臺灣博碩士論文加值系統

本文所設計之微機電邏輯閘係改善Hirata所提出之微開關結構，並將其所具有之邏輯功能由兩個擴充至五個。以矽製程微機電製程技術為基礎，藉由IntelliSuite微機電分析軟體，以有限元素法和邊界元素法探討微結構各尺寸變化與位移量之關係，以設計不同尺寸的微開關元件，相關微致動器製程由國科會中區微機電系統研究中心協助完成。MPMC提供三層複晶矽與一層金屬製程，在微開關結構中，以第一層複晶矽設計下驅動電極結構，第二層複晶矽設計上驅動電極與下接觸電極結構，金屬層則設計上接觸電極結構。在作微元件結構釋放時，由於殘餘應力與製程因素，使得上接觸電極結構產生嚴重彎曲與結構剝落現象，致使部分數據無法量測。本微邏輯閘施加適當的驅動電壓可實現---AND、OR、NAND、NOR和NOT此五種邏輯功能，藉由適當設計，此五種邏輯功能可完成微系統電源控制並滿足微系統中的控制需求，以提升微系統效能。經由實際量測，微邏輯閘的操作電壓範圍為-6~6伏特，最大功率消耗約為120毫瓦。

The MEMS logic gates, the microswitch construction improvement based on Hirata design and expanded logic function design from two to five, are proposed based on silicon-based MEMS technology. The finite element method and the boundary element method are used to analyze the relation between device’s dimension variation and displacement using IntelliSuite, a MEMS analysis software. The microswitch with different physical sizes are designed on the same chip. Microfabrication of the microactuators has been performed at the Central Regional MEMS Research Center supported by the National Science Council. The processes of MPMC project are three layers of polysilicon and one layer of metal. The first polysilicon layer is deposited as the bottom electrode. The second polysilicon layer is deposited as the top electrode and bottom contact electrode. The metal layer is deposited as the top contact electrode. In release etching process, residual stress and some process problems have been produced to bend and deform some top contact electrodes and microstructures seriously. Therefore, some mivrodevice’s performance paremeters can’t be measured. By applying right driving voltages, the microdevices can execute five kinds of logic function of AND, OR, NAND, NOR and NOT. These logic functions could increase microsystem efficiency by suitable combination for power control in the microsystem. By analyzing the measurement results, the actuation voltage of MEMS logic gates is between —6 and 6 volts, and maximum power consumption of the MEMS logic gates is about 120 micro Watts.

誌謝i
中文摘要ii
Abstractiv
目錄ivi
圖目錄vii
表目錄x
第一章 緒論1
1.1研究動機與目的1
1.2 文獻探討2
1.3 研究方法3
第二章 微機電製程技術與微邏輯閘原理5
2.1微製程技術5
2.2面型微機械製程7
2.2.1光微影製程技術8
2.2.2蝕刻技術8
2.2.3物理氣相沈積9
2.2.4化學氣相沈積10
2.2.5舉離法(Lift-off)技術11
2.3 MPMC製程與微元件製程規劃11
2.4微邏輯閘設計原理14
2.4.1靜電負載15
2.4.2吸附(Pull in)現象17
第三章 微致動器設計與模擬20
3.1微致動器邏輯功能與結構設計20
3.1.1微致動器邏輯功能之延伸24
3.2微致動器模擬25
3.2.1二分之一微模型結構模擬評估27
3.2.2微結構尺寸探討29
3.2.2.1 微結構之單一尺寸變化探討29
3.2.2.2 微結構之雙尺寸變化探討39
3.3MPMC結構模擬44
3.4靜電式雙金屬微開關之設計與應用57
3.4.1雙金屬靜電式微開關之熱應力設計原理58
3.4.2雙金屬微開關之應用61
3.4.3雙金屬靜電式微開關之製程規劃63
第四章 微致動器量測分析66
4.1犧牲層蝕刻製程分析66
4.2微致動器之量測71
第五章 結論與未來發展88
5.1結論88
5.2未來發展88
參考文獻90
附錄一93

