|
1. 賴文貴, 翁榮州, 工業材料, 177期, 145頁, 2001年。 2. E. Chassaing and R. Wiart, Electrochimica Acta, 29(5), 649 (1984). 3. H. C. Xu, G. Seshadri, and J. A. Kelber, Journal of The Electrochemical Society, 147(2), 558 (2000). 4. J. Barthelmes, Trans IMF, 78(4), 135 (2000). 5. K. I. Popov, M. G. Pavlovic, E. R. Stojilkovic and Z. Z. Stevanovic, Hydrometallurgy, 46, 321 (1997). 6. H. Wendrock, W. Bruckner, M. Hecker, T. G. Koetter, H. Schloerb, Microelectronics Reliability, 40, 1301 (2000). 7. M. Ward, C. J. Roberts and D. R. Gabe, Journal of Applied Electrochemistry, 30, 457 (2000). 8. T. Battal, O. T. Inal and P. Rangaswamy, Scripta Materialia, 43, 711 (2000). 9. R. J. Nichols, E. Bunge, H. Meyer and H. Baumgartel, Surface Science, 335, 110 (1995). 10. P. Zeppenfeld, V. Diercks, Ch. Tolkes, R. David and M. A. Krzyzowski, Applied Surface Science, 130-132, 484 (1998). 11. L. Gerth and F. Lapicque, Journal of The Electrochemical Society, 143(12), 3910 (1996). 12. Ph. Goudeau, J. Mimault, Th. Girardeau, K. Reklaoui, O. Proux and V. Branger, Thin Solid Films, 275, 25 (1996). 13. L. Aries, J. Roy, J. Sotoul, V. Pontet, P. Costeseque and T. Aigouy, Journal of Applied Electrochemistry, 26, 617 (1996). 14. J. Zhang, K. S. Teng and Th. J. O’ Keefe, Surface and Coatings Technology, 89, 225 (1997). 15. L. Muresan, G. Maurin, L. Oniciu and Silvia Avram, Hydrometallurgy, 40, 335 (1996). 16. S. Varvara, L. Muresan, A. Nicoara,G. Maurin and I. C. Popescu, Materials Chemistry and Physics, 72, 332 (2001). 17. T. Y. B. Leung, M. Kang, B. F. Corry and A. A. Gewirth, Journal of The Electrochemical Society, 147(9), 3326 (2000). 18. M. Scendo and J. Malyszko, Journal of The Electrochemical Society, 147(5), 1758 (2000). 19. A. L. Portela, G. I. Laccon and M. L. Teijelo, Journal of The Electroanalytical Chemistry, 495, 169 (2001). 20. W. Plieth, Electrochimica Acta, 37(12), 2115 (1992). 21. S. A. Campbell, E. E. Farndon, F. C. Walsh and M. Kalaji, Trans IMF, 75(1), 10 (1997). 22. G. Fabricius, K. Kontturi and G. Sundholm, Journal of Applied Electrochemistry, 26, 1179 (1996). 23. G. M. Brown, G. A. Hope, D. P. Schweinsberg and P. M. Fredericks, Journal of The Electroanalytical Chemistry, 380, 161 (1995). 24. J. J. Kelly and A. C. West, Journal of The Electrochemical society, 145(10), 3477 (1998). 25. H. M. Wu, M. L. Lay and C. H. Huang, Plating and Surface Finishing, 79(9), 66 (1992). 26. US Patent 6,231,742 B1, (2001). 27. J. J. Steppan, L. C. Hall and J. A. Roth, Journal of The Electrochemical Society, 138(9), 2635 (1991). 28. E. D. Eliadis, R. G. Nuzzo, A. A. Gewirith and R. C. Alkire, Journal of The Electrochemical Society, 144(1), 96 (1997). 29. M. Peykova, E. Michailova, D. Stoyhev and A. Milchev, Electrochimica Acta, 40(16), 2595 (1995). 30. S. Goldbach, W. Messing, T. Daenen and F. Lapicque, Electrochimica Acta, 44, 323 (1998). 31. C. Alonso, M. J. Pascual and H. D. Abruna, Electrochimica Acta, 42(11), 1739 (1997). 32. J. J. Kelly and A. C. West, Journal of The Electrochemical society, 145(10), 3472 (1998). 33. J. J. Kelly, Ch. Tian and A. C. West, Journal of The Electrochemical society, 146(7), 2540 (1999). 34. Sh. Ch. Kou and A. Hung, Plating and Surface Finishing, 87, 140 (May 2000). 35. M. S. Aroyo, Plating and Surface Finishing, 82, 53 (November 1995). 36. J. D. Reid and A. P. David, Plating and Surface Finishing, 74, 66 (January 1987). 37. T. Akiyama, S. Kobayashi, J. Ki, T. Ohgai and H. Fukushima, Journal of Applied Electrochemistry, 30, 817 (2000). 38. D. Stoychev and C. Tsvetanov, Journal of Applied Electrochemistry, 26, 741 (1996). 39. D. Stoychev, Trans IMF, 76(2), 73 (1998). 40. T. Pearson and J. K. Dennis, Surface and Coatings Technology, 42, 69 (1990). 41. G. A. Hope, G. M. Brown, D. P. Schweinsberg, K. Shimizu and K. Kobayashi, Journal of Applied Electrochemistry, 25, 890 (1995). 42. L. Mirkova and St. Rashkov, Journal of Applied Electrochemistry, 24, 420 (1994). 43. L. Oniciu, L. Muresan, Journal of Applied Electrochemistry, 21, 565 (1991). 44. Xingpu Ye, M. De Bonte, J. P. Celis and J. R. Roos, Journal of The Electrochemical society, 139(6), 1592 (1992). 45. C. H. Huang, J. R. Jan, W. Y. Shu, H. M. Wu, Journal of Materials Science, 36, 4385 (2001).
|