摘 要
本論文主要在探討各種不同型式之散熱鰭片對筆記型電腦散熱模組性能的影響，包含各種不同型式鰭片，在風扇轉速為4200rpm(3.5V)、5200rpm(5V)下，散熱模組之溫度分佈及鰭片熱阻與總熱阻值之差異比較。以提供往後對筆記型電腦散熱模組之設計做參考。
本研究將分為兩大實驗，Case(1)主要改變鰭片之型式，分別為正常型式、交錯型式、凸點型式，比較改善其熱阻值。Case(2)主要是改變鰭片角度之型式，找出最佳的迎風角度，最後再將最佳角度之鰭片型式與無傾斜(0度)之鰭片作不同比例分配之混合，以找出最佳的比例分配。
實驗結果顯示得知，(1)交錯型式能明顯有效的改善鰭片熱阻值。(2)凸點型式也改善其鰭片熱阻，但沒有交錯型式明顯。而且當凸點數目增加，鰭片熱阻反而隨之增加，無法較有效的改善。(3)改變鰭片角度之型式，當在角度為10度、15度時，為最佳的迎風角度。當角度20∼45度時，鰭片熱阻也將隨著角度增加而變大。(4)角度為10度、15度之鰭片與角度為0度的鰭片混合時的最佳的比例分配，為當10度、15度佔總鰭片串長的2/3時，其熱阻值比在沒有混合時來的好。

Abstract
This report investigate the effect of different types of fins on the thermal performance heat sinks of notebook computers. The temperature distributions within the heat sink, the thermal resistance of the fin and the thermal resistance of the entire heat sink module is studied experimentally.
The experimental results show that:(1)Offset-strip fins type can reduce the thermal resistance since it can provide higher heat transfer coefficients.(2)Dimpled fins also can reduce the thermal resistance, but no as significant as that for offset-strip fins.(3)Tilted fins have better thermal performances when the tilted angle is 10o and 15o. For tilted angles between 20o ~ 45o, the thermal resistances become higher.(4)For mixed-type fins(by mixing different proportions of 10o and 15o tilted fins with 0o fins),the best proportion of titled fin 2/3

目 錄
誌謝 I
摘要 III
Abstract V
目錄 VI
表目錄 IX
圖目錄 XI
符號索引 XXII
第一章 緒 論 1
1.1 前言 1
1.2 文獻回顧 4
1.2.1 熱管 4
1.2.2 鰭片 8
1.3 研究動機及目的 20
1.4 內容大綱 21
第二章 理論分析 23
2.1 熱網路模型 24
2.2 熱傳導 26
2.2.1 內阻抗 26
2.2.2 接觸阻抗 27
2.2.3 熱管阻抗 30
2.2.4 散熱鰭片之效率 30
2.3 熱對流 32
第三章 實驗設備與方法 35
3.1 實驗設備 35
3.2 鰭片的製作 41
3.3 熱管製作、模組製作及組裝 42
3.4 實驗安裝過程 44
3.4.1模組安裝過程 44
3.4.2 模組性能測試過程 46
3.4.3風扇性能測試過程 47
3.5 熱電偶之校正 48
第四章 實驗結果與討論 49
4.1 各種不同型式之散熱鰭片 50
4.1.1 交錯型式之鰭片 50
4.1.2 凸點型式之鰭片 50
4.1.3 改變角度之鰭片 51
4.2 實驗結果分析 51
4.2.1 各種不同型式鰭片的散熱模組之溫度分佈 51
4.2.2 各種不同型式鰭片的散熱模組之熱阻 56
4.2.3 各種模組之流量測試結果 61
第五章 結論與建議 62
5.1 結論 62
5.2 建議 64
參考文獻 66
作 者 簡 介 186

參考文獻
[1] Gaugler, R.S., US Patent Application. Dec.12,1942. Published US Patent NO.2350348, June 1944.
[2] Grover, G. M., and Cotter T. P., and G.F. Erickson, “Structure of Very High Thermal Conductance.” J. App. Phys. Vol.35, p1990,1964.
[3] Grover, G. M., US Patent NO.3229759. Filed 1963.
