臺灣博碩士論文加值系統

本研究利用氣體電漿誘導進行高分子材料表面改質及殺菌處理，探討電漿操作參數對基材表面性質如潤濕性、阻氣性及印刷適性等特性之影響，進一步引用電漿進行表面殺菌作業的效果分析。
高分子包裝材料經電漿進行表面處理，可發現改質後對高分子包裝材料之潤濕性有顯著的效果，而且電漿提升基材潤濕性的效果並不隨時間消失，基材的氣體滲透率及表面印刷性也能藉此提升。進一步以FT-IR 及SEM 照片為改質高分子包裝材料的整體完整性提供確認。如能善用電漿的處理改質效果，將能針對高分子包裝材料之表面性質進行改質，擴展其應用性。
經由氧氣電漿進行表面殺菌處理，由實驗結果明顯的發現電漿在殺菌作業上的優勢。實驗結果可發現電漿操作功率加大及電漿殺菌時間加長皆能造成微生物殺滅量的相對增加，其中又以電漿殺菌時間對於殺菌效率的提昇更為顯著，加上證明電漿於熱敏感性物質殺菌上的適用性，顯現電漿有效的提供一可替換傳統高溫殺菌法的選擇，在性質上以低溫、快速、無殘留、適用性廣等優點，有別於傳統殺菌法的種種限制。

This research ran surface modification and sterilization by gas plasma and discussed substrate’s surface properties, such as wettability, barrier properties and printability and then analyses the result of plasma sterilization.
We found plasma surface modification can develop polymer’s wettability significantly by treating polymer’s surface with plasma. The efficiency of polymer’s wettability by plasma wouldn’t disappear with time. The barrier properties and printability of polymer substrate could be improved by plasma treatment, too. Furthermore, we confirmed it was work in modifying polymer pack material by FT-IR and SEM. If we applied the plasma modification well, we could modify polymer pack material’s surface properties, and expand the application.
However, we proceeded sterilization treatment by oxygen plasma, and we found that it had the advantage of using plasma on sterilization in
our experiment results. From our experiment results, we could find that the plasma operation power is not the main point, nevertheless, increasing plasma exposure time could enhance microorganism mortality. It was also proved that it was suitable using plasma sterilization on
thermo-impressibility material and show plasma give a good choice instead of conventional heat sterilization. Plasma sterilization had lots of
advantages, such as lower temperature, fast, no survival, adaptation extensively, and differ from conventional sterilization which had lots of restrictions.

總目錄

中文摘要 I
英文摘要 II
誌謝 III
總目錄 IV
表目錄 VII
圖目錄 VIII
第一章 緒論 1
第二章 文獻回顧 3
2-1 電漿基本原理 3
2-1-1 原理 3
2-1-2 電漿化學 4
2-1-3 電漿設備基本組成及操作參數 6
2-2 表面改質 9
2-2-1 電漿技術於高分子材料之應用 10
2-2-2 高分子的親水性理論 12
2-2-3 電漿表面處理 13
2-3 殺菌處理 15
2-3-1 傳統殺菌方法回顧 15
2-3-2 殘留曲線 22
2-3-3 革蘭氏染色法 23
2-3-4 微生物與氧氣 25
2-3-5 電漿殺菌 28
2-3-6 電漿殺菌商業化機台 32
2-3-7 電漿殺菌原理 37
2-3-8 電漿殺菌與材料老化 48
第三章 實驗材料與方法 51
3-1電漿改質 51
3-1-1 電漿改質進行步驟 51
3-1-2 電漿改質主要討論研究方向 54
3-2 電漿殺菌 55
3-2-1 微生物培養與計數 56
3-2-2 電漿殺菌過程 59
3-3 儀器 62
第四章 結果與討論 65
4-1 接觸角分析 65
4-2 老化試驗 68
4-3 透氣性試驗 70
4-4 官能基性質之量測 72
4-5 表面印刷性測試及SEM分析 74
4-6 電漿殺菌處理 77
4-6-1 基材與電漿殺菌預測試結果 77
4-6-2 以電漿進行E. coli殺菌處理 79
4-6-3 以電漿進行B. subtilis殺菌處理 84
4-7 電漿殺菌對指標菌外觀型態之影響 86
4-8 電漿殺菌與材料老化 88
第五章 結論 91
參考文獻 93


表目錄
表2-1-1 電漿之種類及其性質................................................4
表2-2-1 高分子包裝材料經電漿處理之文獻整理...............11
表2-3-1 各殺菌法特點比較....................................................21
表2-3-2 微生物與氧氣的關係................................................26
表2-3-3 電漿殺菌相關文獻....................................................29
表4-3-1 不同PP 基材之透氣性試驗.....................................71
表4-6-1 不同菌液沾滴位置之電漿殺菌效率表現，數
字均為log 值.............................................................78


