應……………..…………………..11
2.3.2 雷射的動態響應…………………..……………..13
2.4 PIN光二極體…………………………………..………...18
第三章 收發機之組成及分析……………………………….21
3.1 發射端IC的選擇和分析……………….……….………21
3.2 雷射二極體的選擇……………...………………….…...26
3.3 發射端電路之設計………………...……………….…...29
3.3.1 調變電路之設計………………...……………….29
3.3.2 電源和其他控制電路之設計……...…………….36
3.4 接收端IC的選擇和分...………………………………...38
3.5 光二極體模組的選擇……...……………………….…...41
3.6 接收端電路之設計…………...…………………….…...43
第四章 PCB Layout之設計及測……...…………………..46
4.1 差動信號Layout之設計……………..…………….……46
4.2 傳輸線對差模及共模輻射的影響………………….…..52
4.2.1 差模輻射…………………………………………..52
4.2.2 共模輻射………………………………….………...53
4.3 Image Plane對傳輸線的影響和Termination………..……54
4.3.1 Image plane的介紹…………………..………..…….54
4.3.2 影像平面對傳輸線電感的影響………………..…..55
4.3.3 輻射量和slot所造成的影響…………………..…61
4.3.4 Termination………………………………………..…64
4.4 電源的設計…………………..……………….…………..65
4.5 發射端電路和接收端電路之佈線設計…...………….….73
4.6 光接收機和光發射機之量測……………...………….….76
第五章 結論………………………………………………….80
參考文獻
附錄A
附錄B

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