[4] Tien, C. L., and Sun, K. H., “Minimun Meniscus Radius of Heat Pipe with a Wicking Materials.”Int. J. Heat Mass Transfer 14, pp.1853-1855,1970.
[5] Cotter, T. P., “Principles and Prospects for Micro Heat Pipes,”Proc. 5th Int.Heat Pipe Conf., Tsukuba, pp.328-335, Japan, 1984.
[6] 依日光譯,熱管技術理論實務,日本熱管技術協會編,復漢出版社,1986.
[7] Peterson, G. P., and Wu, D., “Experimental Investigation of the Transient Behavior of Micro Heat Pipe,” Proc. AIAA/ASME 5th Joint Thermophysics and Heat Transfer Conf., Seattle, WA, 1990.
[8] 陶謙,微熱管性能測試與筆記型電腦散熱應用,工研院研究報告,1996.
[9] Mochizuki, M., Saito,Y., Goto, K., and Ngyen, T.,“Hinged Heat Pipes for Cooling Notebook PCs,”Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII.,pp.64-72,1997
[10] Cao, Y., Gao, M., Beam, J.E., and Donovan, B.,“Experiments and Analysis of Flat Miniature Heat Pipes,”AIAA Journal of Thermophysics and Heat Transfer, Vol.ll, No.2, pp.l58-164, 1997.
[11] Cao, Y., Gao, M., and Pinilla, E., “Fabrication and Test of a Filling Station for Micro/Miniature Devices”, Proceedings of the 32nd Intersociety Energy Conversion Engineering Conference,IECEC-97., vol.2, pp.1509-1513,1997.
[12] Xie, H.,“The Use of Heat Pipes in Personal Computers,” 1998 Intersociety Conference on Thermal Phenomena, 1998.
[13] Toth, J., DeHoff, R., and Grubb,K.,“Heat Pipes:Then Silent Way to Manage Desktop Thermal Problems,”1998 Intersociety Conference on Thermal Phenomena,1998.
[14] Namba, K., Kimura, N., Nickawa, J., Yuichi, K., and Hashimoto, N., “Heat-Pipes for Electronic Devices Cooling and Evaluation of Their Thermal Performance,”The Sixth Intersociety Conference on Thermal Phenomena in Electronic Systems, 1998. ITHERM’98., pp.456-459,1998.
[15] Nguyen, T., Mochizuki, M., Mashiko, K., Saito, Y., Sauciuc, I.,and Boggs, R., “Advanced Cooling System Using Miniature Heat Pipes in Mobile PC,”6th Intersociety Conference on Thermal Phenomena in Electronic Systems,pp.507-511,1998.
[16] Xie, H, Mostafa, A., Wendy, L., and Kevin, H., “Thermal Solutions to Pentium Processors in TCP in Notebooks and Sub-Notebooks,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, part A, Vol.19, No.1, pp. 54-65. March 1999.
[17] Namba, K., Nickawa, J., Kimura, Y., and Hashimoto, N.,“Heat-Pipes for Eletronic Devices and Evaluation of Their Thermal Performance,”IEEE Transactions on Components and Packaging Technologies,Vol.23,No.1,pp.91-94, 2000.
[18] Ioan Sauciuc, Masataaka Mochizuki, Kouich Mashiko, Yuji Satio, and Thang Nguyen, “The Design Testing of the Super Fiber Heat Pipes for Electronics Cooling Application, ”Fujikura America Inc,2000.
[19] 李青洲,熱管之最大熱傳量與有效長度之關係,國立台灣科技大學機械工程研究所碩士學位論文,2000.
[20] 賴錦川,燒結式微熱管毛細結構參數之影響研究,國立台灣大學機械工程研究所碩士學位論文,2000.
[21] 詹瑞華,燒結式微熱管之熱傳增強研究, 國立台灣大學機械工程研究所碩士學位論文,2001.
[22] 陳松柏,小型金屬網目式熱管之熱傳性能及其滲透率之決定,國立台灣科技大學機械工程研究所碩士學位論文,2001.
[23] Haper, D. R. and Brown, W. B., “Mathematical Equation for Heat Conduction in the Fins if Air Cooled Engines,”NACA Report No.158,1922
[24] Murry, M. N. “Heat Transfer Through an Annular Disk or Fin of Uniform Thickness,”Trans.ASME,J.Applied Mech.,60,A78,1938.