圖目錄
圖2-1-1 電漿機台結構簡圖....................................................8
圖2-2-1 四種含極性基團化合物之立體圖............................12
圖2-3-1 高壓蒸氣滅菌器的流程............................................16
圖2-3-2 紫外線不同波長的殺菌效果....................................18
圖2-3-3 過濾法裝置圖............................................................19
圖2-3-4 過濾後膜材的掃描式電子顯微鏡照片...................20
圖2-3-5 殘留曲線示意圖........................................................22
圖2-3-6 革蘭氏染色法圖解....................................................23
圖2-3-7 革蘭氏陽性及陰性菌細胞壁比較圖解...................24
圖2-3-8 革蘭氏陽性菌（藍色）和革蘭氏陰性菌（紅
色）的顯微照片，菌種分別為金黃色葡萄球
菌（ Staphyloccus aureus ） 和大腸桿菌
（Escherichia coli）..................................................24
圖2-3-9 有毒氧代謝產物與的反應....................................26
圖2-3-10 氧氣對於細菌生長的影響，試管中為固體培
養基，氧氣只存在於表面和表面下有限的距
離................................................................................27
圖2-3-11 電漿殺菌機樣本圖....................................................28
圖2-3-12 嬌生公司所推出之Sterrad®系統.............................33
圖2-3-13 Sterrad®電漿殺菌機台殺菌週期圖..........................33
圖2-3-14 以Sterrad®進行殺菌在擴散期後之微生物殘
留曲線，縱軸是殘留菌數之log 值，橫軸以
不同之過氧化氫水溶液濃度表現之.......................34
圖2-3-15 以Sterrad®進行殺菌在電漿期後之微生物殘
留曲線，縱軸是殘留菌數之log 值，橫軸以
不同之電漿處理時間表現之....................................35
圖2-3-16 電漿殺菌原理假想圖................................................38
圖2-3-17 微生物遺傳物質（DNA）與保護層圖解...............39
圖2-3-18 枯草桿菌電子顯微鏡照片........................................39
圖2-3-19 O2-N2（0.7%O2）電漿下游區殘留曲線，孢
子懸浮液之不同稀釋度造成的影響.......................41
圖2-3-20 B. subtilis 孢子電漿下游區殘留曲線，進氣
組成之不同造成的影響............................................41
圖2-3-21 三相殘留曲線，搭配每一相所作用的機制...........42
圖2-3-22 B. subtilis 孢子電漿下游區殘留曲線，進氣
組成之不同造成的影響，縱軸是Number of
survivors，橫軸是Exposure time，以分為單
位................................................................................43
圖2-3-23 常壓電漿殘留曲線，橫軸是Exposure time，
以分為單位................................................................44
圖2-3-24 B. subtilis 由UV 殺菌燈殺滅之殘留曲線，
τ為D 值對應的所需照射UV 劑量.......................45
圖2-3-25 殺菌時微生物受到活性物種侵蝕之假想圖...........45
圖2-3-26 左圖是E. coli 未經電漿處理時之SEM 照
片，右圖則為經過電漿處理（30 秒之常壓
電漿）後之SEM 照片.............................................46
圖2-3-27 Bacillus subtilis 孢子：（a）未經處理；（b）
經15 min 純O2 電漿處理；（c）經15 min
O2/CF4 電漿處理;（d）經Sterrad-100S®處理；
（e）經殺菌釜（20 min、121℃）處理；（f）
經純EtO 處理...........................................................46
圖2-3-28 UHMWPE 經gamma 射線殺菌前後之FTIR
光譜圖........................................................................48
圖2-3-29 UHMWPE 經殺菌前後之FTIR 光譜圖，縱
軸為intensity，由上往下分別為gamma、
non-sterile、HPGP 三種情況的波形.......................49
圖3-1-1 電漿真空設備組成圖................................................53
圖3-2-1 接種環於NA 斜面上的接種....................................57
圖3-2-2 細胞計數流程圖........................................................58
圖3-2-3 電漿殺菌處理實驗流程圖........................................61
圖3-3-1 圓形極板式電漿機台內視圖....................................63
圖3-3-2 圓形極板式電漿機台外視圖....................................63
圖3-3-3 長方形極板式電漿機台內視圖................................64
圖3-3-4 長方形極板式電漿機台外視圖................................64
圖4-1-1 自動界面張力分析儀................................................66
圖4-1-2 基材表面接觸角量測圖............................................66
圖4-1-3 PP 及PET 經Ar 電漿表面改質對其接觸角
影響之比較圖............................................................67
圖4-1-4 PP 及PET 經O2電漿表面改質對其接觸角影
響之比較圖................................................................67
圖4-2-1 改質PET 基材其接觸角與老化作用之關係
圖................................................................................69
圖4-4-1 PP 及PET 電漿改質前後FTIR 光譜分析圖
之比較，各圖中波型由下往上分別為：改質
前、氬氣電漿改質、氧氣電漿改質.......................72
圖4-5-1 PET 在氧氣電漿改質前後表面印刷性之比
較，各圖之改質條件如圖下方所標示...................75
圖4-5-2 PET 經30 秒氧氣電漿改質前後表面外觀之
比較，各圖之改質條件由上至下為未處理、
5 W、100 W ..............................................................76
圖4-6-1 以5 W 進行電漿殺菌時，不同處理時間的
影響............................................................................82
圖4-6-2 以50 W 進行電漿殺菌時，不同處理時間的
影響............................................................................82
圖4-6-3 以100 W 進行電漿殺菌時，不同處理時間
的影響........................................................................83
圖4-6-4 以200 W 進行電漿殺菌時，不同處理時間
的影響........................................................................83
圖4-6-5 以100 W 進行電漿殺菌時，不同處理時間
的影響........................................................................85
圖4-6-6 以300 W 進行電漿殺菌時，不同處理時間
的影響........................................................................85
圖4-7-1 大腸桿菌殺菌前後SEM 之照片.............................87
圖4-8-1 電漿殺菌前後之FTIR 光譜圖比較.........................89
圖4-8-2 電漿殺菌前後不同殺菌時間之FTIR 光譜圖
比較............................................................................89
圖4-8-3 電漿殺菌前後老化之FTIR 光譜圖比較.................90
圖4-8-4 電漿殺菌前後不同殺菌時間老化之FTIR 光
譜圖比較....................................................................90

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