[1] http://www.intel.com/tw/big5
[2] A. Hirata, K. Machida, H. Kyuragi and M. Maeda, “A Electrostatic Micromechanical Switch for Logic Operation in Multichip Modules on Si,” Sensors and Actuators, vol.80, pp.119-125, 2000.
[3] K. E. Petersen, “Micromechanical Membrane Switches on Silicon,” IBM J. Res. Develop, vol.23, pp.376-385, 1979.
[4] K. E. Petersen, “Dynamic Micromechanics on Silicon : Techniques and Devices,” IEEE Trans. Electron Devices, ED-25, pp.1241-1250, 1978.
[5] K. E. Petersen, “Silicon as A Mechanical Material,” Proceeding of the IEEE, vol.70, pp.442-444, 1982.
[6] M. Sakata, “An Electrostatic Microactuator for Electro-mechanical Relay,” Micro Electro Mechanical Systems, Proceedings, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots, pp.149-151, 1989.
[7] S. Zhou and Xi-Qing Sun, “A Micro Variable Inductor Chip Using MEMS Relays,” Proc. Transducer ’97, Chicago, USA, vol.2, pp.1137 —1140, 1997.
[8] A. Hirata, K. Machida, H. Kyuragi and M. Maeda, “A Micromechanical Switch as The Logic Elements for Circuits in Multi Chip Module on Si (MCM-Si),” MEMS ''99, 12th IEEE International Conference, pp.582 —587, 1999.
[9] 周逸曼, “微結構靜電負載之探討,” 清華大學動力機械研究所, 碩士論文, 1997.
[10] 劉鎮煌, “微扭轉致動器之靜電驅動分析,” 清華大學動力機械研究所, 碩士論文, 1998.
[11] 謝哲偉, “靜電驅動微扭轉致動器之研究,” 清華大學動力機械研究所, 碩士論文, 1998.
[12] 蘇宣霖, “微接觸器系統之分析設計,” 成功大學機械工程研究所, 碩士論文, 1999.
[13] 編輯部, “二十一世紀的顯學─微機電系統（五）,” 機械技術雜誌, 第190期, 2000.
[14] 翁士元, “薄膜蝕刻技術,” 電子月刊, 第2卷, 第7期, 1996.
[15] 黃瑞星,黃義佑,陳建亨, “微機電共用晶片設計與製作規範,” 國科會中區微機電系統研究中心, Rev.2, 2002.
[16] Massood Tabib-Azar, Microactuators /Electrical, Magnetic, Thermal, Optical, Mechanical, Chemical & Smart Structures, Kluwer Academic Publishers, 1998.
[17] Tai-Ran Hsu, MEMS & Microsystems, McGraw-Hill, 2002.
[18] Stephen D. Senturia., Microsystem Design, Kluwer Academic Publishers, 2001.
[19] I. Schiele, J. Huber, C. Evers, B. Hillerich and F. Kozolowski, “Micromechanical Relay with Electrostatic Actuation,” Proc. Transducers ’97, Chicago, USA, pp.1165—1168, 1997.
[20] J. Drake, H. Jerman, B. Lutze and M. Studer, “An Electrostatically Actuated Micro-relay,” Proc. Transducers ’95, Stockholm, Sweden, pp. 380—383, 1995.
[21] 林永俊, ”複合式微型感測體之設計,” 碩士論文, 逢甲大學自動控制工程系, 1999.
[22] A. Boley and J. H. Weiner, Theory of Thermal Stress, John Wiley & Sons, New York, 1960.
[23] W. H. Chu, M. Mehregany and R. L. Mullen, “Analysis of Tip Deflection and Force of A Bimetallic Cantilever Microactuator,” J. Micromech. Microeng., vol.3, pp.4-7, 1993.
[24] 林君明, 蘇茂舜, 黃榮祥, “Shear Stress Analysis of MEMS Device with Wet Etching Release Process,” 國科會中區微機電中心共用晶片研討會暨2002年奈米暨微系統研討會, pp.51-56, 2002.
[25] Gregory T. A. Kovacs, Micromachined Transducers Sourcebook, WCB, 1998.