[25] Haley, K.W., and Westwater, J.W.,“Heat Transfer form a Fin to a Boiling Liquid”, Chemical Engineering Science, 20,pp.711,1965.
[26] London, A. L. and Shah, R. K.,“Offset Rectangular Plate-Fin Sur-faces-Heat Transfer and Flow Friction Characteristics,” J. Engineering for Power, pp. 218-228,1968.
[27] Bar-Cohen, A.,“Fin Thickness for an Optimal Natural Convection Array of Rectangular Fins,”ASME J. Heat Transfer,Vol. 101,pp.564- 566,1976.
[28] Loehrke, R. I., Roadman, R. E. and Read, G. W.,“Low Reynolds Number Flow in Plate Wakes,”ASME Paper 76-WA/HT- 30,November, 1976.
[29] Sparrow, E. M., Baliga, B. R., Patankar, S.V., “Heat Transfer and Fluid Flow Analysis of Interrupted-Wall Channels,”With Application to Heat Exchangers, J. Heat Transfer,pp.4-11,1977.
[30] Patankar, S. V., Liu, C.H. and Sparrow, E. M., “Fully Developed Flow and Heat Transfer in Ducts Having Streamwise-Periodic Variation of Cross-Sectional Area,”J. Heat Transfer, pp. 180—186 ,1977.
[31] Cur, N. and Sparrow, E. M.,“Measurements of Developing and Fully Developed Heat Transfer Coefficients Along a Periodically Inter- rupted Surface, ”J. Heat Transfer, Vol. 101, pp. 211-216, 1979.
[32] Sparrow, E. M., C. H. Liu,“Heat-Transfer, Pressure Drop, and Perfor-Mance Relationships for in-Line, Staggered,and Continuous Plate Heat Exchangers,”Heat Mass Transfer,pp.1613-1625,1979.
[33] Sparrow, E. M. and Hajiloo, A., Measurement of Heat Transfer and Pressure Drop for an Array of Staggered Plates Aligned Parallel to an Air Flow, J. Heat Transfer,pp. 426-432,1980.
[34] Patankar, S. V. and Prakash, C.,“An Analysis of the Effect of Plate Thickness on Laminar Flow and Heat Transfer in Interrupted-Plate Passages,”Int. J. Heat Mass Transfer, Vol. 24, No. 11, pp. 1801- 1810.1981.
[35] Webb, R. L. and Joshi, H. M.,“A Friction Factor Correlation for the Offsett Strip-Fin Matrix,”J. Heat Transfer, pp. 257-262, 1982.
[36] Mochizuki, S. and Yagi, Y.,“Characteristics of Vortex Shedding in Plate Fin Arrays,”Flow Visualization II, Edited by Wolfgang Merzkirch, Vol. 2, pp. 99-103. Hemisphere, New York,1982.
[37] Zeienka, R. L. and Loehrke, R. I.,“Heat Transfer from Interrupted Plates,”J. Heat Transfer, Vol. 105, pp.172-177, 1983.
[38] Bar-Cohen, A., and Jelinek, M.,“Optimum Arrays of Longitudinal Fins in Convective Heat Transfer,”Heat Transfer Engineering,Vol. 6,pp. 68-78,1985.
[39] Leung, C. W.,and Probert, S. D.,“Heat Transfers from Shrouded Rectangular-Fin Arrays,”Applied Energy 24, pp.77-81, 1985.
[40] Ronald Pound,“Thermal Management Balance Cooling and Size Demand,” Electronic Packaging and Production, Vol. 25(9), pp. 112-116, September, 1985.
[41] Mullisen, R. S. and Loehrke, R. I., “A Study of the Flow Mecha-nisms Responsible for Heat Transfer Enhancement in Inturrepted-Plate Heat Exchangers,”J. Heat Transfer, Vol. 108, pp. 377-385,1986.
[42] Mullison, R. S. and Loehrke, R. I.,“A Transient Heat Exchanger Evaluation Test for Arbitrary Fluid Inlet Temperature Varation and Longitudinal Core Conduction,”J. Heat Transfer, Vol. 108, pp. 370-376,1986.
