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研究生:許瑞峰
研究生(外文):R-F Hsu
論文名稱:微小材料機械特性測試系統之設計製作與其在電子封裝與高分子材料上之應用
論文名稱(外文):Design and Fabrication of a Small Scale Material TestingSystem and Its Application on the Characterization of Electronics Packaging and Polymer Materials
指導教授:陳國聲
指導教授(外文):Kuo-Shen Chen
學位類別:碩士
校院名稱:國立成功大學
系所名稱:機械工程學系碩博士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2003
畢業學年度:91
語文別:中文
論文頁數:200
中文關鍵詞:材料測試熱循環潛變高分子材料電子封裝材料
外文關鍵詞:PMMAMaterial TestingThermal CyclingElectronic PackagingCreep
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對於一個設計者而言,選擇合適的材料往往都是產品成功的先決條件,材料的適用性往往根據測試結果得知。隨著高科技的發達,許多的材料都必須應用於小尺寸的結構下,如電子封裝中的鍚球、生物晶片等結構,若要對這些材料做測試,傳統的測試機構都太過於龐大,商業上的小尺寸測試機構又太過昂貴且彈性不高,而以微機電系統所發展出之微材料測試之尺度又太過微小。有鑑於此,本文的目標在於發展一微小尺寸多功能材料測試系統,能針對小尺寸材料特性與產品之實際運用作完善的測試,加速測試過程以獲得值得信賴的測試結果,並應用於高分子材料及BGA電子封裝中之接線材料(銲錫)的測試。本文在材料測試系統之設計製作部分,首先針對本文之系統作概念性設計,接下來各別針對材料測試機構與熱循環室之次系統作設計,如溫度控制系統、機構設計,夾具設計等次系統之設計。系統整合完成後接下來作系統之校準與驗証,經實驗結果的驗証,証明本系統應用於金屬材料或高分子材料之實驗結果可達與MTS的微拉力機構同等級之準確度。在材料測試實驗,我們分別對PMMA與銲錫材料作測試,經機械性質測試實驗結果,可探討溫度與濕度對PMMA材料性質的影響及建立PMMA的潛變模型,與錫球的熱疲勞破壞、溫度對錫球材料性質改變等關係,可提供給設計者作為研究設計時的依據。
本文期望在未來能以現有之系統對其他重要材料進行測試,另外針對試片與夾具作設計以增加其他測試方式,如彎曲、扭轉等測試,並且加入濕度控制系統,可與原有的溫控系統同時進測試環境的濕度與溫度控制,最後期望與其他系統如壓電式適應控制材料測試系統,作搭配做更進一步的應用。
To a designer, choosing appropriate materials is a prerequisite factor for success since the testing result always determine the suitability of the material. With the advancement of modern technology, mechanical properties of materials apply to small scale structure, such as solder joints in electronic packaging or fluid channels in biochip construction become important to be explored. However, the conventional testing apparatus is too huge to perform appropriate testing and the commercial testing apparatus in small scale is too expensive and lacks flexibility.
For the reason above, the objective of this thesis is to develop a multi-functional testing system for materials characterization in small scale , to reduce the cost of the testing equipment , to enhance the flexibility of the testing facility , and to accelerate the testing process while maintains the reliability of the testing results. We also apply this system to test polymer materials and solder joints used in electronic packaging. In design and fabrication of this system, we begin with a conceptual design, followed by a series of detail design sub-system for machinery and thermal cycle chamber respectively. After integrating these sub-systems, we calibrate them and used the experiment data of copper film and PMMA obtained via MTS Tytron to verify this system. The results show that the system is able to achieve the same accuracy level as that obtained by the MTS Tytron. In material testing experiment, we test the PMMA and solder joints. From the test results, we can understand the influence of temperature and humidity on the material properties, the relationship between temperature factor, and the thermal fatigue for solder and develop the creep model for PMMA. These results can provide designer necessary information for design.
In the future, we plan to test other important materials using this system. In addition, with changing the design for specimens and fixtures, this system should have more testing options such as bending and twisting. Finally after integrating humidity control system with the original temperature control unit, the testing environment should be better simulated. In parallel, we also like to incorporate this system with other system such as PZT system for more sophisticated applications.
中文摘要I
英文摘要II
致謝III
目錄IV
表目錄VIII
圖目錄IX
符號說明XV
第一章 緒論1
1.1 材料測試1
1.2研究目標2
1.3 本文架構3
第二章 背景介紹5
2.1 前言5
2.2標準測試方式5
2.3 微小材料測試系統之簡介12
2.4 高分子材料之背景介紹20
2.5電子封裝(鍚球)材料之背景介紹22
2.6 結綸25
第三章 測試系統設計26
3.1前言26
3.2 概念性設計26
3.3 微小尺寸材料測試機構之功能設計30
3.3.1 微小尺寸材料測試之機構設計31
3.3.2 夾具之設計32
3.3.3 隔熱室剛度模擬32
3.4 熱循環室之功能設計39
3.5溫控系統43
3.5.1 建立隔熱室之轉移函數43
3.5.2 熱電偶溫度感測器46
3.5.3 PI控制器47
3.6致動器與感測器55
3.7 資料擷取卡的使用與介紹57
3.8 系統整合與總結58
3.8.1 微小尺寸材料測試系統之整合59
3.8.2 熱循環測試系統之整合59
3.9 結論61
第四章 測試系統之校準與驗証62
4.1 前言62
4.2 感測器之校準62
4.3測試系統之剛度測試67
4.4 隔熱室之溫度分佈測試71
4.5 測試系統之實驗驗証72
4.6 結論82
第五章 高分子材料機械性質測試實驗83
5.1前言83
5.2 PMMA拉伸測試83
5.3 PMMA 拉伸測試之實驗結果討論98
5.4 PMMA潛變測試103
5.5 PMMA潛變測試之實驗結果討論114
5.6 結綸121
第六章 電子封裝材料機械性質測試實驗123
6.1 前言123
6.2 焊鍚的拉伸測試123
6.3 焊點的拉伸與剪切測試130
6.4 銲接點的熱循環測試137
6.5 結綸143
第七章 結論與未來展望145
7.1 全文歸鈉145
7.2 結論146
7.3 本文貢獻148
7.4 未來工作與展望149
參考文獻150
附錄一 實驗設備設計圖155
附錄1.1 溫控室設計圖155
附錄1.2 熱循環室設計圖160
附錄1.3 夾具設計圖162
附錄1.4 試片設計圖170
附錄二 電壓轉電流放大電路172
附錄三 材料測試程式173
附錄四 熱循環測試程式195
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