[43] Himansu M. Joshi and Ralph L. Webb,“Heat Transfer and Friction in the Offset Strip-Fin Heat Exchanger,”Int. J. Heat Mass Transfer,Vol. 30 No.1,pp.69-84, 1987.
[44] Leung, C. W., and Probert, S. D.,“Heat Exchanger Design: Optimal Uniform Thickness of Vertical Rectangular Fins Protruding Perpendicularly Outwards , at Uniform Separations ,From a Vertical Rectangular, Base”Applied Energy, No. 26, pp.111-118,1987.
[45] Wenvick V. P.,“Cooling Hardware Removes Heat From Cabinets,” Electronic Packaging and Production, pp. 63-64, August, 1987.
[46] Linhard, I.N.,“Things We Don''t Know About Boiling Heat Transfer: 1988,” Int. Comm. Heat transfer,pp.401-428,1988.
[47] Xi, G.N. and Suzuki, K.,“A Flow Visualization Experiment Study of Compact Heat Exchanger,”Proceeding of the 2nd Int.Symposium on Heat Transfer,pp.638-643,1988.
[48] Leung, C. W., and Probert, S. D.,“Heat Exchanger Design:Optimal Thickness(Under Natural Convective Conditions) of Vertical Rectangular Fins Protruding Upwards from a Horizontal Rectangular Base,”Applied Energy, No. 29, pp. 299-306, 1988.
[49] Leung, C. W., and Probert, S. D.,“Heat Exchanger Design:Optimal Length of an Array of Uniformly-Spaced Vertical Rectangular Fins Protruding Upwards from a Horizontal Base,”Applied Energy, No. 30, pp. 29-35, 1988.
[50] Xi, G. N., Suzuki, K., Hagiwara, Y. and Murata, T.,“Experimental Study on Heat Transfer Characteristics of Offset Fin Arrays-Effect of Fin Thickness in the Low and Middle Ranges of Reynolds Number,”J. Heat Transfer, Vol. 4, pp. 81-86, 1990.
[51]姜信騰,“筆記型電腦散熱設計”,電子發展月刊,Vol. 167,pp.1-15,November,1991.
[52] Knight, R. W., Goodling, J. S., and Hall, D. J.,“Optimal Thermal Design of Forced Convection Heat Sinks-Analytical,”Journal of Electronic Packaging, Vol. 113, No. 3, pp.313-321, September 1991.
[53] Sullivan,P. F., Ramadhyani, S. and Incropera, F. P., “Use of Smooth and Roughened Spreader Plates to Enhance Impingement Cooling of Small Heat Sources with Single Circular Liquid Jets,”ASME Topics in Heat Transfer,HTD-Vol.206-2,pp.103-110,1992.
[54] Knight, R. W., Goodling, J. S., and Gross, B. E.,“Optimal Thermal Design Air Cooling Forced Convection Finned Heat Sinks- Experimental Verification,”IEEE Transactions on Components, Hybrids , and Manufacturing Technology, Vol. 15, No. 5, October 1992,pp. 754-760.
[55] Hagiwara, Y., Xi, G. N., Futagarni, S. andd Suzuki, K., “an Experimental Study off Flow Characteristics of Offset Fin and in-Line Fin Arrays,”(Effects of Fin Thickness and Fin Pitches on Flow Instability)(in Japanese),Trans. JSME,B59,pp.220-225,1993.
[56] Bejan, A. and Morega, A. M.,“Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection,”J. Heat Transfer, Vol.115, No. 1, pp. 75-81, February 1993.
[57] Jubran, B. A., Hamdan, M. A., and Abdualh, R. M.,“Enhanced Heat Transfer, Missing Pin, and Optimization for Cylindrical Pin Fin Arrays,”J. Heat Transfer,Vol.115,No.3, pp.576-583, August 1993.
[58] 林正,“可攜帶電子裝備之散熱設計”,電腦與通訊,Vol. 32,pp.78-94,September,1994.
[59] Strassberg D.,“Cooling Hot Microprocessors”,EDN,Vol. 39(2), pp. 40-50, January 20, 1994.
[60] Mohanial S. Mansuria and Vinod Kamath,“Design Optimization of a High-Performace Heat-Sink/Fan Assembly,” Heat Transfer in Electronic Systems of ASME, Vol. 292, pp. 95-104,1994.
[61] Lee, S.,“Optimum Design and Selection of Heat Sinks,”IEEE Transaction on Components, Packaging, and Manufacturing Technology-Part A, pp. 812-817, 1995.
[62] Yeh, R. h., and Chang, M.,“Optimum Longitudinal Convective Fin Arrays,”International Communications in Heat and Mass Transfer, Vol. 22, No. 3, pp. 445-460,1995.
[63] 林唯耕“電腦中央處理器(CPU)冷凝器(Cooler)之熱效率及熱傳模式評估,”國科會NSC85-2815-C007-01-056E,1996.
[64] 林唯耕,“鰭片理論應用於CPU散熱片之分析研究,”國科會NSC86-2815-C007-01-060E,1997.
[65] Sterner John,“Thermal Design Challenges in a Pentium Notebook Computer,” Proceedings of the International Systems Packaging Symposium, pp. 107-112,1997.
[66] Madhusudan, I., and Bar-Cohen, A.,“Least-Material Optimization of Vertical Pin-Fin, Plate-Fin and Triangular-Fin Heat Sinks in Natural Convective Heat Transfer,”IEEE International Society Conference on Thermal Phenomena, pp. 295-302, 1998.
[67] Fisher, T. S. and Torrance, K. E.,“Free Convection Limits for Pin-Fin Cooling,”J. Heat Transfer, Vol. 120, No. 3, pp. 633-640, August 1998.
[68] Rujano, J. R.,“Development of Thermal Management Solution for a Ruggedized Pentium Based Notebook Computer,”IEEE International Society Conference on Thermal Phenomena, pp.8 -14,1998.
[69] 莊昀儒,PC風扇性能測試之研究,國立清華大學工程與系統科學所碩士論文,1998.
[70] Chou, F. C., Lukes, J. R., and Tien, C. L.,“Heat Transfer Enhancement by Fins in the Microscale Regime,”J. Heat Transfer, Vol. 121, No. 4, pp. 972-977, November 1999.
[71] Biber, C. R., and Fijol, S.,“ Fan-plus Heat sink Optimization,” Mechanical and Thermal Design with Reality Proceedings of the International Systems Packaging Symposium , pp. 285-289, 1999.
[72] Tasaka, M., Aihara, T.,and Hayashi, C.,“Heat Transfer and Pressure Lose Characteristics of Very Compact Heat Sinks,”Heat Transfer- Asian Research, Vol.28, No. 8, pp. 687-705, 1999.
[73] Craig, K. J., and Kock, D,“Minimization of Heat Sink Mass Using CFD and Mathematical Optimization,”J. Electronic Packaging, Vol.21, pp. 143-147, 1999.
[74] Iwasaki, H., Ishizuka, M.,“Forced Convection Air Cooling Characteristics of Plate Fins for Notebook Personal Computer,” IEEE International Society Conference on Thermal Phenomena, pp. 21-26,2000.
[75] Ken, T., Ishizuka, M.,“Optimization of Parallel Plate Heat Sinks for Forced Convection,”IEEE International Society Conference on Thermal Phenomena, pp. 266-271, 2000.
[76] El-Sheikh, H. A. and Garimella, S. V.,“Enhancement of Air Jet Impingement Heat Transfer Using Pin-Fin Heat Sinks,”IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 2, pp. 300-308, June 2000.
[77] Kodo, Y., Marsushima, H., and Komatsu, T.,“Optimization of Pin-Fin Heat Sink for Impingement Cooling of Electronic Packages,”J. Electronic Packaging, Vol. 122, pp. 240-246, September 2000.
[78] Jonsson, H. and Plam, B.,“Thermal and Hydraulic Behavior of Plate Fin and Strip Fin Heat Sinks Under Varying Bypass Conditions, ” IEEE Transactions on Components and Packaging Technologies,Vol. 23, No. 1, pp. 47-54, March 2000.
[79] 劉建佳,Pentiun 4散熱模組底板具凸起霧之散熱性能研究, 國立台灣科技大學機械工程研究所碩士學位論文,2001.